H01L2924/36 - CPC Classification Index

ClassID:

212837 ⎘

H01L2924/36 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical effects Material effects

Sub-classes:

H01L2924/364 » Polymers 18
H01L2924/365 » Metallurgical effects 40

Recent Application in this class:

20260011665

2026-01-08

BUILD UP BONDING LAYER PROCESS AND STRUCTURE FOR LOW TEMPERATURE COPPER BONDING

20230420408

2023-12-28

SELF-ALIGNING BONDING BY HYDROPHILIC CONTRAST

20180182710

2018-06-28

Semiconductor arrangement with a sealing structure

20180076228

2018-03-15

Array substrate and methods of manufacturing same, and display panel and display apparatus including the array substrate

20160336284

2016-11-17

Moisture barrier for semiconductor structures with stress relief

20150187715

2015-07-02

SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATON AND METHOD OF FORMING SAME

20150054019

2015-02-26

Semiconductor device having electrode interconnections within a conductive adhesive

20110226841

2011-09-22

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

20110210443

2011-09-01

SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATION AND METHOD OF FORMING SAME