220677 ⎘
Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators; Details; Holders; Supports; Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a foil covering the non-active sides of the SAW device
Manufacturing method of mounting structure, and laminate sheet therefor
#2Electronic device comprising an optical chip and method of fabrication
#3Component with a thin-layer covering and method for its production
#4Elastic wave device
#5Elastic wave device and electronic component
#6Acoustic wave device and method of manufacturing the same
#7Acoustic wave device
#8Electronic component and manufacturing method therefor
#9Acoustic wave device
#10Surface acoustic wave (SAW) device package and method for fabricating same
#11Electronic device
#12Acoustic wave device and fabrication method of the same
#13Module and production method
#14Acoustic wave device
#15Acoustic wave device
#16Acoustic wave device and method for fabricating the same
#17Stack type surface acoustic wave package, and method for manufacturing the same
#18Method of manufacturing a boundary acoustic wave device
#19Surface acoustic wave device having gap between surface acoustic wave filters covered by sealer
#20Surface acoustic wave device
#21Electronic device and method of fabricating the same
#22Electronic component package
#23Electronic device, method for producing the same, and communication apparatus including the same
#24STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTURING THE SAME
#25Methods for integrated circuit module packaging and integrated circuit module packages
#26Piezoelectric device
#27Electronic part having high sealing performance and method of manufacturing the same
#28Manufacturing method capable of simultaneously sealing a plurality of electronic parts
#29Stack type surface acoustic wave package, and method for manufacturing the same
#30Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method
#31Surface acoustic wave filter and method of producing the same
#32Radio frequency module and fabrication method thereof
#33Semiconductor device and method for producing the same
#34Encapsulated electronic component and production method
#35Boundary acoustic wave device
#36Electronic device and method of fabricating the same
#37Modular construction component with encapsulation
#38Surface acoustic wave device and method for manufacturing the same
#39Encapsulated component and method for the production thereof
#40Downsized package for electric wave device
#41Encapsulated electronics device with improved heat dissipation
#42Electronic part and method of manufacturing the same
#43Method for the hermetic encapsulation of a component
#44Acoustic wave device and method of fabricating the same
#45Package assembly for electronic device
#46Method for fabricating surface acoustic wave filter packages and package sheet used therein
#47Encapsulated component which is small in terms of height and method for producing the same
#48Surface acoustic wave device, package for the device, and method of fabricating the device