220675 ⎘
Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators; Details; Holders; Supports; Mounting in enclosures for surface acoustic wave [SAW] devices
Sub-classes:PIEZOELECTRIC DEVICE
#2SYSTEM FOR ENCAPSULATING A SURFACE ELASTIC WAVE DEVICE
#3Circuit device and oscillator
#4LASER-MARKED PACKAGED SURFACE ACOUSTIC WAVE DEVICES
#5COMPOSITE FILTER DEVICE
#6ACOUSTIC WAVE DEVICE AND METHOD FOR PRODUCING SAME
#7ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
#8MULTILAYER PIEZOELECTRIC SUBSTRATE DEVICE WITH NEGATIVE TEMPERATURE COEFFICIENT OF FREQUENCY DIELECTRIC FILM FOR TEMPERATURE STABILITY
#9Multilayer piezoelectric substrate device with positive temperature coefficient of frequency dielectric film for temperature stability
#10MULTILAYER PIEZOELECTRIC SUBSTRATE SURFACE ACOUSTIC WAVE DEVICE WITH SPURIOUS SHIFTING
#11ACOUSTIC WAVE DEVICE WITH MULTILAYER PIEZOELECTRIC SUBSTRATE FOR REDUCED SPURIOUS SIGNALS
#12SURFACE ACOUSTIC WAVE DEVICE HAVING ENHANCED POWER DURABILITY
#13Surface acoustic wave device
#14PACKAGED ACOUSTIC WAVE DEVICES WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE
#15METHOD OF MAKING A PACKAGED ACOUSTIC WAVE DEVICES WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE
#16Electronic component and method for manufacturing the same
#17Wafer level surface acoustic wave filter and package method
#18SUBSTRATE COMPRISING ACOUSTIC RESONATORS CONFIGURED AS AT LEAST ONE ACOUSTIC FILTER
#19Packaging surface acoustic wave devices with conductive terminals
#20Over temperature protection for acoustic wave filter
#21METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE
#22High-frequency module
#23Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias
#24Wideband filter including an acoustic resonator chip integrated with 3D inductors and a 3D transformer
#25Methods for packaging surface acoustic wave devices
#26Packaged surface acoustic wave devices
#27Laser-marked packaged surface acoustic wave devices
#28Laser-marked packaged surface acoustic wave devices
#29Acoustic wave device, module, and multiplexer
#30Acoustic wave filter with temperature sensor
#31Multiplexer
#32COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION
#33Elastic wave device, radio-frequency front-end circuit, and communication device
#34Component with a thin-layer covering and method for its production
#35Composite electronic component
#36Elastic wave device and method for producing the same
#37Surface acoustic wave device
#38Apparatus for automatic sampling of biological species employing an amplification with a magnetic nanoparticle and propulsion method
#39Surface acoustic wave device with thermally conductive layer
#40Acoustic wave filters with thermally conductive sheet
#41Wafer level package and manufacturing method thereof
#42High-frequency module
#43High-frequency module
#44Filter device
#45Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias
#46Wave separator
#47Surface acoustic wave filter with temperature sensor
#48Filter with over temperature protection
#49Component with improved heat dissipation
#50Electronic component and method of manufacturing the same
#51Elastic wave device
#52HERMETIC SEALING LID MEMBER AND ELECTRONIC COMPONENT HOUSING PACKAGE
#53Acoustic wave device
#54Acoustic wave device
#55Electronic device
#56Acoustic wave filter device, package to manufacture acoustic wave filter device, and method to manufacture acoustic wave filter device
#57Oscillation module, electronic apparatus, and vehicle
#58Surface acoustic wave device
#59Systems and methods for quartz wafer bonding
#60Elastic wave device with sealing structure
#61Printed circuit board and method of manufacturing the same
#62Elastic wave device, electronic component, and method for manufacturing elastic wave device
#63Switchable filters and design structures
#64Elastic wave devices
#65Miniaturized multi-part component and method for producing same
#66Method for manufacturing acoustic wave device
#67Electronic module having an interconnection substrate with a buried electronic device therein
#68Switchable filters and design structures
#69Method of packaging integrated circuits and a molded package
#70Electronic component
#71Module and production method
#72Method of manufacturing switchable filters
#73Module package and production method
#74Elastic wave device having pairs of filters that face each other
#75Electronic component, electronic device, and method for manufacturing the electronic component
#76Ovenized crystal oscillator assembly
#77Acoustic wave device and method for fabricating the same
#78Structure and method of making sealed capped chips
#79Structure and self-locating method of making capped chips
#80Structure and method of making capped chips having vertical interconnects
#81Manufacture of mountable capped chips
#82Back-face and edge interconnects for lidded package
#83High frequency chip packages with connecting elements
#84Microelectronic assemblies incorporating inductors
#85Method of manufacturing semiconductor device and method of manufacturing electronic device
#86Integrated circuit having one or more conductive devices formed over a SAW and/or MEMS device
#87Structure and method of making capped chips having vertical interconnects
#88Back-face and edge interconnects for lidded package
#89Structure and method of making capped chips using sacrificial layer
#90Structure and self-locating method of making capped chips
#91Structure and method of making sealed capped chips
#92Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
#93High-frequency chip packages
#94Package part and method of manufacturing the part
#95Packaged component and manufacturing process thereof
#96Manufacture of mountable capped chips