220411 ⎘
Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
Sub-classes:ACOUSTIC WAVE DEVICE INCLUDING RESONATORS FORMED ON PIEZOELECTRIC SUBSTRATE OF DIFFERENT HEIGHTS AND METHOD FOR MANUFACTURING THE SAME
#2MULTILAYER PIEZOELECTRIC SUBSTRATE NONLINEARITY IMPROVEMENT WITHIN THE STACK OF LAYERS
#3ROBUST CONNECTION METAL STRUCTURES FOR SAW DEVICE APPLICATION
#4ACOUSTIC FILTER, PRODUCTION METHOD THEREFOR, AND ELECTRONIC DEVICE
#5ACOUSTIC WAVE DEVICE AND FABRICATION METHOD THEREOF
#6MULTI-LAYER PIEZOELECTRIC SUBSTRATE
#7SAW DEVICE HAVING MULTIPLE FILTER BANDS AND METHOD FOR MANUFACTURING THE SAME
#8BONDED SUBSTRATE AND METHOD FOR MANUFACTURING BONDED SUBSTRATE
#9Double-Mode Surface-Acoustic-Wave (DMS) Filter with Apodization
#10MULTILAYER PIEZOELECTRIC SUBSTRATE DEVICE WITH REDUCED NONLINEAR RESPONSE AND ROUNDED INTERDIGITAL TRANSDUCER ELECTRODES
#11MULTI-MODE SAW FILTERS WITH MULTI-TRACK, UNIFIED INSULATING ELEMENTS AND RELATED METHODS OF MANUFACTURE
#12Surface Acoustic Wave Device for Reducing Noise
#13PIEZOELECTRIC DEVICE WITH CONDUCTIVE PROTECTIVE LAYER INTERCONNECTS
#14PACKAGED MULTI-LAYER PIEZOELECTRIC SUBSTRATE ACOUSTIC WAVE DEVICE WITH INSULATOR FOR REDUCED DC LEAKAGE
#15METHOD FOR MANUFACTURING BONDED BODY
#16SURFACE ACOUSTIC WAVE DEVICE WITH VARYING PIEZOELECTRIC LAYER THICKNESS
#17ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
#18COMPOSITE SUBSTRATE AND PREPARATION METHOD THEREOF, ELECTRONIC DEVICE AND MODULE
#19STEEP REJECTION AND SMALL SIZED MULTILAYER PIEZOELECTRIC SUBSTRATE DEVICE WITH PARTLY BURIED SURFACE ACOUSTIC WAVE DEVICE ELECTRODES
#20SURFACE ACOUSTIC WAVE (SAW) DEVICE WITH BARRIER LAYERS BETWEEN ALUMINUM-COPPER LAYERS
#21SURFACE ACOUSTIC WAVE (SAW) DEVICES INCLUDING A SUPERLATTICE AND RELATED METHODS
#22METHODS FOR MAKING SURFACE ACOUSTIC WAVE (SAW) DEVICES INCLUDING A SUPERLATTICE
#23STRUCTURE WITH PHOTODIODE, HIGH ELECTRON MOBILITY TRANSISTOR, SURFACE ACOUSTIC WAVE DEVICE AND FABRICATING METHOD OF THE SAME
#24SURFACE ACOUSTIC WAVE DEVICE HAVING AN ELECTRODE STRUCTURE WITH IMPROVED NONLINEARITY, FILTER INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SURFACE ACOUSTIC WAVE DEVICE
#25SURFACE ACOUSTIC WAVE DEVICE INCORPORATING A THIN LAYER OF METAL MATERIAL
#26METHOD FOR PREPARING A THIN LAYER OF FERROELECTRIC MATERIAL
#27PIEZOELECTRIC BOUNDARY ACOUSTIC WAVE DEVICE WITH A LAYERED SUBSTRATE
#28MULTILAYER PIEZOELECTRIC SUBSTRATE SURFACE ACOUSTIC WAVE DEVICE WITH TRANSVERSE MODE SUPPRESSION
#29SURFACE ACOUSTIC WAVE DEVICE WITH TRANSVERSE MODE SUPPRESSION
#30SURFACE ACOUSTIC WAVE DEVICE WITH INTERDIGITAL TRANSDUCER ELECTRODE FINGERS HAVING MULTIPLE LINER DENSITIES IN BORDER REGION
#31SHEAR HORIZONTAL MODE SPUR SUPPRESSION FOR TEMPERATURE COMPENSATED SURFACE ACOUSTIC WAVE DEVICES
#32PISTON MODE FOR SURFACE ACOUSTIC WAVE DEVICE
#33ISOLATION USING MICRO/NANOSCALE PIEZOELECTRIC ACOUSTIC RESONATOR STRUCTURES
#34SURFACE ACOUSTIC WAVE (SAW) DEVICE WITH HIGH-DIELECTRIC-CONSTANT MATERIAL
#35ACOUSTIC WAVE DEVICE, METHOD OF MANUFACTURING THE SAME, AND MODULE
#36ISOLATION USING MICRO/NANOSCALE PIEZOELECTRIC ACOUSTIC RESONATOR STRUCTURES
#37PHASE CANCELLING CIRCUIT IN MULTI-LAYER PIEZOELECTRIC SUBSTRATE SURFACE ACOUSTIC WAVE DEVICE WITH INTERFERENCE SUPPRESSION STRUCTURE
#38MULTI-LAYER PIEZOELECTRIC SUBSTRATE SURFACE ACOUSTIC WAVE DEVICE WITH PHASE CANCELLING CIRCUIT
#39VERTICALLY COUPLED SAW RESONATORS
#40MULTI-LAYER PIEZOELECTRIC SUBSTRATE SURFACE ACOUSTIC WAVE DEVICE WITH LOOP CIRCUIT
#41MULTILAYER PIEZOELECTRIC SUBSTRATE SURFACE ACOUSTIC WAVE DEVICE WITH POLYMER-BASED PACKAGING STRUCTURE
#42METHOD OF FORMING AN ELECTRICAL CONNECTION COUPLED TO A RESONATOR
#43PACKAGING OF SURFACE ACOUSTIC WAVE DEVICE HAVING MULTILAYER PIEZOELECTRIC SUBSTRATE
#44SURFACE ACOUSTIC WAVE DEVICE AND METHOD FOR FABRICATING THE SAME
#45HIGH Q ELECTROACOUSTIC RESONATOR
#46OPTIMIZATION OF SUPPRESSION OF TRANSVERSE MODE SPURIOUS SIGNALS IN SURFACE ACOUSTIC WAVE FILTERS WHILE MAINTAINING FILTER INSERTION LOSS
#47TEMPERATURE COMPENSATED SURFACE ACOUSTIC WAVE DEVICE AND METHODS OF MANUFACTURING THE SAME
#48Surface Acoustic Wave Filter Module Packaging Structure And Packaging Method Thereof
#49Surface Acoustic Wave Filter Module Packaging Structure And Packaging Method Thereof
#50DUAL-MODE SURFACE ACOUSTIC WAVE DEVICE AND PREPARATION METHOD THEREOF
#51SULFUR HEXAFLUORIDE FILLED SURFACE ACOUSTIC WAVE (SAW) THIN-FILM ACOUSTIC PACKAGE (TFAP) DOMES
#52INTEGRATED DEVICE BASED ON THIRD-GENERATION SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF
#53COMBINER FOR RADIO-FREQUENCY CIRCUITS, DEVICES AND METHODS
#54ELECTROACOUSTIC RESONATOR WITH MODIFIED CHARGE TRAPPING REGION
#55METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE
#56ELECTRO ACOUSTIC RESONATOR WITH SUPPRESSED TRANSVERSAL GAP MODE EXCITATION AND REDUCED TRANSVERSAL MODES
#57METHOD OF MANUFACTURING PIEZOELECTRIC SUBSTRATE FOR SAW RESONATOR WITH IMPROVED CHARACTERISTIC AND PIEZOELECTRIC SUBSTRATE MANUFACTURED USING THE SAME
#58PIEZOELECTRIC-ON-INSULATOR (POI) SUBSTRATE AND METHOD FOR PRODUCING A PIEZOELECTRIC-ON-INSULATOR (POI) SUBSTRATE
#59PIEZOELECTRIC WAFER AND METHOD OF FABRICATING THE SAME AND ACOUSTIC WAVE DEVICE INCLUDING THE SAME
#60SURFACE ACOUSTIC WAVE DEVICES WITH DECOUPLED INTERDIGITAL CAPACITORS
#61PIEZOELECTRIC-ON-INSULATOR (POI) SUBSTRATE AND METHOD FOR PRODUCING A PIEZOELECTRIC-ON-INSULATOR (POI) SUBSTRATE
#62MEMBRANE-TYPE LONGITUDINAL MODE RESONATOR
#63ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF
#64SURFACE ACOUSTIC WAVE RESONATOR DEVICE AND MANUFACTURING METHOD THEREOF
#65THIN-FILM SURFACE-ACOUSTIC-WAVE RESONATOR WITH ALUMINUM NITRIDE LAYER
#66SURFACE ACOUSTIC WAVE FILTER WITH CONNECTED BAR PISTONS
#67SURFACE ACOUSTIC WAVE DEVICE AND FABRICATING METHOD OF THE SAME
#68Elastic Wave Device and Module Using Elastic Wave Device
#69ACOUSTIC WAVE DEVICE AND FABRICATION METHOD THEREOF
#70COMPOSITE SUBSTRATE AND METHOD FOR PRODUCING COMPOSITE SUBSTRATE
#71PIEZOELECTRIC TRENCHES INTERLEAVED WITH HEAVY-METAL ELECTRODES OF A SAW RESONATOR
#72SURFACE ACOUSTIC WAVE RESONATOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND FILTER
#73ACOUSTIC WAVE DEVICES AND METHODS FOR RADIO-FREQUENCY APPLICATIONS
#74Surface acoustic wave resonator device and manufacturing method therefor and filter
#75ACOUSTIC WAVE DEVICES AND RELATED METHODS
#76MULTIMETER-WAVE ACOUSTIC RESONATORS
#77ACOUSTIC DEVICES WITH INTEGRATED CIRCUIT ELEMENTS AND RELATED FABRICATION METHODS
#78SURFACE ACOUSTIC WAVE (SAW) DEVICE WITH ONE OR MORE INTERMEDIATE LAYERS FOR SELF-HEATING IMPROVEMENT
#79ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD FOR ACOUSTIC WAVE DEVICE
#80SURFACE ACOUSTIC WAVE DEVICE HAVING IMPROVED Q PERFORMANCE AND METHOD OF MANUFACTURING THE SAME
#81SYSTEM FOR ENCAPSULATING A SURFACE ELASTIC WAVE DEVICE
#82COMPOSITE SUBSTRATE FOR SURFACE ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF
#83TRAVELING-WAVE SURFACE ACOUSTIC WAVE TRANSDUCER AND INTERCONVERTING AN ELECTRICAL SIGNAL AND A SURFACE ACOUSTIC WAVES
#84ACOUSTIC WAVE DEVICE HAVING DIFFERENT TYPES OF PIEZOELECTRIC LAYER STRUCTURES
#85ACOUSTIC WAVE DEVICE WITH A VARIABLE THICKNESS MULTI-LAYER PIEZOELECTRIC STRUCTURE
#86Electrode Structure with Corrosion Resistance and Power Durability
#87ELECTRONIC MODULE
#88DEVICES INCLUDING THROUGH-SUBSTRATE VIAS (TSVs) FOR BACKSIDE INTERCONNECTION, AND RELATED FABRICATION METHODS
#89PACKAGED ACOUSTIC WAVE DEVICES WITH MULTILAYER PIEZOELECTRIC SUBSTRATE
#90ACOUSTIC WAVE DEVICES
#91COMPOSITE SUBSTRATE, SURFACE ACOUSTIC WAVE ELEMENT, AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE
#92BONDING STRUCTURE AND ACOUSTIC WAVE DEVICE
#93SURFACE ACOUSTIC WAVE RESONANCE DEVICE AND METHOD FOR FORMING SAME, FILTER DEVICE, AND RADIO FREQUENCY FRONT END DEVICE
#94ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE
#95ELECTRICALLY TUNABLE SURFACE ACOUSTIC WAVE RESONATOR
#96ACOUSTICALLY SWITCHED RADIO FREQUENCY FRONTEND CIRCUIT
#97ACOUSTIC WAVE DEVICE
#98SURFACE ACOUSTIC WAVE FILTER FORMED ON SUBSTRATE WITH MULTI-LAYER STRUCTURE AND METHOD OF FABRICATING THE SAME
#99METHOD OF MANUFACTURING ACOUSTIC WAVE DEVICE WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE
#100ACOUSTIC WAVE DEVICE AND METHOD FOR PRODUCING SAME
#101SURFACE ACOUSTIC WAVE SENSOR ASSEMBLY
#102PRINTING COMPONENTS TO SUBSTRATE POSTS
#103SURFACE ACOUSTIC WAVE DEVICE
#104SURFACE ACOUSTIC WAVE RESONATOR HAVING ELECTRODE STRUCTURE WITH IMPROVED PERFORMANCE AND MANUFACTURING METHOD THEREOF
#105TEMPERATURE COMPENSATED FILTER WITH INCREASED STATIC CAPACITANCE
#106Acoustic Wave Device and Manufacturing Method Thereof
#107ACOUSTIC WAVE DEVICE AND METHOD FOR PRODUCING SAME
#108ACOUSTIC WAVE DEVICE
#109SURFACE ACOUSTIC WAVE DEVICE
#110BULK ACOUSTIC WAVE RESONANCE DEVICE AND METHOD FOR FORMING SAME, FILTERING DEVICE, AND RADIO FREQUENCY FRONT END DEVICE
#111ACOUSTIC WAVE DEVICE
#112SURFACE ACOUSTIC WAVE DEVICE HAVING AN INTERFACE LAYER BETWEEN AN IDT AND A PIEZOELECTRIC LAYER
#113MODULE
#114COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE
#115ACOUSTIC WAVE DEVICE AND METHOD FOR PRODUCING SAME
#116Surface acoustic wave device on composite substrate
#117LASER-MARKED PACKAGED SURFACE ACOUSTIC WAVE DEVICES
#118ACOUSTIC WAVE DEVICE WITH PARTIALLY ROUNDED INTERDIGITAL TRANSDUCER ELECTRODE
#119ACOUSTIC RESONATOR HAVING SYMMETRIC COATING MATERIAL FOR IMPROVED COUPLING
#120METHOD OF FORMING ACOUSTIC WAVE DEVICE WITH SELECTIVELY ROUNDED INTERDIGITAL TRANSDUCER ELECTRODE
#121Vertically coupled SAW resonators
#122Surface acoustic wave resonator device and method for manufacturing the same and filter
#123Double-Mode Surface-Acoustic-Wave (DMS) Filter Having A Transition Region with A Partly Uniform Geometric Property
#124Surface acoustic wave resonator device and method of manufacturing the same, filter
#125PIEZOELECTRIC PLATE AND MANUFACTURING METHOD THEREFOR, SAW DEVICE AND MANUFACTURING METHOD THEREFOR
#126SURFACE ACOUSTIC WAVE DEVICE AND FABRICATION METHOD THEREOF
#127MEMS and NEMS Resonators with Acoustic Metamaterial Lateral Anchors for Improved Performance and Linearity
#128WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE
#129Surface acoustic wave resonator device and method for manufacturing the same, and filter
#130MULTILAYER FILM SUBSTRATE, ACOUSTIC WAVE DEVICE, MODULE, AND METHOD FOR PRODUCING MULTILAYER FILM SUBSTRATE
#131Acoustic wave resonator assembly and related modules
#132Electro acoustic resonator with suppressed transversal gap mode excitation and reduced transversal modes
#133STRUCTURE WITH PHOTODIODE, HIGH ELECTRON MOBILITY TRANSISTOR, SURFACE ACOUSTIC WAVE DEVICE AND FABRICATING METHOD OF THE SAME
#134ELECTROACOUSTIC RESONATOR
#135Methods of manufacturing acoustic wave device with anti-reflection layer
#136ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
#137DIE PACKAGE WITH SEALED DIE ENCLOSURES
#138METHOD FOR PREPARING A THIN LAYER OF FERROELECTRIC MATERIAL
#139SURFACE ACOUSTIC WAVE DEVICE
#140MULTILAYER PIEZOELECTRIC SUBSTRATE PACKAGING
#141MULTILAYER PIEZOELECTRIC SUBSTRATE PACKAGING METHOD FOR STACKING STRUCTURE
#142Surface Acoustic Wave Resonator and Manufacturing Method Therefor
#143PROCESS FOR MANUFACTURING A PIEZOELECTRIC STRUCTURE FOR A RADIOFREQUENCY DEVICE AND WHICH CAN BE USED TO TRANSFER A PIEZOELECTRIC LAYER, AND PROCESS FOR TRANSFERRING SUCH A PIEZOELECTRIC LAYER
#144TEMPERATURE COMPENSATED SURFACE ACOUSTIC WAVE DEVICE AND METHODS OF MANUFACTURING THE SAME
#145COMBINER CIRCUITS, AND RELATED DEVICES AND METHODS
#146BRIDGE COMBINERS AND MULTIPLEXERS
#147PACKAGED ACOUSTIC WAVE DEVICES WITH MULTILAYER PIEZOELECTRIC SUBSTRATE
#148COMPOSITE SUBSTRATE, SURFACE ACOUSTIC WAVE DEVICE, AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE
#149PIEZOELECTRIC LAYER ARRANGEMENTS IN ACOUSTIC WAVE DEVICES AND RELATED METHODS
#150PACKAGED ACOUSTIC WAVE DEVICES WITH MULTILAYER PIEZOELECTRIC SUBSTRATE
#151SURFACE ACOUSTIC WAVE DEVICES WITH HIGH VELOCITY HIGHER-ORDER MODE
#152Semiconductor device and method of forming high Khigh Q acoustic wave resonator
#153COMPOSITE WAFER AND METHOD FOR PRODUCING SAME
#154Bridge combiners with resonators for radio-frequency applications
#155COMPOSITE SUBSTRATE, SURFACE ACOUSTIC WAVE ELEMENT, AND METHOD OF PRODUCING COMPOSITE SUBSTRATE
#156Multi-layer piezoelectric substrate with conductive layer
#157COMPOSITE SUBSTRATE FOR SURFACE ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF
#158Structure and manufacturing method of surface acoustic wave filter with back electrode of piezoelectric layer
#159SURFACE ACOUSTIC WAVE FILTERS WITH SUPPRESSED CAVITY BENDING
#160MEMS DEVICE AND FABRICATION METHOD THEREOF
#161ACOUSTIC WAVE DEVICE
#162PACKAGED ACOUSTIC WAVE DEVICES WITH MULTILAYER PIEZOELECTRIC SUBSTRATE
#163ACOUSTIC WAVE DEVICE WITH TRENCH PORTIONS AND NARROW INTERDIGITAL TRANSDUCER TIP PORTIONS FOR TRANSVERSE MODE SUPPRESSION
#164METHOD OF MANUFACTURE OF ACOUSTIC WAVE DEVICE WITH TRENCH PORTIONS FOR TRANSVERSE MODE SUPPRESSION
#165Acoustic wave device with enhanced quality factor and fabrication method thereof
#166Surface acoustic wave device
#167Surface acoustic wave device and fabrication method thereof
#168ACOUSTIC FILTER OPERATING AT BROADER PASSBAND
#169Surface acoustic wave resonator structure and method of forming the same, and filter
#170Surface acoustic wave device and fabrication method thereof
#171Air gap type semiconductor device package structure
#172PROCESS FOR MANUFACTURING A PIEZOELECTRIC STRUCTURE FOR A RADIOFREQUENCY DEVICE WHICH STRUCTURE CAN BE USED TO TRANSFER A PIEZOELECTRIC LAYER, AND PROCESS FOR TRANSFERRING SUCH A PIEZOELECTRIC LAYER
#173Suspending an Electrode Structure Using a Dielectric
#174Surface-Acoustic-Wave (SAW) Filter with an Electrical Conductor Having a Floating Potential
#175LAYERED TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE RESONATOR AND PACKAGING METHOD
#176Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods
#177METHOD OF MAKING PACKAGES WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE
#178Surface acoustic wave (SAW) device with one or more intermediate layers for self-heating improvement
#179ACOUSTIC WAVE DEVICE WITH VERTICALLY MASS LOADED MULTI-LAYER INTERDIGITAL TRANSDUCER ELECTRODE FOR TRANSVERSE MODE SUPPRESSION
#180ACOUSTIC WAVE DEVICE AND METHOD FOR PRODUCING SAME
#181METHOD OF MAKING ACOUSTIC WAVE DEVICE WITH VERTICALLY MASS LOADED MULTI-LAYER INTERDIGITAL TRANSDUCER ELECTRODE FOR TRANSVERSE MODE SUPPRESSION
#182ACOUSTIC WAVE DEVICE AND ACOUSTIC-WAVE-DEVICE MANUFACTURING METHOD
#183COMPOSITE SUBSTRATES INCLUDING EPITAXIAL MONOCRYSTALLINE PIEZOELECTRIC LAYERS BONDED TO SUBSTRATES, AND ACOUSTIC WAVE DEVICES FORMED WITH SUCH COMPOSITE SUBSTRATES
#184METHODS OF MANUFACTURING MULTI-BAND SURFACE ACOUSTIC WAVE FILTERS
#185METHOD OF MANUFACTURING AN ACOUSTIC WAVE DEVICE WITH THROUGH VIA ON MULTILAYER PIEZOELECTRIC SUBSTRATE
#186Resonator-assisted LC filter exhibiting high-pass and bandpass behavior
#187STRUCTURE AND MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE FILTER WITH INTERDIGITAL TRANSDUCER
#188Structure and manufacturing method of surface acoustic wave filter with back electrode of piezoelectric layer
#189COMPOSITE SUBSTRATE OF FILTER, METHOD FOR MAKING COMPOSITE SUBSTRATE OF FILTER, AND TEMPERATURE COMPENSATED SURFACE ACOUSTIC WAVE FILTER
#190MULTI-BAND SURFACE ACOUSTIC WAVE FILTERS
#191METHOD FOR FORMING A LAYER WITH THE BASIC OF A PIEZOELECRIC MATERIAL AND SURFACE ACOUSTIC WAVE DEVICE USING SUCH A LAYER
#192METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE AND COMPOSITE SUBSTRATE
#193METHOD FOR FORMING ACOUSTIC WAVE DEVICE
#194ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
#195STACKED FILTER PACKAGE HAVING MULTIPLE TYPES OF ACOUSTIC WAVE DEVICES
#196Interdigital transducer electrode for acoustic wave device with improved response
#197METHOD OF MAKING PACKAGED ACOUSTIC WAVE DEVICES WITH MULTILAYER PIEZOELECTRIC SUBSTRATE
#198ELASTIC WAVE DEVICE, MODULE
#199MULTI-LEVEL STACKED ACOUSTIC WAVE (AW) FILTER PACKAGES AND RELATED FABRICATION METHODS
#200Surface-Acoustic-Wave (SAW) Filter with a Compensation Layer Having Multiple Densities
#201SURFACE ACOUSTIC WAVE FILTER WAFER-LEVEL PACKAGING STRUCTURE AND METHOD
#202INTEGRATION OF CARBON NANOTUBES IN PACKAGE FILLER AND GEL OVERCOAT
#203BONDED BODY AND A METHOD OF PRODUCING THE SAME
#204PACKAGED SURFACE ACOUSTIC WAVE DEVICE WITH CONDUCTIVE PILLAR
#205PACKAGED SURFACE ACOUSTIC WAVE DEVICE WITH CONDUCTIVE ROOF SUPPORTING STRUCTURE
#206PACKAGED MULTILAYER PIEZOELECTRIC SURFACE ACOUSTIC WAVE DEVICE WITH CONDUCTIVE PILLAR
#207MODULE HAVING ELASTIC WAVE DEVICE
#208MULTILAYER PIEZOELECTRIC SUBSTRATE DEVICE WITH POLYCRYSTALLINE SUBSTRATE
#209Elastic wave device and method for manufacturing the same
#210ACOUSTIC WAVE RESONATOR WITH REDUCED SIZE
#211Method of manufacturing integrated circuit configured with two or more single crystal acoustic resonator devices
#212MULTILAYER PIEZOELECTRIC SUBSTRATE DEVICE WITH PARTIALLY RECESSED PASSIVATION LAYER
#213Multilayer piezoelectric substrate with reduced side leakage and transverse mode suppression
#214Surface acoustic wave device and method for fabricating the same
#215SURFACE ACOUSTIC WAVE DEVICE AND METHOD FOR FABRICATING THE SAME
#216STRUCTURE AND MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE FILTER WITH INTERDIGITAL TRANSDUCER
#217STRUCTURE AND MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE FILTER WITH BACK ELECTRODE OF PIEZOELECTRIC LAYER
#218Structure and manufacturing method of surface acoustic wave filter with back electrode of piezoelectric layer
#219ACOUSTIC WAVE DEVICE WITH ACOUSTIC OBSTRUCTION STRUCTURE
#220METHOD OF FORMING ACOUSTIC WAVE DEVICE WITH REDUCED ACOUSTIC COUPLING
#221ACOUSTIC RESONATOR
#222Acoustic wave resonators and radio frequency elements with isolation
#223Overcurrent protection circuit, display apparatus and driver circuit thereof, and overcurrent protection method
#224COMPOSITE SUBSTRATE AND METHOD OF PRODUCING COMPOSITE SUBSTRATE
#225MULTILAYER PIEZOELECTRIC SUBSTRATE FOR ACOUSTIC WAVE DEVICE
#226METHOD OF MAKING A MULTILAYER PIEZOELECTRIC SUBSTRATE FOR ACOUSTIC WAVE DEVICE
#227SURFACE ACOUSTIC WAVE DEVICE WITH HIGH ELECTROMECHANICAL COUPLING COEFFICIENT BASED ON DOUBLE-LAYER ELECTRODES AND PREPARATION METHOD THEREOF
#228Bonded body
#229Surface acoustic wave devices and related methods
#230Solidly-mounted transversely-excited film bulk acoustic device and method
#231BLACKENED WAFERS AND METHOD FOR MANUFACTURING THE SAME, AND WAVE FILTER DEVICE HAVING THE SAME
#232TRANSDUCER STRUCTURE FOR SINGLE-PORT RESONATOR WITH TRANSVERSE MODE SUPPRESSION
#233COMPOSITE SUBSTRATE, SURFACE ACOUSTIC WAVE RESONATOR, AND FABRICATING METHODS THEREOF
#234ACOUSTIC TRANSDUCER AND METHOD OF MANUFACTURING
#235TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATORS WITH STRUCTURES TO REDUCE ACOUSTIC ENERGY LEAKAGE
#236Surface acoustic wave device and method of manufacturing the same
#237ELASTIC WAVE DEVICE AND METHOD OF MANUFACTURING ELASTIC WAVE DEVICE
#238Acoustic filters with shared acoustic tracks for series and shunt resonators
#239Site-selective piezoelectric-layer trimming
#240Electronic component and method of manufacturing electronic component
#241Surface acoustic wave resonator with piston mode design and electrostatic discharge protections
#242ACOUSTIC WAVE DEVICE
#243Manufacturing method of a composite substrate of an acoustic wave resonator
#244METHOD FOR MANUFACTURING A STRUCTURE COMPRISING A THIN LAYER TRANSFERRED ONTO A SUPPORT PROVIDED WITH A CHARGE TRAPPING LAYER
#245SURFACE ACOUSTIC WAVE (SAW) DEVICES WITH A DIAMOND BRIDGE ENCLOSED WAVE PROPAGATION CAVITY
#246ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
#247Surface acoustic wave resonator, filter, manufacturing method thereof, and communication device
#248Transversely-excited film bulk acoustic resonators with structures to reduce acoustic energy leakage
#249Surface acoustic wave device fabrication method
#250METHOD FOR PRODUCING SEALED FUNCTIONAL ELEMENTS
#251PACKAGED ACOUSTIC WAVE DEVICES WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE
#252Electronic component and method for manufacturing the same
#253ACOUSTIC WAVE DEVICE
#254SURFACE ACOUSTIC WAVE (SAW) DEVICE WITH HIGH PERMITTIVITY DIELECTRIC FOR INTERMODULATION DISTORTION IMPROVEMENT
#255Composite substrate, elastic wave element, and production method for composite substrate
#256Integration Method and Integration Structure for Control Circuit and Acoustic Wave Filter
#257Surface acoustic wave devices with ultra-thin transducers
#258PIEZOELECTRIC ELEMENT, METHOD OF MANUFACTURING THE SAME, SURFACE ACOUSTIC WAVE ELEMENT, AND PIEZOELECTRIC THIN FILM RESONANCE ELEMENT
#259Hybrid pinning package for radio frequency filters
#260SUBSTRATE COMPRISING ACOUSTIC RESONATORS CONFIGURED AS AT LEAST ONE ACOUSTIC FILTER
#261Surface acoustic wave resonator, its manufacturing method, and radio circuit
#262Composite substrate, piezoelectric device, and method for manufacturing composite substrate
#263SURFACE ACOUSTIC WAVEWAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF
#264Packaging surface acoustic wave devices with conductive terminals
#265Acoustic wave device
#266Package comprising stacked filters
#267Micro-transfer-printed acoustic wave filter device
#268MICRO-ACOUSTIC DEVICE WITH REFLECTIVE PHONONIC CRYSTAL AND METHOD OF MANUFACTURE
#269Composite substrate for surface acoustic wave device and manufacturing method thereof
#270Surface acoustic wave electroacoustic device using gap grating for reduced transversal modes
#271APPARATUS AND METHOD FOR REAL-TIME SENSING OF PROPERTIES IN INDUSTRIAL MANUFACTURING EQUIPMENT
#272Formation method of filter device
#273COMPOSITE SUBSTRATE AND METHOD OF MANUFACTURING COMPOSITE SUBSTRATE
#274Bonded body of piezoelectric material substrate and supporting substrate
#275Thin film saw device
#276Composite substrate, piezoelectric device, and method for manufacturing composite substrate
#277Deposition method of a metallic layer on a substrate of a resonator device
#278Bridge combiners having resonator
#279Architectures having bridge combiners and multiplexers
#280Electro acoustic resonator with suppressed transversal gap mode excitation and reduced transversal modes
#281Systems and methods for packaging an acoustic device in an integrated circuit (IC)
#282Circuits, devices and methods related to half-bridge combiners
#283Superconducting device that mixes surface acoustic waves and microwave signals
#284Printing components to substrate posts
#285Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices
#286Bonded body and acoustic wave element
#287Wafer level package and method of manufacture
#288Surface acoustic wave filter and manufacturing method therefor
#289Phase shift structures for acoustic resonators
#290Surface acoustic wave device and manufacturing method thereof
#291Multilayer body and method of manufacturing the same
#292Monolithic single chip integrated radio frequency front end module configured with single crystal acoustic filter devices
#293Packaging method and package structure for filter chip
#294Elastic wave device
#295TF-SAW resonator with improved quality factor, RF filter and method of manufacturing a TF-SAW resonator
#296ELECTROACOUSTIC RESONATOR, RF FILTER WITH INCREASED USABLE BANDWIDTH AND METHOD OF MANUFACTURING AN ELECTROACOUSTIC RESONATOR
#297ENERGY CONFINEMENT IN ACOUSTIC WAVE DEVICES
#298Surface acoustic wave device
#299Method of making stacked acoustic wave resonator package with laser-drilled vias
#300Variation of metal layer stack under under bump metallization (UBM)