H01L2924/302 - CPC Classification Index

ClassID:

212828 ⎘

H01L2924/302 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical effects; Electrical effects Electrostatic

Sub-classes:

H01L2924/30201 » Charge 3
H01L2924/30205 » Discharge 50

Recent Application in this class:

20190326193

2019-10-24

Semiconductor device and method for manufacturing the same

20180350711

2018-12-06

INVERSION-TYPE PACKAGE STRUCTURE FOR FLIP CHIP AND FLIP CHIP HAVING THE SAME

20180294202

2018-10-11

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

20160322315

2016-11-03

Moisture-resistant electronic component, notably microwave, and method for packaging such a component

20150215502

2015-07-30

Antistatic device and electronic device with the same