214037 ⎘
Waveguides; Transmission lines of the waveguide type with two longitudinal conductors; Microstrips; Strip lines; Microstriplines Multilayer dielectric
ELECTRONIC DEVICE
#2Transmission Line Structures for Three-Dimensional Integrated Circuit and the Methods Thereof
#3TRANSMISSION LINE SUBSTRATE
#4Low-loss transmission line structure comprising a dielectric layer stacked with conductive layers having signal strips and ground strips and including air grooves close to the signal strips
#5LOSSY MATCHING NETWORK AND WIDEBAND STABILIZER
#6FILTER DEVICE
#7Transmission line device compriing first and second conductive lines on one level separated from a third conductive line on another level by an intervening ground layer
#8Printed circuit boards and methods for manufacturing thereof for RF connectivity between electro-optic phase modulator and digital signal processor
#9CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
#10MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR
#11Semiconductor device and methods, where first and second transmission lines are surrounded by first and second high-k dielectric materials
#12MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
#13TRANSMISSION LINE AND ELECTRONIC DEVICE
#14FILTER DEVICE
#15ELECTRONIC DEVICE
#16Substrate integrated waveguide transition including an impedance transformer having an open portion with long sides thereof parallel to a centerline
#17Transmission line structures for three-dimensional integrated circuit and the methods thereof
#18Multi-layer signal transmission line including a void of specified dimensions and method for manufacture
#19Microstrip line structures having multiple wiring layers and including plural wiring structures extending from one wiring layer to a shield on a different wiring layer
#20Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line
#21Substrate integrated waveguide transition including a metallic layer portion having an open portion that is aligned offset from a centerline
#22Signal transmission line comprising stacked insulating layers having a signal line and a ground conductor respectively spaced apart by a spacer with a hollow portion
#23Wireless module
#24Printed circuit boards and methods for manufacturing thereof for RF connectivity between electro-optic phase modulator and digital signal processor
#25Electromagnetic band gap structure and package structure
#26Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission lines
#27Signal transmission line including a flexible resin laminate having interior hollow portions overlapping the signal transmission line with the hollow portions having a vent hole
#28Rapid over-the-air production line test platform
#29Substrate integrated waveguide device including a resonance region therein coupled by conductor posts to first and second lines and a transistor coupled between the first and second lines
#30Structure for mounting a transmission line substrate having interlayer connection conductors to another substrate by a conductive bonding material
#31Transmission line member including first and third transmission line portions connected by a second coplanar waveguide portion of reduced thickness and greater width
#32Multilayer balun
#33Antennas-in-package verification board
#34Transition structure for coupling first and second transmission lines through a multi-layer structure and including a cavity corresponding to the second transmission line
#35Power amplifier with shielded transmission lines
#36Transmission line cable including an unbendable superimposed layer part and a bendable non-superimposed layer part
#37Flexible cable including a transmission line having an air gap configured to prevent signals from propagating to the air gap
#38Printed circuit boards and methods for manufacturing thereof for RF connectivity between electro-optic phase modulator and Digital Signal Processor
#39High directivity compact size inter layer coupler
#40Transmission line device comprising a plurality of substrates each having signal and ground conductor patterns thereon that are joined to each other
#41Interlayer region having a signal via for coupling between planar signal lines, where a multi-mode signal propagates through the interlayer region
#42Signal transmission line including a flexible resin laminate having interior hollow portions overlapping the signal transmission line
#43Low loss and low cross talk transmission lines having l-shaped cross sections
#44Transmission line device comprising a plurality of substrates each having signal and ground conductor patterns thereon that are joined to each other
#45Flexible flat cable comprising conductor layers disposed on opposite sides of a metal isolation layer
#46Semiconductor device having a high-k dielectric material disposed beyween first and second transmission lines and a dielectric directly contacting the high-k dielectric material
#47Composite substrate for a waveguide and method of manufacturing a composite substrate
#48Transmission line
#49High frequency film transmission line, antenna including the same and antenna-integrated image display device
#50Printed circuit boards and methods for manufacturing thereof for RF connectivity between electro-optic phase modulator and digital signal processor
#51RF crossover apparatus for microwave systems comprising a body having at least two intersecting RF strips disposed thereon and insulated from an external environment
#52Device having at least one subset of stripline sections on opposite sides of an electrically conductive structure and configured to have positive coupling
#53Low loss architecture for superconducting qubit circuits
#54Transmission line, flat cable, and electronic device
#55Low loss architecture for superconducting qubit circuits
#56Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion
#57Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line
#58Flexible circuit board
#59Method of manufacturing printed circuit board
#60Multilayer transmission line plate
#61Compact band pass filter
#62Multilayer substrate including plural ground plane layers, where there are fewer ground plane layers in input and output regions than in an intermediate region and a radar device formed therefrom
#63High-frequency signal transmission line and electronic device
#64Signal transmission line including a signal conductor and reinforcing conductor portions parallel to the signal conductor
#65Method of additively manufacturing an impedance transformer
#66Stranded transmission line and uses thereof
#67Feeder circuit
#68Multilayer substrate comprising a flexible element assembly and conductor layers
#69Microstrip line structure and method for fabricating the same
#70Board-to-board interconnect apparatus including a microstrip circuit connected by a waveguide, where a bandwidth of a frequency band is adjustable
#71Semiconductor device having first and second transmission lines with a high-K dielectric material disposed between the first and second transmission lines
#72High-frequency transmission line and electronic device
#73COAXIAL TRANSMISSION LINE INCLUDING ELECTRICALLY THIN RESISTIVE LAYER AND ASSOCIATED METHODS
#74High-frequency signal line
#75Stripline energy transmission in a wellbore
#76Electronic device
#77Transmission line cable
#78Transmission line and flat cable
#79Multi-wire wiring board
#80Pocketed circuit board
#81High-frequency signal line and manufacturing method thereof
#82Transmission line
#83Multilayer microwave filter
#84Coaxial transmission line including electrically thin resistive layer and associated methods
#85High-frequency transmission line and electronic device
#86Transmission line for 3D integrated circuit
#87High-frequency signal transmission line and electronic apparatus including the same
#88Transmission line design and method, where high-k dielectric surrounds the transmission line for increased isolation
#89Ground structures between resonators for distributed electromagnetic wave filters
#90Resonance device and filter including the same
#91Flexible board and electronic device
#92High-frequency signal line and electronic device provided with the same
#93Filter
#94On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
#95Vertical trench routing in a substrate
#96Package substrate
#97High-frequency signal transmission line and electronic device
#98Multi-layer printed circuit boards having properties suitable for layer reduction design
#99Insulated coated wire having a wire coating layer of a resin surrounded by a wire adhesive layer of a resin
#100Electronic circuit
#101Common mode filter
#102Printed wiring board, electronic device, and wiring connection method
#103WIDEBAND TRANSITION BETWEEN A PLANAR TRANSMISSION LINE AND A WAVEGUIDE
#104Multi-layer resin substrate having grounding conductors configured to form triplate line sections and microstrip sections
#105Compact impedance transformer
#106Passive microelectronic components, capable of allowing a radio-frequency or hyper-frequency signal to travel in a single direction
#107Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages
#108Transmission line for 3D integrated circuit
#109Surface plasmon polariton device including discontinuous waveguide separated by gap, and apparatus and method for generating surface plasmon polariton signal using same
#110High-frequency signal line
#111High-frequency transmission line and electronic device
#112High-frequency signal line
#113Slow wave RF propagation line including a network of nanowires
#114High-frequency signal line and manufacturing method thereof
#115High-frequency signal line and electronic device including the same
#116On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
#117Coplanar waveguide
#118High frequency filter
#119Multi-tunable superconducting circuits
#120High-frequency signal line
#121Multi-tunable superconducting circuits
#122High-frequency signal line and electronic device
#123High frequency signal line and electronic device
#124High-frequency signal line and electronic device
#125High-frequency signal transmission line and electronic device
#126Transmission line and methods for fabricating thereof
#127Multi-layer integrated transmission line circuits having a metal routing layer that reduces dielectric losses
#128Signal transmission line and circuit board
#129High-frequency signal transmission line and electronic apparatus including the same
#130Waveguide
#131Conformal reference planes in substrates
#132Microwave-sending device
#133Microwave emitter and level measuring device
#134Parallel synchronous bus with non-uniform spaced conductive traces for providing equalized crosstalk
#135Double microstrip transmission line having common defected ground structure and wireless circuit apparatus using the same
#136Transmission line for electronic circuits
#137Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages
#138Signal transmission line and circuit board
#139STRIPLINE
#140Compact on-chip branchline coupler using slow wave transmission line
#141FILTER, COMMUNICATION MODULE, AND COMMUNICATION APPARATUS
#142Complementary-conducting-strip transmission line structure with plural stacked mesh ground planes
#143Conformal reference planes in substrates
#144Microstrip lines with tunable characteristic impedance and wavelength
#145Coplanar waveguide
#146Substrate, communication module, and communication apparatus
#147Electric apparatus
#148Stripline transmission lines with cross-hatched pattern return plane, where the striplines do not overlap any intersections in the cross-hatched pattern
#149Multilayer integrated circuit packages with localized air structures