SMALL-SIZED COMMUNICATION MODULE PACKAGE

STACKED MULTILAYER CAPACITOR

CHIP EMBEDDED PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF

Package for light emitting device with metal base to conduct heat

Printed circuit board provided with heat circulating medium and method for manufacturing the same

Mounting Assembly for Optoelectronic Devices

Die module system

System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards

Light source module with high heat-dissipation efficiency

Carrier For Electrical Components With Soldered-On Cooling Body

Underfill film having thermally conductive sheet

PACKAGE STRUCTURE FOR LIGHT-EMITTING ELEMENTS

Equipped flexible electronic support, supporting at least one light emitting diode, and the associated manufacturing method

Electrical circuit assembly for high-power electronics

Printed circuit board and electronic apparatus

Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate

Flexible LED array

Electronic component package and manufacturing method thereof

Low profile flip chip power module and method of making

Electric device having first and second electric elements

Thermal management system for computers

Printed circuit boardc structure

Small form factor power supply

Printed circuit board having vertical heat dissipating element

Mounting device for high frequency microwave devices

Substrate mounted with electronic element thereon

Method and system for extracting heat from electrical components

Method for manufacturing an antenna

Printed circuit board

Illumination device with semiconductor light-emitting elements

Low thermal resistance high power LED

LED light engine with applied foil construction

Light emitter assembly

Circuit device

Electric Power Module

Thermally Conductive Low Profile Bonding Surfaces

Circuit device and method of manufacturing the same

CIRCUIT BOARD WITH REGIONAL FLEXIBILITY

Multi-chip module with power system

Backlight unit and liquid crystal display device including the same

Method and apparatus for using light emitting diodes for the treatment of biological tissue

High capacity thin module system

METHOD OF MANUFACTURING LIGHT SOURCE UNIT, BACKLIGHT UNIT INCLUDING THE LIGHT SOURCE UNIT, AND LIQUID CRYSTAL DISPLAY INCLUDING THE BACKLIGHT UNIT

Motherboard configured to minimize or prevent damage to a chip thereon

Multi-Chip Module (MCM) of a Computer System

HEAT TRANSFER FOR A HARD-DRIVE PRE-AMP

Electrical circuit assembly for high-power electronics

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING

Electronic controller

Underfill film having thermally conductive sheet

Flexible circuit light-emitting structures

Mounting arrangement for light emitting diodes

Method for soldering charge coupled device and tooling thereof

Light emitting module, lighting device, and display device

High density electronic packages

High capacity thin module system and method

High capacity thin module system and method

Multi-layered printed circuit board

STAGGERED MEMORY LAYOUT FOR IMPROVED COOLING IN REDUCED HEIGHT ENCLOSURE

Light-emitting heat-dissipating device and packaging method thereof

Illumination device

LED assembly and use thereof

Power supply equipment with matching indicators on converter and connector adapters

High density memory module using stacked printed circuit boards

Interconnection system between CPU and voltage regulator

Method for producing an organic substrate with integral thermal dissipation channels

Magnetic device

Encapsulated multi-phase electronics heat-sink

Switching power supply utilizing switch-selectable resistors to determine output voltage

Electrical connection box

Circuit board and electrical connection box having the same

Circuit Assembly and Method of its Manufacture

Optically coupled semiconductor device and electronic device

Base of a circuit board with a heat dissipating capability

Motor controller

Lighting Device And Method

Non-Covalent Bonding Agent for Carbon Nanotube Reinforced Polymer Composites

Pressing mechanism for LED chip

Method of making wirebond electronic package with enhanced chip pad design

Airflow guides using silicon walls/creating channels for heat control

Thermal management of LED-based lighting systems

Circuit device

Memory module

Circuit device

Electronic circuit device

Bendable solid state planar light source structure

Printed circuit board having metal core

Light source and liquid crystal display device using the same

Encapsulation and methods thereof

LED illumination assembly with compliant foil construction

Structure for integrating LED circuit onto heat-dissipation substrate

Liquid crystal display device and method of making the same

Printed circuit board and method of use thereof

Hybrid composite material substrate

Attachment of a QFN to a PCB

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM

Circuit board arrangement including heat dissipater

Modular heat-radiation structure and controller including the structure

Light-emitting diode arrangement with heat dissipating plate

Underfill film having thermally conductive sheet

Package module with alignment structure and electronic device with the same

LED lighting assemblies with thermal overmolding

Illumination system for use with display signage

Method of cooling electronic device and electronic device with improved cooling efficiency

Thin module system and method

Buffered Thin Module System and Method

BACKLIGHT MODULE

Method for making stacked integrated circuits (ICs) using prepackaged parts

Lighting Device And Method

CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Heat spreaders with vias

Printed circuit board with a heat dissipation device

MULTICOMPONENT FIBER COMPRISING A PHASE CHANGE MATERIAL

Heat-generating electronic part cover and cover mounting method

LED light source module with high efficiency heat dissipation

Chip embedded packaging structure

Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener

System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards

Process for manufacturing an LED lamp with integrated heat sink

Light emitting assembly

Electronic ultimate defects analyzer detecting all defects in pcb/mcm

Mounting arrangement for light emitting diodes

Circuit board and light souce device having same

System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards

Circuit board and arrangement for minimizing thermal and electromagnetic effects

LED array module

Technique for manufacturing an overmolded electronic assembly

Backlight unit

Heat spreader for use with light emitting diode

Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same

Technique for manufacturing an overmolded electronic assembly

Light source module

High-power LED lamp having heat dissipation assembly

Component mounting board structure and production method thereof

Heat sink arrangement for electrical apparatus

Through-hole arrangement for a ball grid array package

Electronic device package with an integrated evaporator

Wiring board

Printed circuit board structure and manufacturing method thereof

Power supply for simultaneously providing operating voltages to a plurality of devices

Programmable power supply

Programmable power supply

Electronic circuit apparatus

Programmable power supply

Programmable power supply

Integrated circuit package

Microchannel structure and manufacturing method therefor, light source device, and projector

Modified core for circuit module system and method

DIRECT TYPE BACKLIGHT MODULE

Thermal management apparatus and method for a circuit substrate

Thermally conductive adhesive composition and process for device attachment

Arrangement and method for cooling a power semiconductor

Multi-processor module with redundant power

Redundant power beneath circuit board

Integral molded heat sinks on DC-DC converters and power supplies

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

Cooling apparatus, system, and associated method

Heat dissipating arrangement for an electronic appliance

Intelligent high-power amplifier module

Semiconductor device and manufacturing method therefor

Processor module for system board

Automobile led light

Light emitting diode indoor lamp

Processor module with thermal dissipation device

Systems to cool multiple electrical components

Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module

Flex circuit constructions for high capacity circuit module systems and methods

Circuit component module, electronic circuit device, and method for manufacturing the circuit component module

Semiconductor device and method of fabricating the same

Designated MOSFET and driver design to achieve lowest parasitics in discrete circuits

Semiconductor device with improved heat dissipation

LED lamp with LEDs on a heat conductive post and method of making the LED lamp

Multi-chip module with power system

Redundant power for processor circuit board

Apparatus and method for multiprocessor circuit board

Illumination assembly using circuitized strips

Stepped integrated circuit packaging and mounting

Electronic part-mounted substrate, thermal conductive member for electronic part-mounted substrate and liquid-jetting head

High capacity thin module system

Circuit module with thermal casing systems

Modular mounting arrangement and method for light emitting diodes

Magnetic attachment method for LED light engines

Optoelectronic transceiver

LED luminance enhancing construction

Thin module system and method

Die module system

Buffered thin module system and method

Thin module system and method

Thin module system and method

Optimized mounting area circuit module system and method

High capacity thin module system and method

Thin module system and method with thermal management

Thin module system and method with skew reduction

Module thermal management system and method

Thin module system and method

Minimized profile circuit module systems and methods

Electronic module with conductive polymer

High density memory module using stacked printed circuit boards

IC package with power and signal lines on opposing sides

Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus

Printed circuit board having cooling means incorporated therein

Substrate mounted with electronic element thereon and liquid ejection head including the substrate

Power semiconductor package having integral fluid cooling

System and method for installing a tamper barrier wrap in a PCB assembly, including a PCB assembly having improved heat sinking

Engine control circuit device

Surface-mountable light-emitting diode and/or photodiode and method for the production thereof

Mounting substrate and driving device using same

Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management

Interposer structure and method

Thermally improved placement of power-dissipating components onto a circuit board

Device comprising a circuit arrangement with an inductive element

Programmable power supply

Circuit device and manufacturing method thereof

Circuit board with high density power semiconductors

LED assembly with reverse circuit board

Method, system and device for delivering phototherapy to a patient

Semiconductor device and hybrid integrated circuit device

Light emitting apparatus

Thermal dissipating capacitor and electrical component comprising same

Thermal dissipating capacitor and electrical component comprising same

ATCA integrated heatsink and core power distribution mechanism

Multi-substrate circuit assembly

Electronic device

Light emitting diode light source

Heat dissipating pin structure for mitigation of LED temperature rise

Heatsink

Optical communications module

Method for bonding ceramic to copper, without creating a bow in the copper

System and method for installing a tamper barrier wrap in a PCB assembly, including a PCB assembly having improved heat sinking

Method and apparatus for using light emitting diodes for curing

Stack up assembly

Drive circuit device and motor having the same

Semiconductor module

Hybrid illuminator

Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board

STRUCTURE OF WAFER LEVEL PACKAGE WITH AREA BUMP

Method for forming an electronic assembly

Semiconductor device and method of fabricating the same

Modular mounting arrangement and method for light emitting diodes

Copper paste and wiring board using the same

System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards

Method of manufacturing heat conductive substrate

Mounting device for high frequency microwave devices

Programmable power supply

Power supply packaging system

Stack up assembly

Stack up assembly

Actuation membrane for application to a card slot of a system

Space saving surface-mounted inductors

Light-emitting diode (LED) with amorphous fluoropolymer encapsulant and lens

Printed circuit board with integrated axial flux motor cooling apparatus

Coolant flow control

Helmet mount with accessories

Integrated cooling assembly with upper and lower channels

High-temperature resistant solid-state relay

Liquid cooling assembly for electronic components on printed circuit boards and computing device including same

LIDAR system and manufacturing method having semiconductor-based optical components coupled together with solder

Pressure relief valve and adsorbent chamber for two-phase immersion cooling systems and methods for using same

Flexible circuit board and heat spreader thereof

LED lighting element and method of manufacturing same

Heatsink with vapor chamber and pedestal

Apparatus, system, and method for increasing the cooling efficiency of cold plate devices

PCB for bare die mount and process therefore

LED light driver

Thermal management assemblies for electronic assemblies circumferentially mounted on a motor

Illumination apparatus having thermally isolated heat sinks and dual light sources

Flexible elastic thermal bridge for electronic subassemblies with variable gaps between components and enclosures

Cable connector assembly for an integrated circuit assembly

Superconducting computing system in a liquid hydrogen environment

Networking cards with increased thermal performance

Antenna assembly for a vehicle

Memory module cooling

Thermal module mounting structure

Apparatus, system, and method for improved cooling of computing components with heatsinks

Luminous fan

Solid state drive device and computer server system including the same

Rugged digital mass storage device

LED lighting element and method of manufacturing same

Antenna assembly for a vehicle

Heating-cooling module

Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates

Integrated card-guide adapter heat sink

Air-cooled heat exchanger and thermal arrangement for stacked electronics

Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node

Stacked base heat sink with heat pipes in-line with airflow

Liquid-cooled integrated circuit system

Display with integrated graphite heat spreader and printed circuit board insulator

Liquid chamber housings

Dual dynamic random (DDR) access memory interface design for aerospace printed circuit boards

Wave absorbing heat dissipation structure

Printed circuit board based RF circuit module

Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node

Electronic device display with a backlight

Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger

Hard disk drive backplane for immersion-cooled circuit board

Sealable multi-surface electronics thermal conduction package

Apparatus, system, and method for increasing the cooling efficiency of cold plate devices

LED lighting element and method of manufacturing same

Heat management in wireless electronic devices

Light guide heat dissipation module and electronic device