LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME

Method of making a substrate structure having a flexible layer

Two piece aluminum heat sink

Light emitting device and manufacturing method for the same

LED chip packaging structure, its manufacturing method, and display device

Semiconductor light emitting device and method for manufacturing same

High heat-radiant optical device substrate and manufacturing method thereof

Methods and apparatus providing thermal isolation of photonic devices

Method for manufacturing light emitting diode chip

Package for mounting a light emitting element including a flat plate-shaped electrode and method for manufacture

LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing semiconductor element

LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Light emitting diodes with enhanced thermal sinking and associated methods of operation

Methods of fabricating semiconductor structures using thermal spray processes, and semiconductor structures fabricated using such methods

LED package and method of making the same

HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE

HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE

Overlay circuit structure for interconnecting light emitting semiconductors

Stress regulated semiconductor devices and associated methods

Reduction of etch microloading for through silicon vias

Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof

Optical device and method for manufacturing same

Method for forming package substrate

Light emitting diode carrier

Stress regulated semiconductor devices and associated methods

Method of manufacturing a package carrier

LED ARRAY MODULE AND FABRICATION METHOD THEREOF

Thin-film LED with p and n contacts electrically isolated from the substrate

LIGHT-EMITTING DIODE DEVICE

HEAT CONDUCTIVE COMPOSITE SUBSTRATE HAVING HEAT DISSIPATION PROPERTIES AND MANUFACTURING METHOD THEREOF

Semiconductor package structure and manufacturing method thereof

Package Substrate and Method for Forming the Same

High power plastic leaded chip carrier with integrated metal reflector cup and direct heat sink

Packaging photon building blocks having only top side connections in a molded interconnect structure

Die structure, manufacturing method and substrate thereof

Method for manufacturing heat dissipation bulk of semiconductor device

LIGHT EMITTING CHIP AND METHOD FOR MANUFACTURING THE SAME

Light emitting chip and method for manufacturing the same

Heat sinking element and method of treating a heat sinking element

Light emitting diode components integrated with thermoelectric devices

Wafer-level light emitting diode package and method of fabricating the same

THERMALLY EFFICIENT PACKAGING FOR A PHOTONIC DEVICE

MANUFACTURING METHOD FOR POWER LED HEAD-DISSIPATING SUBSTRATE AND POWER LED PRODUCT AND THE PRODUCTS THEREOF

LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

Thermal management system for multiple heat source devices

Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate

Method and numerical tool for optimizing light emitting diode systems

SEMICONDUCTOR DEVICE

LIGHT EMITTING DIODE, FRAME SHAPING METHOD THEREOF AND IMPROVED FRAME STRUCTURE

Reduction of etch microloading for through silicon vias

Light emitting apparatus, and method for manufacturing the same, and lighting system

Photoelectrical element having a thermal-electrical structure

Light emitting diode and method for manufacturing the same

LED package structure with concave area for positioning heat-conducting substance

Light emitting diodes with enhanced thermal sinking and associated methods of operation

Light emitting diode and method of making the same

Solid state light sheet or strip having cavities formed in top substrate

Solid state light sheet having wide support substrate and narrow strips enclosing LED dies in series

Solid state light strips containing LED dies in series

Solid state light sheet or strip having cavities formed in bottom substrate

Solid state light sheet for general illumination

Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination

Solid state light sheet for general illumination having metal interconnector through layer for connecting dies in series

Solid state light sheet for general illumination having substrates for creating series connection of dies

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS

Semiconductor light-emitting device with a protection layer

Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts

Method of forming vertical structure light emitting diode with heat exhaustion structure

Semiconductor light emitting device

Light-emitting diode chip and method of manufacturing the same

Resin molding device

PRE-THERMAL GREASED LED ARRAY

LED package structure with concave area for positioning heat-conducting substance and method for manufacturing the same

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/FLANGE HEAT SPREADER AND A CAVITY IN THE FLANGE

Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange

Thin-film LED with P and N contacts electrically isolated from the substrate

THIN-FILM LED WITH P AND N CONTACTS ELECTRICALL ISOLATED FROM THE SUBSTRATE

Thin-film LED with P and N contacts electrically isolated from the substrate

Metallic laminate and manufacturing method of light emitting diode package using the same

Light emitting apparatus

Light emitting apparatus, and method for manufacturing the same, and lighting system

Methods for optimal operation of light emitting diodes

Mounting structure of component of lighting device and method thereof

OPTOELECTRONIC DEVICE STRUCTURE

PROCESS AND PASTE FOR CONTACTING METAL SURFACES

Light emitting diode and method of making the same

Method for packaging a light emitting device including a metal reflection layer and a metal heat dissipation layer

Optical device manufacturing method

Semiconductor light-emitting device, illuminator and method of manufacturing semiconductor light-emitting device

Process and Paste for Contacting Metal Surfaces

LED chip thermal management and fabrication methods

Thermal module

Efficient cooling of lasers, LEDs and photonics devices

Light emitting apparatus, resin molding device composing light emitting device, method for producing the same

Method for Fixing a Light-Emitting Diode to a Metallic Heat-Radiating Element

Luminescent ceramic for a light emitting device

Method for Manufacturing Semiconductor Device

Semiconductor light-emitting device with improved heatsinking

Device for cooling an electrical component and production method thereof

Light-emitting device and process for manufacturing the same

Method for manufacturing vertical structure light emitting diode

Fabrication method of light emitting diode package

Light emitting device and method for fabricating the same

Method for manufacturing a GaN based LED of a black hole structure

Light emitting diode and method of making the same

Luminescent ceramic for a light emitting device

LED packaging structure

LED circuit structure

Method and apparatus to facilitate direct surface cooling of a chip within a 3D stack of chips using optical interconnect

LED package structure