220679 ⎘
Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators; Details; Holders; Supports; Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
MULTI-LAYER PIEZOELECTRIC SUBSTRATE
#2SUPPORT SUBSTRATE, COMPOSITE SUBSTRATE, ELECTRONIC DEVICE, AND MODULE
#3PACKAGED MULTI-LAYER PIEZOELECTRIC SUBSTRATE ACOUSTIC WAVE DEVICE WITH INSULATOR FOR REDUCED DC LEAKAGE
#4VERTICALLY COUPLED SAW RESONATORS
#5PACKAGING OF SURFACE ACOUSTIC WAVE DEVICE HAVING MULTILAYER PIEZOELECTRIC SUBSTRATE
#6ACOUSTIC WAVE FILTER AND RADIO FREQUENCY MODULE
#7SURFACE ACOUSTIC WAVE STRUCTURES WITH EMBEDDED ACOUSTIC REFLECTORS
#8ACOUSTIC WAVE MODULE
#9EFFICIENT QUERYING, GENERATION, DISPLAY, AND DISTINGUISHING OF INFORMATION IN A NETWORK
#10LASER-MARKED PACKAGED SURFACE ACOUSTIC WAVE DEVICES
#11Vertically coupled SAW resonators
#12STACKED ACOUSTIC WAVE (AW) PACKAGES WITH REDUCED EXCITATION OF REFLECTED BULK WAVES
#13Multiplexer including filter with two types of acoustic wave resonators
#14SURFACE ACOUSTIC WAVE DEVICE
#15MULTILAYER PIEZOELECTRIC SUBSTRATE PACKAGING
#16Acoustic wave device and acoustic wave module including the same
#17Structure and manufacturing method of surface acoustic wave filter with back electrode of piezoelectric layer
#18PACKAGED ACOUSTIC WAVE DEVICES WITH MULTILAYER PIEZOELECTRIC SUBSTRATE
#19Electronic device and module including the same
#20Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods
#21PACKAGES WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE
#22Elastic wave device
#23Structure and manufacturing method of surface acoustic wave filter with back electrode of piezoelectric layer
#24SURFACE ACOUSTIC WAVE FILTER WAFER-LEVEL PACKAGING STRUCTURE AND METHOD
#25PACKAGED SURFACE ACOUSTIC WAVE DEVICE WITH CONDUCTIVE PILLAR
#26PACKAGED SURFACE ACOUSTIC WAVE DEVICE WITH CONDUCTIVE ROOF SUPPORTING STRUCTURE
#27PACKAGED MULTILAYER PIEZOELECTRIC SURFACE ACOUSTIC WAVE DEVICE WITH CONDUCTIVE PILLAR
#28PIEZOELECTRIC DEVICE
#29Acoustic wave device and acoustic wave module including the same
#30WAFER LEVEL PACKAGE HAVING ENHANCED THERMAL DISSIPATION
#31STRUCTURE AND MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE FILTER WITH BACK ELECTRODE OF PIEZOELECTRIC LAYER
#32Surface acoustic wave device
#33Elastic wave device
#34ELASTIC WAVE DEVICE AND METHOD OF MANUFACTURING ELASTIC WAVE DEVICE
#35Manufacturing method for surface acoustic wave filter package structure
#36Electronic component and method of manufacturing electronic component
#37Surface acoustic wave device fabrication method
#38Robust location, retrieval, and display of information for dynamic networks
#39Wafer level surface acoustic wave filter and package method
#40Filter assembly with two types of acoustic wave resonators
#41SURFACE ACOUSTIC WAVEWAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF
#42Packaging surface acoustic wave devices with conductive terminals
#43Electronic device and module including the same
#44ENERGY CONFINEMENT IN ACOUSTIC WAVE DEVICES
#45SURFACE ACOUSTIC WAVE WAFER-LEVEL PACKAGE
#46High-frequency module
#47ACOUSTIC WAVE DEVICE
#48SYSTEMS AND METHODS FOR SAW WAFER LEVEL ASSEMBLY WITH TOP SIDE CONTACTS
#49Acoustic wave device, high-frequency front-end circuit, and communication device
#50Acoustic wave device, high-frequency front end circuit, communication device, and method for manufacturing acoustic wave device
#51Acoustic wave device and acoustic wave module
#52Acoustic wave device
#53Acoustic wave filter, multiplexer, and communication apparatus
#54Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies
#55Acoustic wave device
#56Elastic wave filter apparatus
#57Acoustic wave device, radio-frequency front-end circuit, and communication apparatus
#58Acoustic wave device and acoustic wave module including the same
#59CAVITY STRUCTURES
#60Surface acoustic wave filter package structure and method of manufacturing the same
#61Thin-film type package
#62Acoustic wave device, front-end circuit, and communication apparatus
#63Methods for packaging surface acoustic wave devices
#64Packaged surface acoustic wave devices
#65Laser-marked packaged surface acoustic wave devices
#66Laser-marked packaged surface acoustic wave devices
#67Multilayer piezoelectric substrate
#68Electronic device and module including the same
#69Electronic component and module including the same
#70Filter device and method for manufacturing the same
#71Elastic wave device, duplexer, and communication device
#72Robust location, retrieval, and display of information for dynamic networks
#73Acoustic wave device, acoustic wave device package, multiplexer, radio-frequency front-end circuit, and communication device
#74Acoustic wave device and method of manufacturing the same
#75Surface acoustic wave device
#76Surface acoustic wave device
#77Multiplexer including filter with two types of acoustic wave resonators
#78Filter including two types of acoustic wave resonators
#79Acoustic wave filter including two types of resonators
#80Elastic wave device
#81Acoustic wave device
#82Acoustic wave device, radio-frequency front end circuit, and communication device
#83Elastic wave device
#84SURFACE ACOUSTIC WAVE RESONATOR STRUCTURE
#85Search and navigation to specific document content
#86Elastic wave device
#87Elastic wave device
#88Elastic wave device
#89Elastic wave device and manufacturing method for same
#90Surface acoustic wave device
#91Elastic wave device
#92Composite filter device, high-frequency front end circuit, and communication apparatus
#93Electronic module having a filler in a sealing resin
#94Elastic wave device
#95Module device
#96Surface acoustic wave sensor
#97High-frequency module
#98Elastic wave device
#99(R)- and (S)-1-(3-(3-N,N-dimethylaminocarbonyl)phenoxyl-4-nitrophenyl)-1-ethyl-N,N'-bis (ethylene)phosphoramidate, compositions and methods for their use and preparation
#100Acoustic wave device
#101Elastic wave device
#102Elastic wave device, high frequency front-end circuit, and communication apparatus
#103Acoustic wave filter device
#104Radio-frequency module
#105Filter including bulk acoustic wave resonator
#106SOLDER MATERIAL AND ELECTRONIC COMPONENT
#107Robust location, retrieval, and display of information for dynamic networks
#108Elastic wave filter apparatus
#109Elastic wave device, communication module apparatus, and method for manufacturing elastic wave device
#110Surface acoustic wave device assembly
#111Covering for a component and method for producing a covering for a component
#112Acoustic wave device and electronic component
#113Surface acoustic wave device
#114Electronic component
#115Duplexer
#116Acoustic wave device and method of manufacturing the same
#117Elastic wave device with sealing structure
#118Acoustic wave device
#119Search and navigation to specific document content
#120Elastic wave device and fabrication method thereof
#121Elastic wave device with first and second support layers providing a hollow path
#122Electronic component and manufacturing method therefor
#123Switchable filters and design structures
#124Surface acoustic wave device including first and second wiring electrodes crossing three-dimensionally
#125Microacoustic component and method for the production thereof
#126Method for forming a layered structural member
#127Method for manufacturing acoustic wave device
#128Electronic component
#129Surface acoustic wave sensor
#130Elastic wave device
#131Method for manufacturing surface acoustic wave apparatus
#132Method of manufacturing elastic wave device
#133Elastic wave device including a conductive shield electrode and manufacturing method thereof
#134Switchable filters and design structures
#135Acoustic wave device and method of fabricating the same
#136Oscillator device and method of mounting oscillator device
#137Acoustic wave device and method of fabricating the same
#138Surface acoustic wave device and composite module including same
#139Multi-band filter module and electronic device comprising the same
#140Method for manufacturing an electronic device
#141Acoustic wave device and electronic component
#142Search and navigation to specific document content
#143Acoustic wave device and sealing body contained therein
#144Elastic wave device and method of manufacturing the device
#145Acoustic wave filter and module
#146Electronic component module
#147Circuit module including duplexer
#148Electronic component and acoustic wave device
#149Acoustic wave device built-in module and communication device
#150Electronic component and method for producing the electronic component
#151Electronic component including a surface acoustic wave element and a pillar member
#152Acoustic wave device and fabrication method of the same
#153Module and production method
#154Method of manufacturing switchable filters
#155Method of manufacturing a film bulk acoustic resonator with a loading element
#156Acoustic wave device
#157Production method of electronic component
#158Piezoelectric device and manufacturing method therefor
#159Elastic-wave filter device and composite device including the same
#160ACOUSTIC WAVE DEVICE AND METHOD FOR FABRICATING THE SAME
#161Method for manufacturing piezoelectric vibration device
#162Surface acoustic wave resonator mounting with low acceleration sensitivity
#163Surface acoustic wave resonator, surface acoustic wave oscillator, and surface acoustic wave module device
#164Acoustic wave element and electronic device including the same
#165Electronic component
#166Electronic component and method for manufacturing electronic component
#167Electronic component and method of manufacturing the same
#168Elastic wave device and electronic device using the same
#169Electronic component
#170Piezoelectric component and manufacturing method thereof
#171Acoustic wave device and method for production of same
#172Acoustic wave device and electronic apparatus using the same
#173Surface acoustic wave device
#174Piezoelectric component and manufacturing method thereof
#175Elastic wave device and method for manufacturing the same
#176Surface acoustic wave device and method of manufacturing the same
#177Piezoelectric device
#178Surface acoustic wave device
#179Surface acoustic wave device and method for production of same
#180Surface acoustic wave device and duplexer
#181Surface acoustic wave element and equipment for measuring characteristics of liquid material
#182Acoustic wave device comprising an inter-digital transducer electrode
#183Surface acoustic wave resonator, surface acoustic wave oscillator, and surface acoustic wave module device
#184MULTI-BAND FILTER MODULE AND METHOD OF FABRICATING THE SAME
#185Acoustic wave device and method for manufacturing the same
#186Method for manufacturing surface acoustic wave device
#187Method for manufacturing surface acoustic wave apparatus
#188Surface acoustic wave device and method of fabricating the same
#189Method of manufacturing a piezoelectric component
#190Branching filter and method for manufacturing the same
#191Balance filter comprising two acoustic wave filters connected to a single ground terminal
#192Electrical component and production method
#193ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
#194Electronic component package
#195Acoustic wave device with adhesive layer and method of manufacturing the same
#196Electronic component
#197Method of manufacturing a surface acoustic wave device
#198Surface acoustic wave device and method for manufacturing the same
#199ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
#200Wafer level package fabrication method
#201Method for manufacturing semiconductor package
#202Electronic device package manufacturing method and electronic device package
#203Surface acoustic wave device and boundary acoustic wave device
#204Method for manufacturing surface acoustic wave device and surface acoustic wave device
#205Method of manufacturing an acoustic wave device
#206Acoustic wave device
#207Piezoelectric electronic component, process for producing the same, and communication apparatus
#208Multi-band filter module and method of fabricating the same
#209Surface acoustic wave device
#210Method of producing a surface acoustic wave device
#211Piezoelectric device and method for producing same
#212Surface acoustic wave packages and methods of forming same
#213Method for making a surface acoustic wave device package
#214Wafer level package for surface acoustic wave device and fabrication method thereof
#215Sequential fabrication of vertical conductive interconnects in capped chips
#216Structure and method of making capped chip having discrete article assembled into vertical interconnect
#217Piezoelectric filter
#218Wafer level package for surface acoustic wave device and fabrication method thereof
#219Method of forming a conductive through hole for a piezoelectric substrate
#220Surface acoustic wave device and manufacturing method thereof
#221Surface acoustic wave device and manufacturing method thereof
#222Chip packages with covers
#223Piezoelectric electronic component, and production method therefor, and communication equipment
#224Method for manufacturing a piezoelectric vibration device
#225Electrical component and production thereof
#226Piezoelectric device
#227Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same
#228Integrated and monolithic package structure of acoustic wave device
#229Surface acoustic wave device and method of manufacturing the same, IC card, and mobile electronic apparatus
#230Surface acoustic wave device package
#231Method for making a surface acoustic wave device package
#232Piezoelectric device and manufacturing method thereof
#233Surface acoustic wave device, surface acoustic wave apparatus, and communications equipment
#234Structure and method of forming capped chips
#235Surface acoustic wave device, surface acoustic wave apparatus, and communications equipment
#236Method for manufacturing surface acoustic wave device
#237Integrated circuit having one or more conductive devices formed over a SAW and/or MEMS device
#238Wafer-level seal for non-silicon-based devices
#239Method for producing a protective cover for a device
#240Package element and packaged chip having severable electrically conductive ties
#241Robust location, retrieval, and display of information for dynamic networks