High speed interface design

Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias

OPTIMIZATION OF THROUGH PLANE TRANSITIONS

Circuit substrate and method of manufacturing plated through slot thereon

Die pad arrangement and bumpless chip package applying the same

Flexible print cable having alternating signal and ground conductors and connector for the same

Electrical conductor for signal transmission

Crosstalk reduction in electrical interconnects using differential signaling

Signal transmission structure, circuit board and connector assembly structure

Impedance controlled via structure

Signal transmission structure, circuit board and connector assembly structure

Memory module with a predetermined arrangement of pins

Matched-impedance surface-mount technology footprints

Orthogonal backplane connector

Routing vias in a substrate from bypass capacitor pads

Signal transmission structure having alignment hole for coaxial cable connector

Method of making circuitized substrate with signal wire shielding

High frequency multilayer circuit structure and method for the manufacture thereof

Differential signal connector with wafer-style construction

Low impedance test fixture for impedance measurements

Grounded interleaved flex for ultrasound transducer array

Tile-based routing method of a multi-layer circuit board and related structure

High frequency signal transmission line having ground line blocks to reduce noise

Electrical connector with horizontal ground plane

Printed circuit board having a bond wire shield structure for a signal transmission line

connection arrangement for micro lead frame plastic packages

Circuit layout structure and method

Wiring board having connecting wiring between electrode plane and connecting pad

Method and system for memory signal transmission

Printed circuit board for high-speed electrical connectors

Multi-layer printed circuit with low noise

Multi-layer printed circuit with low noise

Surface-mounted microwave package and corresponding mounting with a multilayer circuit

Low EMI capacitive trackpad

Two-layer PCB with impedence control and method of providing the same

Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies

Routing vias in a substrate from bypass capacitor pads

Routing power and ground vias in a substrate

Connection structure for coaxial connector and multilayer substrate

Balanced transmission cable connector

Circuit board and method for producing a circuit board

Multilayer structure with device for improving integrity of signals propagating between signal layers

Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias

Connector circuit board

Spark gap device

High frequency via with stripped semi-rigid cable

High frequency via

Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device

PRINTED CIRCUIT BOARD WITH SHIELDED PATH AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH SHIELDED PATH

Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe

Semiconductor device power interconnect striping

Plating of multi-layer structures

Miniature broadband switched filter bank

Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module

Microstrip lines in a multi-layered shielded configuration

Flexible substrate and electronic equipment

Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making

Flat flexible circuitry

Optical sub-assembly for opto-electronic modules

Multi-layer printed board

Signal line circuit device

Multilayered circuit board for high-speed, differential signals

Multilayer printed circuit board including first and second signal traces and a first ground trace

Triangular conforming transmission structure

High permeability layered magnetic films to reduce noise in high speed interconnection

Board-to-board connector

Rf system concept for vehicular radar having several beams

Techniques for joining an opto-electronic module to a semiconductor package

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication

Techniques for joining an opto-electronic module to a semiconductor package

Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk

Method and structure for implementing column attach coupled noise suppressor

Dielectric structure for printed circuit board traces

High frequency multilayer circuit structure and method for the manufacture thereof

Waveguide in multilayer structures and resonator formed therefrom

Acoustic wave touch detecting apparatus

Three dimensional dynamically shielded high-Q BEOL metallization

Printed wiring board having impedance-matched differential pair signal traces

Electronic device carrier adapted for transmitting high frequency signals

Transmission line parasitic element discontinuity cancellation

Electromagnetic interference shielding for packages and modules

Electronic device including capacitive structure

Printed circuit board based RF circuit module

Attenuation reduction structure for flexible circuit board

Tiered circuit board for interfacing cables and connectors

Circuit for and method of routing signals in a plurality of metal layers of an integrated circuit

High performance PCB