220379 ⎘
Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
Sub-classes:Fabrication Method for a Thin-Film Layer on a Substrate
#2RF filter circuit including BAW resonators
#3Electromechanical conversion device and system using such a device
#4Balun
#5Oscillator and method of manufacturing same
#6PACKAGED ACOUSTIC WAVE DEVICES WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE
#7INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND INTEGRATION METHOD THEREFOR
#8Micro-acoustic wafer-level package and method of manufacture
#9Crystal device and method for manufacturing crystal device
#10Micro-transfer-printed acoustic wave filter device
#11METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE
#12Preparation process for graphene resonant gas sensor based on doped metal atoms
#13Multi-mode qubit readout and qubit state assignment
#14Electroacoustic resonator and method for manufacturing the same
#155G n41 2.6 GHz band acoustic wave resonator RF filter circuit
#16COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION
#17Component with a thin-layer covering and method for its production
#18Acoustic wave device and method of manufacturing the same
#19Pitch/roll annulus gyroscope with slanted quadrature tuning electrodes and related fabrication methods
#20Surface acoustic wave device having a piezoelectric layer on a quartz substrate and methods of manufacturing thereof
#21Switchable filters and design structures
#22Semiconductor package and semiconductor process
#23Bulk acoustic wave filter and a method of frequency tuning for bulk acoustic wave resonator of bulk acoustic wave filter
#24Electronic component and method of manufacturing the same
#25Switchable filters and design structures
#26Switchable filters and design structures
#27Resonator and filter with resonator
#28BAW FILTER AND METHOD FOR MANUFACTURING THE SAME
#29Covering for a component and method for producing a covering for a component
#30Device packaging using a recyclable carrier substrate
#31Surface acoustic wave device having a piezoelectric layer on a quartz substrate and methods of manufacturing thereof
#32Method for manufacturing electronic component module
#33Acoustic device package and method of making
#34METHOD FOR FORMING EXTERNAL ELECTRODE OF ELECTRONIC COMPONENT
#35Hollow supports and anchors for mechanical resonators
#36Switchable filters and design structures
#37Method for manufacturing surface acoustic wave apparatus
#38METHOD FOR MANUFACTURING VIBRATING ELEMENT, VIBRATING ELEMENT, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
#39Filter and layout structure thereof
#40Systems and methods for manufacturing passive waveguide components
#41Process for manufacturing a plurality of wave energy emitters
#42Three dimensional piezoelectric MEMS
#43Method for manufacturing an electronic device
#44Method of fabricating crystal unit, crystal unit fabrication mask, and crystal unit package
#45Electronic component module
#46Integration of piezoelectric materials with substrates
#47Method of manufacturing switchable filters
#48Method of manufacturing a film bulk acoustic resonator with a loading element
#49Microelectromechanical systems (MEMS) resonators and related apparatus and methods
#50Oscillator device and manufacturing process of the same
#51Low-temperature wafer level processing for MEMS devices
#52Media content management and presentation systems and methods
#53Microelectromechanical systems (MEMS) resonators and related apparatus and methods
#54SUBSTRATE, MANUFACTURING METHOD OF SUBSTRATE, SAW DEVICE AND DEVICE
#55Passive waveguide components manufactured by three dimensional printing and injection molding techniques
#56Manufacturing method of an array of BAW resonators with mask controlled resonant frequencies
#57Method of fabricating crystal unit, crystal unit fabrication mask, and crystal unit package
#58Integration of piezoelectric materials with substrates
#59INTEGRATION OF PIEZOELECTRIC MATERIALS WITH SUBSTRATES
#60Methods of fabricating a membrane with improved mechanical integrity
#61Low temperature wafer level processing for MEMS devices
#62Integration of piezoelectric materials with substrates
#63Method for manufacturing acoustic wave device
#64ARRAY OF BAW RESONATORS WITH MASK CONTROLLED RESONANT FREQUENCIES
#65Surface mount crystal oscillator
#66Method for manufacturing surface acoustic wave apparatus
#67Methods of fabricating a membrane with improved mechanical integrity
#68Structure and method of making sealed capped chips
#69Structure and method of making capped chip having discrete article assembled into vertical interconnect
#70Structure and self-locating method of making capped chips
#71Structure and method of making capped chips having vertical interconnects
#72Back-face and edge interconnects for lidded package
#73Wafer level package fabrication method using laser illumination
#74Method of manufacturing an electronic device
#75Structure and method of making capped chips having vertical interconnects
#76Back-face and edge interconnects for lidded package
#77Structure and method of making capped chips using sacrificial layer
#78Structure and self-locating method of making capped chips
#79Structure and method of making sealed capped chips
#80Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
#81Method for producing a protective cover for a device
#82Multi-mode qubit readout and qubit state assignment
#83Methods for suppressing spurious modes in microresonators
#84Acoustic wave filter manufacturing method using photo-definable epoxy for suppression of unwanted acoustic energy