H01L2924/403 - CPC Classification Index

ClassID:

212873 ⎘

H01L2924/403 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body; LASER; Type being an Excimer

Sub-classes:

H01L2924/40301 » ArF LASER 0
H01L2924/40302 » F2 LASER 0
H01L2924/40303 » KrCl LASER 0
H01L2924/40304 » KrF LASER 0
H01L2924/40305 » XeCl LASER 0
H01L2924/40306 » XeF LASER 0

Recent Application in this class:

20200176344

Printed circuit board and semiconductor package

20180366380

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS

20170309559

Printed circuit board and semiconductor package

20170148692

Semiconductor package including a semiconductor die having redistributed pads

20150072515

LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNING AND REMOVAL

20070108585

Semiconductor package including a semiconductor die having redistributed pads