Patents-Review.com
ClassID:

212847 ⎘

H01L2924/3701 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical effects; Effects of the manufacturing process increased through put

Recent Application in this class:
#1
20250279392
2025-09-04

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

 #2
20250192098
2025-06-12

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME, AND POWER CONVERSION APPARATUS

 #3
20240194635
2024-06-13

Integrated process sequence for hybrid bonding applications

 #4
20240128209
2024-04-18

Efficient Integration of a First Substrate without Solder Bumps with a Second Substrate Having Solder Bumps

 #5
20240105565
2024-03-28

SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE

 #6
20220392868
2022-12-08

Apparatus and method for manufacturing semiconductor package structure

 #7
20220223505
2022-07-14

Semiconductor device and measurement device

 #8
20200235046
2020-07-23

Semiconductor device having an oscillator and an associated integrated circuit

 #9
20190348389
2019-11-14

Apparatus with multi-wafer based device comprising embedded active and/or passive devices and method for forming such

 #10
20190198477
2019-06-27

Method of manufacturing a semiconductor device

 #11
20190139929
2019-05-09

Detection of foreign particles during wire bonding

 #12
20180047677
2018-02-15

Method of manufacturing a semiconductor device

 #13
20170309586
2017-10-26

Thermocompression for semiconductor chip assembly

 #14
20160351512
2016-12-01

Semiconductor device

 #15
20160155690
2016-06-02

Semiconductor device and measurement device

 #16
20160093585
2016-03-31

Thermocompression for semiconductor chip assembly

 #17
20160079198
2016-03-17

Wire bonding device and method of eliminating defective bonding wire

 #18
20160043065
2016-02-11

Semiconductor multi-project or multi-product wafer process

 #19
20150380381
2015-12-31

Flip chip bonder and flip chip bonding method

 #20
20150235987
2015-08-20

Method of manufacturing semiconductor device

 #21
20150123271
2015-05-07

Thermocompression for semiconductor chip assembly

 #22
20150115478
2015-04-30

Semiconductor module

 #23
20150076673
2015-03-19

Semiconductor device and measurement device having an oscillator

 #24
20150076570
2015-03-19

Semiconductor module and method for manufacturing the same

 #25
20150035169
2015-02-05

VIA STRUCTURE FOR THREE-DIMENSIONAL CIRCUIT INTEGRATION

 #26
20140332969
2014-11-13

Chip package and method for forming the same

 #27
20140328523
2014-11-06

Chip package and method for forming the same

 #28
20130307160
2013-11-21

Via structure for three-dimensional circuit integration

 #29
20130020691
2013-01-24

Method of manufacturing a semiconductor device

 #30
20120088329
2012-04-12

Semiconductor multi-project or multi-product wafer process

 #31
20110278724
2011-11-17

Chip package and method for forming the same

 #32
20110204502
2011-08-25

Method of manufacturing a semiconductor device

 #33
20100068852
2010-03-18

Method of manufacturing a semiconductor device

 #34
20100065951
2010-03-18

Method of manufacturing a semiconductor device

 #35
20090075427
2009-03-19

Method of manufacturing a semiconductor device

 #36
20080006916
2008-01-10

Method of Manufacturing a Semiconductor Device

 #37
20050116327
2005-06-02

Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body

 #38
14609896
2016-05-24

Contact arrangements for stackable microelectronic package structures with multiple ranks