H01L2924/37002 - CPC Classification Index

ClassID:

212846 ⎘

H01L2924/37002 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical effects; Effects of the manufacturing process Shelf life

Recent Application in this class:

20230105851

2023-04-06

COPPER BONDING WIRE

20220260504

2022-08-18

Method for predicting reliability of semiconductor device

20160300796

2016-10-13

Reliable microstrip routing for electronics components

20160172278

2016-06-16

Assembly of an integrated circuit chip and of a plate

20150262959

2015-09-17

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

20150228583

2015-08-13

Reliable microstrip routing for electronics components

20130062742

2013-03-14

Spot plated leadframe and IC bond pad via array design for copper wire