Circuit card cartridge for an electronic system

Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic device

Closed type display apparatus and method of assembling the same

Printed circuit board assembly

Image pickup apparatus

SINGLE BASE MULTI-FLOATING SURFACE COOLING SOLUTION

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

Printed wiring board, electronic device, catheter, and metallic material

Heat dissipating structure and electronic device

STRUCTURE HAVING METAL MATERIAL FOR HEAT RADIATION, PRINTED CIRCUIT BOARD, ELECTRONIC APPARATUS, AND METAL MATERIAL FOR HEAT RADIATION

Heat dissipation apparatus and electronic device including the same

ECU, control box and CFM having the same

Technologies for cooling rack mounted sleds

Technologies for providing power to a rack

Robotically serviceable computing rack and sleds

Thermally efficient compute resource apparatuses and methods

Dynamic memory for compute resources in a data center

Disaggregated physical memory resources in a data center

SUBSTRATE UNIT

Configurable computing resource physical location determination

Technologies for managing the efficiency of workload execution

Technologies for dynamically managing resources in disaggregated accelerators

Technologies for assigning workloads to balance multiple resource allocation objectives

Out-of-band management techniques for networking fabrics

Technologies for managing resource allocation with phase residency data

Techniques to configure physical compute resources for workloads via circuit switching

Technologies for allocating ephemeral data storage among managed nodes

Technologies for predictively managing heat generation in a datacenter

Technologies for dynamic remote resource allocation

Technologies for allocating resources within a self-managed node

Techniques to process packets in a dual-mode switching environment

Technologies for data center multi-zone cabling

Techniques to verify and authenticate resources in a data center computer environment

Techniques to support multiple interconnect protocols for a common set of interconnect connectors

Technologies for a low-latency interface to data storage

Technologies for dynamic allocation of tiers of disaggregated memory resources

Technologies for assigning workloads based on resource utilization phases

Technologies for performing partially synchronized writes

Storage sled and techniques for a data center

Accelerator resource allocation and pooling

Memory sharing for physical accelerator resources in a data center

Technologies for blind mating for sled-rack connections

Method for manufacturing a printed circuit board element and printed circuit board element

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Chip packaging and composite system board

System and method for maintaining efficiency of a heat sink

Electrical device heat dissipation structure

Rollable display device

Printed circuit board for integrated LED driver

Photovoltaic junction box

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Manufacturing method of a molded photosensitive assembly of an array imaging module

Electrical device, model series of electrical devices, and production method

Board level shields with adjustable covers

Electronic device and method for producing an electronic device

ONBOARD CONTROL APPARATUS

POWER MODULE AND METHOD OF MANUFACTURING THE SAME

Active heatsink lid

Method of manufacturing a circuit device

Component mounting device head unit

Information processing device and cooling unit

Low-cost superior performance coinless RF power amplifier

Optical module

Heat exchanger including passageways

Electronic apparatus and heat dissipation and EMI shielding structure thereof

Regulator rectifier device and a method for regulating an output voltage of the same

Circuit assembly and method for manufacturing same

Information processing apparatus

Electronic unit

Single reflow power pin connections

SEMICONDUCTOR DEVICE AND MOTOR APPARATUS

Input/output module baffle and motherboard with the same

Bridge leg circuit assembly and full-bridge circuit assembly

COMBINED ENERGY DISSIPATION APPARATUS AND METHOD

Lighting-means carrier for a strip-lighting luminaire

Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms

Wickless capillary driven constrained vapor bubble heat pipes for application in display devices

Graphene Based Conformal Heat Sink and Method Therefor

Wickless capillary driven constrained vapor bubble heat pipes for application in rack servers

MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LEADFRAMES FOR COMPONENT-ON-PACKAGE CIRCUITS

Electricity storage unit

High powered RF part for improved manufacturability

Power-module substrate with cooler and method of producing the same

Sterilizable optical mouse

Computer internal architecture

Immersion cooling arrangements for electronic devices

High heat-dissipation circuit board assembly system and power supply including the same

Power conversion apparatus

Electronic device

Systems and methods for thermal management for high power density EMI shielded electronic devices

Electronic device, and electronic structure provided with electronic device

Circuit structure, electrical junction box, and spacer

PRINTED CIRCUIT BOARD

Compliant Pin Fin heat sink with base integral pins

Heat radiation shielding device

Methods and systems for dissipating heat in optical communications modules

Memory heater and heating aid arrangement

ELECTRONIC DEVICE AND METHOD OF ASSEMBLING SUCH A DEVICE

Fixation of heat sink on SFP/XFP cage

Electronic component and manufacturing method therefor

HEAT SINK WITH A LOAD SPREADING BAR

Brushless DC motor power tool with combined PCB design

Light emitting package having a guiding member guiding an optical member

Computer internal architecture

Circuit board and display device

Multi-layer cooling element

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Gimbal

Shield can assembly and electronic device having the same

Electronic circuit board assembly including EMI shielding structure and thermal pad

Circuit board and manufacturing method thereof

High performance compliant substrate

METHOD OF MANUFACTURING ELECTRONIC UNIT

CIRCUIT CARD ASSEMBLY (CCA) WITH REDUCED SUSCEPTIBILITY TO DEFORM UNDER LOADING

Water cooling system

Electronic component mounting structure

Heat-dissipation and shielding structure and communications product

Printed board and method for manufacturing same

Device with top-side base plate

Aluminum-silicon carbide composite and production method therefor

Electronic component having a connection element

Cooling mechanism of high mounting flexibility

Heat sink with integrated threaded lid

Methods of manufacturing flexible printed circuit boards

Vapor chamber amplifier module

Display device

Automotive vehicle lighting device with electrical connection circuit board connected to substrate by anisotropic conductive film

COOLING MECHANISM OF HIGH MOUNTING FLEXIBILITY

Thermoelectric cooling module

Single base multi-floating surface cooling solution

Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boards

Layered Thermal Spreader

BOLSTER PLATE

Switching circuit including wire traces to reduce the magnitude of voltage and current oscillations

Electronic module and method for forming package

Rigid-flex assembly for high-speed sensor module comprising a flexible wiring section with dual flexible strips stacked and attached together

Hydrofluoroether olefins and methods of using same

Integrated circuit device assembly

Plug connecetor with a metallic enclosure having heat sink member thereon

Electronic device heat transfer system and related methods

SHIELD COVER AND ELECTRONIC APPARATUS

Formable shielding film

ELECTRONIC CIRCUIT BOARD SHIELDING WITH OPEN WINDOW HEAT TRANSFER PATH

Sliding thermal shield

Systems, methods and devices for a package securing system

Method of fabricating an electrical filter for use with superconducting-based computing systems

COOLING DEVICE

CONDUCTIVE HEAT SINK-WELDED PCB APPARATUS, CONDUCTIVE HEAT SINK AND WELDING METHOD THEREOF

Power distribution connector with thermally conductive polymer heat sink

Heatsink providing equivalent cooling for multiple in-line modules

Electronic power module, electronic architecture comprising same, voltage converter and electric machine comprising same

Circuit board and display device having the same

Circuit card assembly including heat transfer assembly and method of manufacturing such

EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THEREOF AND ELECTRONIC MEMBER

Apparatus for positioning heat sink

Wire retention cover for printed circuit boards in an electronic device

Production method of electronic component board with uncut portions for heat radiating portions

Flexible-to-rigid tubing

Circuit assembly, connected busbar structure, and electrical junction box

Display device

Blower fan cooling system

Flexible-to-rigid tubing

Flexible-to-rigid tubing

System and method for thermal management of electronic devices

Circuit card assembly and method of providing same

Circuit board

Converter module, transformer module and circuit thereof

Holder and mobile terminal

Heat radiation adhesive, heat radiation sheet using same, and electronic device having same

HEAT DISSIPATION MEMBER AND PRINTED CIRCUIT BOARD HAVING THE SAME

ELECTRONIC DEVICE EQUIPPED WITH A HEAT SINK

LED lighting assemblies with thermal overmolding

Display mirror assembly incorporating heatsink

Circuit board and arrangement with a circuit board

Adhesive agent and connection structure

HEAT CONDUCTIVE PLASTIC RADIATOR AND COMMUNICAITON DEVICE

Latch device for heat dissipation unit

INTEGRATED HEAT SPREADER AND EMI SHIELD

LAYERED AIRFLOW COOLING FOR ELECTRONIC COMPONENTS

Printed circuit board clip

Display device

Receptacle assembly and module assembly

Package integrated synthetic jet device

Package integrated synthetic jet device

Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer

Thermal interface materials including electrically-conductive material

Conformable thermal bridge

Printed circuit board and electronic apparatus

ELECTRONIC TERMINAL EQUIPMENT AND METHOD FOR ASSEMBLING SAME

Method for producing a circuit board and circuit board

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Electronics assembly with interference-suppression capacitors

Graphite thermal conductor, electronic device and method for manufacturing graphite thermal conductor

Heat dissipation for substrate assemblies

Embedded venting system

Electronic power module with enhanced thermal dissipation and manufacturing method thereof

Electronic apparatus and method for fabricating the same

Circuit assembly and electrical junction box

Electronic device including multiband antenna

Electronic device having wireless power transmitting/receiving conductive pattern

Circuit assembly and electrical junction box

Electronic circuit device and heat sink structure for the same

Dual Layer Shielding Cover and Terminal

Heat pipe embedded heat sink with integrated posts

Circuit board and method for manufacturing the same

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

HEAT DISSIPATION STRUCTURE

Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding

Modular power supply and method for manufacturing the same

Thermoelectric device cooling system

PCB current track cooling in electrical climate compressors

Double insulated heat spreader

Fan Carrier Apparatus

Embedding an integrated venting system into a printed circuit board

Circuitized structure with 3-dimensional configuration

Circuitized structure with 3-dimensional configuration

Flexible substrate

Power conversion device

Power supply system

Welding system with potted circuit board and method of making thereof

Method of joining cooling component

Electronic apparatus and method for fabricating the same

Switching board

Heatsink and circuit board with heatsink

HEAT DISSIPATION DEVICE FOR ELECTRONIC SYSTEM

Molding type power module

Circuit board and method of manufacturing the same

Reed relay

Dual purpose press-bar and heat sink for high data transfer integrated circuit card reader

Computer internal architecture

Thermally conductive flexible adhesive for aerospace applications

COOLING JACKET AND ELECTRONIC DEVICE HAVING THE SAME

Heat sink for a square camera

Circuit board and method of manufacturing the same

Back-to-back solid state lighting devices and associated methods

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Cooling arrangement for computer system

ELECTRONIC DEVICE

Techniques for implementing a synthetic jet to cool a device

PACKAGING METHOD FOR VERY HIGH DENSITY CONVERTERS

Brushless DC motor power tool with combined PCB design

Package integrated synthetic jet device

ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES

L-bending PCB

Heat dissipation structure for connector module

Computer housing

Printed board and electronic apparatus

Circuit substrate with embedded heat sink

Electronic unit having heat dissipating device, method for fabricating electronic unit and projector having electronic unit

COMBINED ELECTROMAGNETIC SHIELD AND THERMAL MANAGEMENT DEVICE

Composite heat sink device for cooling of multiple heat sources in close proximity

PRINTED CIRCUIT BOARD

Electronic equipment with double cooling

LED-based illumination systems having sense and communication capability

Electronic apparatus and camera device thereof

Control apparatus and tunable filter apparatus

LED substrate with electrical connection by bridging

Heatsink alignment to printed circuit board

System with stepped three dimensional profile and venting

Printed circuit board and method of fabricating the same

Electronic control unit

Electronic control unit

Electronic unit

Electronic control unit

Electronic device including an externally-mounted heat pipe

Cooling device and device

Computer internal architecture

Integrated power electronics assembly module

Printed circuit board structure

Device and a cooling structure

COOLING DEVICE AND COOLING DEVICE OF ELECTRONIC APPARATUS USING MIXED WORKING FLUID

Power conversion apparatus

LED lighting assemblies with thermal overmolding

Unit device

Electronic device

A HEAT DISSIPATING ENCLOSURE WITH INTEGRATED COOLING FINS

Manufacturing electronic package with heat transfer element(s)

Electronic package with heat transfer element(s)

Light emitting package having a guiding member guiding an optical member

Electric module, electrical system comprising such an electric module, and corresponding production methods

Power converter

Waterproof component-suppressing electronic control device

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Hybrid circuit device

Electronic apparatus and method for fabricating the same

Method of manufacturing an alectronic circuit

Electronic apparatus capable of efficient and uniform heat dissipation

Flexible substrate

Light emitting device including a metal substrate for high heat dissipation and increased light efficiency

Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate

Arrangement and method for electromagnetic shielding

Systems and methods for combined thermal and electrical energy transfer

Mounting plate apparatus, systems, and methods

Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part

Device for dissipating heat from at least one electronic component

Method of manufacturing a circuit device

Wiring substrate and manufacturing method thereof

Multi-layer heat spreader assembly with isolated convective fins

Thermal switches for active heat flux alteration