Control circuit apparatus and endoscope apparatus

CIRCUIT BOARD WITH THERMALLY CONDUCTIVE LAYERS AND MANUFACTURING METHOD THEREFOR

Device mounting board, cell, and battery module

Display devices, and display and electronic systems including the display devices

Light-emitting element mounting package, light-emitting element package, and method of manufacturing these

Light Emitting System

Portable computing device with thermal management

LED lighting module for vehicle headlight

HEAT DISTRIBUTION STRUCTURE, MANUFACTURING METHOD FOR THE SAME AND HEAT-DISSIPATION MODULE INCORPORATING THE SAME

LED PACKAGE MODULE

LED module and method of bonding thereof

COMPLEMENTARY CONFIGURATION OF MOUNTED LIGHT SOURCES

Methods and apparatus for reducing size and costs of motor controllers for electric motors

Lighting apparatus

Lead frame, wiring board, light emitting unit, and illuminating apparatus

CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE

METHOD AND APPARATUS FOR CONNECTING INLAID CHIP INTO PRINTED CIRCUIT BOARD

HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME

Thermal management for handheld projectors

Circuit board mount for LED light

Thermal management system and method

Solid state disk assembly

SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM IN PACKAGE

Modular lighting system and method employing loosely constrained magnetic structures

VEHICLE-MOUNTABLE JUNCTION BOX, AND CIRCUIT MEMBER AND CIRCUIT UNIT USABLE FOR THE VEHICLE-MOUNTABLE JUNCTION BOX

Device for screening an electronic module

SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM IN PACKAGE

Ceramic elements module

HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

LED LIGHT BAR

Light emitting package

Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate

Three-dimensional LED substrate and LED lighting device

MULTICHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COMPONENT WITH PINS AND FIXED ON CIRCUIT BOARD

Circuit board device and manufacturing method thereof and power supply having the circuit board device

Circuit board with thermo-conductive pillar

LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LED PACKAGE

Heat dissipating high power systems

LED device, method of manufacturing the same, and light-emitting apparatus

Light emitting diode carrier

Metal core board for vehicle-mountable junction box

METHOD FOR MANUFACTURING AN LED LIGHT ENGINE WITH APPLIED FOIL CONSTRUCTION

Mounting arrangement and method for light emitting diodes

Heat dissipation device for LED lamp

Metal core printed circuit board and electronic package structure

Media content device with customized panel

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Mounting structure for solid state light sources

Method for manufacturing a substrate supporting an integrated circuit chip

PCB WITH HEAT DISSIPATION STRUCTURE AND PROCESSING METHODS THEREOF

Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same

High pin count, small SON/QFN packages having heat-dissipating pad

Illumination device with semiconductor light-emitting elements

Circuit assemblies including thermoelectric modules

Systems and methods providing thermal spreading for an LED module

Electronic package with thermal interposer and method of making same

SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE

LIGHTING DEVICE AND METHOD FOR FORMING THE SAME

Method of Making a Low Profile Flip Chip Power Module

Light emitting package

System and method for integrated waveguide packaging

Molded Interconnect Device (MID) with Thermal Conductive Property and Method for Production Thereof

Flexible circuit assemblies with stacked flex interconnects and connector assemblies having the same

Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method

Chip-type LED and method of manufacturing the same

LED ENERGY-SAVING LAMP

Bendable luminous modules and method for producing bendable luminous modules

ELECTRONIC APPARATUS, METHOD FOR MOUNTING A DEVICE, AND OPTICAL COMMUNICATION APPARATUS

Controlled power dissipation in a lighting system

Controlled power dissipation in a link path in a lighting system

Thermal management in a lighting system using multiple, controlled power dissipation circuits

SOLID STATE LIGHTING DEVICE WITH AN INTEGRATED FAN

Display apparatus

Heat radiating substrate and method of manufacturing the same

LED luminaire

Electronic part and connection structure of the electronic part

Circuit device and method of manufacturing the same

Method of manufacturing a lighting assembly with thermal overmolding

LED lighting assemblies with thermal overmolding

Monolithic microwave integrated circuit

LIGHT-EMITTING DIODE PACKAGE

Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material

Back-to-back solid state lighting devices and associated methods

Flexible-to-rigid tubing

Printed circuit board and method for fabricating the same

Manufacturing method of printed circuit board embedded chip

LED unit

Circuit board and manufacturing method thereof

CIRCUIT BOARD

Optical interconnects in cooling substrates

Circuit device and method of manufacturing the same

Lid for an electrical hardware component

Heat transfer for a hard-drive pre-amp

Light emitting device module and lighting system including the same

Light emitting module

Compact inverter

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE

METHOD FOR FORMING CIRCUIT PATTERNS ON SURFACE OF SUBSTRATE

Solid state lighting device and method employing heat exchanger thermally coupled circuit board

Apparatus for Use Downhole Including Devices Having Heat Carrier Channels

Heat-radiating substrate and method of manufacturing the same

HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Solder and lead free electronic circuit and method of manufacturing same

Wiring substrate and manufacturing method thereof

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Heat sink

Backlight module and display device with two-sided light emitting structure

Methods of forming and utilizing rutile-type titanium oxide

Cooling jacket and electronic device having the same

Electric device mounted in electric compressor

Package for light emitting device

Package for light emitting device

Electronic component assembly comprising a varistor and a semiconductor component

ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES

Illumination device with heat dissipation structures

PRINTED CIRCUIT BOARD COMPONENTS FOR ELECTRONIC DEVICES

LED lamp circuit

Electronic device and latching mechanism thereof

CIRCUIT MODULE

SUBSTRATE FOR LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE

METHOD OF MANUFACTURING AN LED ILLUMINATOR DEVICE

High-density integrated circuit module structure

OPTO-ELECTRONIC MODULE WITH IMPROVED LOW POWER, HIGH SPEED ELECTRICAL SIGNAL INTEGRITY

Modular LED lamp and manufacturing methods

Illumination source and manufacturing methods

Thermal interface material design for enhanced thermal performance and improved package structural integrity

hBN INSULATOR LAYERS AND ASSOCIATED METHODS

Storage device and electronic apparatus

Mobile terminal

Illumination device with semiconductor light-emitting elements

LIGHT SOURCE MODULE

Electromagnetic interference shield with integrated heat sink

LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME

Backlight unit and liquid crystal display having the same

Heat-release configuration, bracket for supporting heat-release plate and method of assembling heat-release configuration

LED lighting apparatus

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

Underfill film having thermally conductive sheet

Apparatus and method for embedding components in small-form-factor, system-on-packages

Package for light emitting device

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

ELECTRONIC MODULE

Thermally optimised LED chip-on-board module

Sectionally covered light emitting assembly

Module having at least two surfaces and at least one thermally conductive layer therebetween

Card-type peripheral apparatus

COOLING ARRANGEMENT

Method of making a liquid crystal display device having a heat dissipation pattern

Package substrate

Method for low temperature bonding of electronic components

HYBRID CHIP-ON-HEATSINK DEVICE AND METHODS

RADIANT HEAT STRUCTURE FOR PIN TYPE POWER LED

Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive Sheets

Rigid-flexible circuit board and method of manufacturing the same

System to improve an in-line memory module

Distributed LED-based light source

Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond

LIQUID CRYSTAL DISPLAY APPARATUS AND BACK LIGHT APPARATUS

MOUNTING STRUCTURE

Thermal management of LED-based lighting systems

LED PACKAGE STRUCTURE FOR FORMING A STUFFED CONVEX LENS TO ADJUST LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME

Method for manufacturing a ceramic elements module

Resistor device

LED retrofit for miniature bulbs

Light emitting package having screen layer

ELECTRONIC APPARATUS AND REINFORCING COMPONENT

HEAT DISSIPATION STRUCTURE OF A LED LIGHT

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOLING MEMBER AND METHOD OF MANUFACTURING THE SAME

SOLID STATE LIGHTING DEVICE WITH AN INTEGRATED FAN

Circuit board structure having measures against heat

CIRCUIT BOARD FOR MULTI-TYPE HEAT DISSIPATING DEVICES

Electronic component module

Semiconductor device with high density optical chips and manufacturing method thereof

Process for manufacturing LED lighting with integrated heat sink

PRINTED CIRCUIT BOARD UNIT

METHOD AND APPARATUS FOR USING LIGHT EMITTING DIODES

Method and apparatus for using light emitting diodes

Vehicular light source unit

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENT MOUNTING METHOD

Thermoelectric feedback circuit

Metal-based print board formed with radiators

Illumination device with semiconductor light-emitting elements

Package Structure for Solid-State Lighting with Low Thermal Resistance

LED lamp assembly

Light emitting diode module and back light assembly

Flexible light source device and fabrication method thereof

Chassis base and plasma display apparatus having the same

Electrical connector and heat sink

Electronic component mounting module and electrical apparatus

Thermally conductive structure of LED and manufacturing method thereof

Switching circuit layout with heatsink

Mount board and semiconductor module

COMPONENT HAVING A CERAMIC BASE THE SURFACE OF WHICH IS METALIZED

Module having at least two surfaces and at least one thermally conductive layer therebetween

POWER SUPPLY APPARATUS

Power supply equipment for simultaneously providing operating voltages to a plurality of devices

Method and apparatus for embedded battery cells and thermal management

Light-emitting module and illuminating apparatus having an insulating base having a plurality of insulating layers

ELECTRONIC DEVICE-MOUNTED APPARATUS AND NOISE SUPPRESSION METHOD FOR SAME

Component having a ceramic base with a metalized surface

Mounting arrangement and method for light emitting diodes

Electronic circuit device

Light source module and display apparatus having the same

LIGHTING APPARATUS HAVING LIGHT EMITTING DIODES FOR LIGHT SOURCE

Light emitting module, lighting device and display device

Printed circuit board

LIGHTING DEVICE

Method of manufacturing a wiring board

LED APPARATUS AND THE PCB THEREOF

Bonded metal and ceramic plates for thermal management of optical and electronic devices

Mounting structure and electronic equipment

Microheat exchanger for laser diode cooling

Substrate structure

THERMALLY CONDUCTIVE POLYMER BASED PRINTED CIRCUIT BOARD

Electronic Component Mounting Board and Method for Manufacturing Such Board

Printed circuit board and electronic apparatus

LED module having a heat sink

Printed circuit board assembly

Printed circuit board embedded chip and manufacturing method thereof

Backlight device and display device using the same

Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method

Printed Circuit Board With Additional Functional Elements, Method of Production and Use

Method of manufacturing bendable solid state lighting

PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS

LED lamp module and fabrication method thereof

Thermal management of LED-based lighting systems

Semiconductor device and multilayer wiring board

LED LIGHT SOURCE UNIT

LED illumination assembly with compliant foil construction

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Camera unit

Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board

Electronic component, illuminating device, contact-type image sensor, and image reading device having no short circuit condition achieved by allowing only one electrode of an LED chip in direct contact with a metallic substrate

Solar-To-Electricity Conversion System Using Cascaded Architecture of Photovoltaic and Thermoelectric Devices

Method for Solar-To-Electricity Conversion

Solar-To-Electricity Conversion System

Solar-To-Electricity Conversion Sub-Module

Heat sink arrangement for electrical apparatus

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING

Display device and a television receiver having the same

Electrical power tools

Method of manufacturing an electrically driven LED lamp assembly

Thermal interface material design for enhanced thermal performance and improved package structural integrity

System and method for integrated waveguide packaging

Printed circuit board and method of manufacturing the same

METHOD OF CONNECTING A SERIES OF INTEGRATED DEVICES UTILIZING FLEXIBLE CIRCUITS IN A SEMI-STACKING CONFIGURATION

Multileveled printed circuit board unit including substrate interposed between stacked bumps

Arrangement comprising a shunt resistor and method for producing an arrangement comprising a shunt resistor

THERMAL MANAGEMENT SYSTEMS AND METHODS

Wiring substrate

Imaging device unit and imaging apparatus

LIGHT SOURCE MODULE AND METHOD FOR MANUFACTURING SAME

Circuit board and image display apparatus

Circuit device and method of manufacturing the same

Semiconductor device including main substrate and sub substrates

Light unit and display device having the same

Electronic-component-mounting board

Multi-phase voltage regulation module

Warpage preventing substrates

PRINTED WIRING BOARD AND ELECTRONIC APPARATUS

CO-FIRED CERAMIC MODULE

LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME

Arrangement with an assembly and a mounting rack

Electronic control device using LC module structure

Carrier body for components or circuits

ELECTRICAL CONNECTING APPARATUS

THIN CIRCUIT MODULE AND METHOD

Luminous module and method for producing it

Electronic device

Arrangement for heat dissipation

Planar heat pipe for cooling

Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module

Heat-dispensing structure for the led's lamp

Electronic device and method of forming same

Circuit module with thermal casing systems

Photocontrol devices and methods for forming the same

Lighting apparatus with LEDs

Heat sink for a high capacity thin module system

Heat radiation package and semiconductor device

High power light emitting diode

Metal base circuit board, LED, and LED light source unit

Dual cavity, high-heat dissipating printed wiring board assembly

Device and method for determining the temperature of a heat sink

Electric heating device, in particular for motor vehicles

Motherboard

Chip-type LED having an insulating substrate in which a first concave hole and a second concave hole are formed

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

RECOVERABLE ELECTRONIC COMPONENT

High density module having at least two substrates and at least one thermally conductive layer therebetween

Electronic apparatus and flexible wiring member

Printed circuit board, memory module having the same and fabrication method thereof

INTERCONNECT DEVICE WHICH FORMS A HEAT SINK AND ELECTRICAL CONNECTIONS BETWEEN A HEAT GENERATING DEVICE AND A POWER SOURCE

Method of manufacturing an interconnect device which forms a heat sink and electrical connections between a heat generating device and a power source

Method of assembly to achieve thermal bondline with minimal lead bending

ELECTRONIC COMPONENT BUILT-IN MODULE AND METHOD FOR MANUFACTURING THE SAME

Printed wiring board assembly, method of mounting components on printed wiring board and electronic apparatus

COMMUNICATION MODULE PACKAGE ASSEMBLY