233630 ⎘
Printed circuits; Details; Thermal arrangements, e.g. for cooling, heating or preventing overheating Cooling of mounted components
Displays with direct-lit backlight units and light spreading structures
#902Cooling structure and mounting structure
#903Optical transceiver including heat dissipation structure
#904Cooling system
#905METHOD FOR PREPARING HEXAGONAL BORON NITRIDE BY TEMPLATING
#906Asymmetric heat pipe coupled to a heat sink
#907Switching power supply device
#908Heatsink mounting system to maintain a relatively uniform amount of pressure on components of a circuit board
#909Electronic equipment and electronic device
#910Thermally conductive flexible adhesive for aerospace applications
#911Metal additive structures on printed circuit boards
#912Communication module and mounting structure thereof
#913Vertical-side solder method and package for power GaN devices
#914Electronic apparatus
#915Activate loading mechanism
#916Inverter
#917Bi-directional heatsink dampening force system
#918Power electronics module and a method of producing a power electronics module
#919Electronic device with self-regulated cooling to avoid hot-spot heating
#920ELECTRICAL DEVICE, CIRCUIT BOARD, AND METHOD OF IDENTIFYING A TYPE OF A HOUSING OF AN ELECTRICAL DEVICE
#921Desktop electronic device
#922Mobile terminal
#923Method for producing an electronic assembly, and electronic assembly, in particular for a transmission control module
#924High-frequency module
#925Electronic component, electronic component manufacturing method, and mechanical component
#926POWER SUPPLY DEVICE, HEADLIGHT AND MOVING BODY
#927Highly thermally conductive dielectric structure for heat spreading in component carrier
#928Control unit
#929Memory heat dissipation unit
#930Lidar apparatus for vehicle
#931Systems and methods for a smart module directly embedded on a lighting fixture
#932Electronic assembly with enhanced high power density
#933Wiring of a high resolution light source
#934Silicon heat-dissipation package for compact electronic devices
#935Optical module
#936Systems and methods for lighting fixtures
#937Converter module
#938Technologies for adaptive processing of multiple buffers
#939SYSTEM WITH SOCKETED PROCESSING DEVICE FOR HIGH SHOCK AND VIBRATION ENVIRONMENTS
#940THERMALLY CONDUCTIVE MEMBER
#941Controller with heat sink clamping plate for enhanced thermal properties
#942Electric motor assembly including end cap having heat sink for heat-generating electrical component
#943Damaged connection detection
#944Heat dissipation system of enclosed electronic module with single/multiple active components
#945REPLACEABLE ON-PACKAGE MEMORY DEVICES
#946Method for producing a power electronics system
#947HEAT RADIATION DEVICE
#948Inductive component
#949Molded photosensitive assembly for array imaging module for electronic device
#950Light-emitting device and method for manufacturing same
#951Fixing device for double sided heat sink and associated heat dissipating system
#952Printed circuit board assembly and assembling method thereof
#953High-speed hybrid circuit
#954Circuit assembly having a heat transfer member
#955Printed circuit board for integrated LED driver
#956Socket connector for an electronic package
#957Ceramic circuit substrate and method for producing ceramic circuit substrate
#958Printed circuit board assembly and assembling method thereof
#959Socket connector assembly for an electronic package
#960Cable socket connector assembly for an electronic
#961Semiconductor packages relating to thermal transfer plate and methods of manufacturing the same
#962TOPOLOGICAL INSULATOR TUBES APPLIED TO SIGNAL TRANSMISSION SYSTEMS
#963Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits
#964Solder assembly of pins to the peripheral end face of a printed circuit board
#965Assemblies including heat dispersing elements and related systems and methods
#966Component carrier with transistor components arranged side by side
#967Printed circuit board and electronic device
#968FLOATING CORE HEAT SINK ASSEMBLY
#969Planar phased array antenna
#970Light emitting package having a guiding member guiding an optical member
#971Cooled electronics package with stacked power electronics components
#972Component vertical mounting
#973Electronic device having wireless power transmitting/receiving conductive pattern
#974Electronic device and over-temperature detecting method
#975Releasable thermal gel
#976Circuit assembly
#977Method of making single reflow power pin connections
#978MOTOR
#979Ceramic circuit substrate and method for manufacturing same
#980Semiconductor-mounting heat dissipation base plate and production method therefor
#981Heat capacitive component carrier and method to produce said component carrier
#982Symmetrical power stages for high power integrated circuits
#983Heat-removal assemblies with opposing springs
#984Apparatus, system, and method for precise heatsink alignment on circuit boards
#985Motor control device and electric power steering apparatus
#986Preparation method of a ceramic module for power semiconductor integrated packaging
#987Modular electronic device and head unit for vehicles
#988Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
#989Vehicle lighting device and vehicle lamp
#990Printed circuit board, a terminal and a method of assembling a printed circuit board module
#991Mechanism with folded wrapping to seal components immersed in coolant
#992Power module with integrated liquid cooling
#993Portable power supply
#994Heat conducting member, printed circuit board, and electronic apparatus
#995Heat transfer adapter plate
#996Display device including a fingerprint scanner
#997Transcranial laser therapy for treatment of acute ischemic stroke
#998Power module assembly and assembling method thereof
#999Method for manufacturing a multilayer structure for hosting electronics
#1000Multilayer structure for hosting electronics and related method of manufacture
#1001Three-dimensional molded circuit component
#1002Thermal insulation and temperature control of components
#1003Method for producing heat-dissipating sheet having high thermal conductivity
#1004Electrical junction box
#1005Three-dimensional packaging structure and packaging method of power devices
#1006Power control system with improved thermal performance
#1007Heat-dissipating cooling pad
#1008Printed circuit board spacer
#1009ELECTROMAGNETIC SHIELDING STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME
#1010Movable heatsink utilizing flexible heat pipes
#1011RESILIENT CONTACT TERMINAL
#1012Circuit assembly and electrical junction box
#1013Electronic device including cooling structure
#1014Methods of forming flipped RF filter components
#1015Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member
#1016DC-DC CONVERTER
#1017Cooling techniques to improve thermal performance of electroacoustic device
#1018Connecting electrical circuitry in a quantum computing system
#1019Electronic control unit and electric power steering device using the same
#1020Technologies for optical communication in rack clusters
#1021Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
#1022Optical unit with rolling correction function and optical unit with triaxial shake correction function
#1023Ceramic module for power semiconductor integrated packaging and preparation method thereof
#1024LED substrate with electrical connection by bridging
#1025Electronic control unit and electric power steering device using the same
#1026Cooling mechanism of high mounting flexibility
#1027Circuit structure and electrical junction box
#1028Technologies for switching network traffic in a data center
#1029Methods for the acylation of maytansinol
#1030Display module and display device
#1031Inductive element and LC filter
#1032ELECTRICAL ASSEMBLY
#1033CIRCUIT ASSEMBLY AND ELECTRICAL JUNCTION BOX
#1034Automotive power electronics assembly
#1035Multi-rotor aerial drone with vapor chamber
#1036Capacitor substrate unit for opening/closing module
#1037Shield case and electronic device
#1038Back-to-back solid state lighting devices and associated methods
#1039LED display device, has flexible circuit board comprising main and extension portions, where main portion is arranged on first surface and extension portion is arranged on second surface, and light-emitting units arranged on main portion
#1040Systems and methods for lighting fixtures
#1041Systems and methods for a smart module directly embedded on a lighting fixture
#1042Systems and methods for lighting fixtures
#1043Systems and methods for lighting fixtures
#1044Printed circuit board assembly and assembling method thereof
#1045Assembly and lighting device comprising the assembly
#1046Heat dissipation device
#1047Microwave module
#1048Microelectronic assembly with electromagnetic shielding
#1049Electronics device that dissipates internal device heat via heat sink having exposed surface
#1050External charger for an implantable medical device having a thermal diffuser
#1051Structure of substrate having electronic parts mounted thereon and case for housing the substrate
#1052Heat sink for optical transceiver
#1053Light emitting apparatus
#1054Light emitting diode signal light
#1055Electrical power conversion apparatus
#1056Cold plate with dam isolation
#1057Heat spreaders with staggered fins
#1058Display device including a back cover with recess to provide cooling to a heat generating element
#1059SELF-COOLED LASER INTEGRATED DEVICE AND SUBSTRATE ARCHITECTURE
#1060THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD
#1061LIGHT MODULE HAVING A HEATSINK CRIMPED AROUND A LENS, AND A METHOD FOR CRIMPING A HEAT SINK AROUND A LENS OF A LIGHT MODULE
#1062Cooling arrangement and air guide shroud
#1063Lamp assembly for use in a headlamp
#1064Circuit assembly with increased mounting area
#1065MULTl-LAYER HEAT SPREADER ASSEMBLY WITH ISOLATED CONVECTIVE FINS
#1066Circuit structure and electrical junction box
#1067Hydrofluoroether olefins and methods of using same
#1068Heat dissipater resilient structure and connector module
#1069Motor driving device
#1070BIOMETRIC SENSOR AND DEVICE INCLUDING THE SAME
#1071Electronic device
#1072Heat dissipation device for an electronic device
#1073Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
#1074ILLUMINATION SYSTEM AND PROJECTION APPARATUS
#1075Electronic assembly with phase-change cooling of a semiconductor device
#1076MOTOR DRIVE DEVICE
#1077Airtight structure
#1078Onboard control device
#1079Liquid discharging apparatus and circuit substrate
#1080Stacked module, stacking method, cooling/feeding mechanism, and stacked module mounting board
#1081Electronic device
#1082Dual connector system
#1083POWER SUPPLY RELAY UNIT
#1084Electronic apparatus
#1085HIGH-FREQUENCY CIRCUIT
#1086DEVICE FOR GENERATING ELECTRICAL ENERGY
#1087Cooling Arrangement For An Electronic Component
#1088Thermally conductive flexible adhesive for aerospace applications
#1089Electronic device for a motor vehicle
#1090Battery including heat dissipation plate and electronic device having the same
#1091System with provision of a thermal interface to a printed circuit board
#1092Power module with cooling system for electronic cards
#1093Device for receiving an electronics assembly
#1094Brushless DC motor power tool with combined PCB design
#1095Electronic apparatus
#1096Desktop electronic device
#1097Desktop electronic device
#1098Symmetrical and orthogonal component design
#1099Image capture assembly and aerial photographing aerial vehicle
#1100Pourous heat sink with chimney
#1101Heat exchanger for an information handling system
#1102PRESSURE LIMITING HEAT SINK
#1103Electrical connector assembly
#1104Electrical connector assembly
#1105Electrical connector
#1106Dual-Chip Package Structure
#1107Thermally-conductive electromagnetic interference (EMI) absorbers positioned or positionable between board level shields and heat sinks
#1108ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS
#1109Heatsink alignment to printed circuit board
#1110Electronic Control Device
#1111Bi-directional heatsink dampening force system
#1112Component with improved heat dissipation
#1113IMMERSION COOLING ARRANGEMENTS FOR ELECTRONIC DEVICES
#1114Microstrip antennas for wireless power transmitters
#1115Efficient heat removal from component carrier with embedded diode
#1116Mobile terminal
#1117Power conversion device
#1118Electronic control unit
#1119Dual-use thermal management device
#1120Electronic device with laterally extending thermally conductive body and related methods
#1121Technologies for performing speculative decompression
#1122REDUCING THERMAL CYCLING FATIGUE
#1123Reducing thermal cycling fatigue
#1124Dynamic heat conducting path for portable electronic device
#1125Method of dynamic thermal management
#1126Electrical connector having a metal member injection molded in a base and side walls of an insulating body
#1127Cooling device, method for producing a cooling device and power circuit
#1128Inverter apparatus
#1129METAL ADDITIVE STRUCTURES ON PRINTED CIRCUIT BOARDS
#1130Method for producing an electronic module assembly and electronic module assembly
#1131Memory device with daughter board fastening structure
#1132Power supply for output of various specifications
#1133Optical device
#1134Electronic device
#1135Back plate and motherboard having the same
#1136System and method for assembling hook type heatsink
#1137Embedding Component in Component Carrier by Component Fixation Structure
#1138Printed circuit board heat dissipation system using highly conductive heat dissipation pad
#1139Device with switchable heat path
#1140Hybrid-type power module having dual-sided cooling
#1141Two-piece solderable shield
#1142Molded photosensitive assembly of array imaging module
#1143Integrated circuit device assembly
#1144Single plate heat radiation device and method
#1145Electronic component with two substrates enclosing functional element and insulating film therein
#1146Connector having increased contact area for power transmission and related power supply
#1147Cooling using adjustable thermal coupling
#1148ELECTRIC DRIVER AND ILLUMINATION DEVICE
#1149Heat dissipating structure
#1150Semiconductor device
#1151Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
#1152Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof
#1153Holder and mobile terminal
#1154Heat sink connector pin and assembly
#1155Mobile terminal and heat dissipation and shielding structure
#1156Torque controlled driver apparatus and method
#1157Electronic device and heat spreader
#1158Cooling mechanism used inside gimbal
#1159Semiconductor device
#1160Package-on-package structure and manufacturing method thereof
#1161LED module with high flame retardant grade
#1162Controller with fan monitoring and control
#1163Controller with enhanced thermal properties
#1164ELECTRONIC BOARD AND ASSOCIATED MANUFACTURING METHOD
#1165Integrated panel level liquid cooling for bus bars
#1166Electronic assembly, in particular for a transmission control module, with attached cooling body
#1167Thermal management structures for optoelectronic modules
#1168Circuit board and method for manufacturing the same
#1169Component vertical mounting
#1170HEAT CONDUCTIVE ALD-COATING IN AN ELECTRICAL DEVICE
#1171Rotary electric machine including rectifying parts and intake parts
#1172Methods of applying thermal interface materials to board level shields
#1173Arrangement and method for electromagnetic shielding
#1174Flipped RF filters and components
#1175Local stress-relieving devices, systems, and methods for electronic assemblies
#1176Component carrier comprising at least one heat pipe and method for producing said component carrier
#1177Control unit
#1178Flexible heat spreader
#1179Assembly
#1180Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
#1181Luminous means having LEDs arranged on fold-out surfaces
#1182Method for manufacturing substrate for power module with heat sink
#1183Control and power module for brushless motor
#1184FIELD DEVICE FOR PROCESS AUTOMATION
#1185Optoelectronic assembly, and method for producing an optoelectronic assembly
#1186Control and power module for brushless motor
#1187Vehicle-mounted power distribution board, electrical junction box, and charging/discharging controller
#1188REACTOR, CONNECTION MEMBER, BOARD MODULE, AND ELECTRIC DEVICE
#1189Printed-circuit board, printed-wiring board, and electronic apparatus
#1190Brushless DC motor power tool with combined PCB design
#1191Matching inclination of cavity sidewall and medium supply device for manufacturing component carrier
#1192Board having electronic element, method for manufacturing the same, and electronic element module including the same
#1193Light emitting module and lighting device having same
#1194Capacitor with improved heat dissipation
#1195PROACTIVE FAN SPEED ADJUSTMENT
#1196Heat sink retention spring clip
#1197Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
#1198SSD internal thermal transfer element
#1199Light emitting device using metal substrate for improving heat dissipation efficiency
#1200Vertical shielding and interconnect for SIP modules