233640 ⎘
Printed circuits; Details; Electrical arrangements not otherwise provided for; Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
Sub-classes:CIRCUIT BOARD FOR CONNECTORS
#2DISPLAY DEVICE AND MOBILE ELECTRONIC DEVICE INCLUDING THE SAME
#3SEMICONDCUTOR DEVICE AND SEMICONDCUTOR MODULE ARRANGEMENT
#4COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER
#5ELECTRONIC COMPONENT MODULE
#6Multilayer Component, Multilayer Component Assembly, and Methods for Forming a Multilayer Component
#7PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
#8INTEGRATED HEAT SINK FOR COMPUTING STRUCTURE
#9APPARATUS FOR MEASURING RESPIRATION
#10CIRCUIT BOARD STRUCTURE
#11WIRING BOARD AND VEHICLE DISPLAY DEVICE
#12AEROSOL-GENERATING DEVICE AND SYSTEM
#13VIA HOLE STRUCTURE OF CIRCUIT BOARD, AND CIRCUIT BOARD
#14MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
#15PRINTED CIRCUIT BOARD HEAT EXCHANGER AND ASSOCIATED METHOD
#16NATURAL STONE PANEL WITH AN INTEGRATED TOUCH SENSING SYSTEM AND MANUFACTURING METHOD THEREOF
#17DRIVE PORTION FOR DISPLAY DEVICE, DISPLAY DEVICE, AND ELECTRONIC DEVICE INCLUDING THE SAME
#18SURGE PROTECTIVE DEVICES
#19APPARATUSES AND METHODS FOR PROVIDING POWER TO ELECTRONIC DEVICES
#20WIRING SUBSTRATE
#21LOW-TRANSMISSION-LOSS COPPER-BASED COMPOSITE MATERIAL AND PREPARATION METHOD THEREOF, PCB, AND ELECTRONIC COMPONENT
#22VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
#23Microphone
#24RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
#25Harness PCB
#26Semiconductor Device and Method of Forming Multi-Layer Shielding Structure Over the Semiconductor Device
#27ELECTRONIC DEVICE
#28SYSTEMS AND METHODS FOR INTEGRATING INDUCTORS WITHIN PRINTED CIRCUIT BOARDS
#29CIRCUIT BOARD AND DISPLAY APPARATUS
#30MICROSTRIP BOARD GROUND PLANE IMPEDANCE MATCHING ADJUSTMENT
#31ELECTRICAL MAGNETIC INTERFERENCE FILTER BOARD FOR POWER BUSBAR
#32DISPLAY MODULE AND DISPLAY DEVICE
#33Optical Module
#34PRINTED WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC EQUIPMENT AND VIDEO DISPLAYING APPARATUS
#35ELECTRONIC DEVICE
#36CONNECTION MEMBER AND DISPLAY DEVICE INCLUDING SAME
#37SELF-CENTERING CERAMIC WASHER
#38Self-Centering Ceramic Washer That Prevents Misalignment When Positioned Between A Feedthrough And An EMI Filter Capacitor Or A Circuit Board Supporting EMI Filter Capacitors For A Medical Device
#39ASSEMBLY STRUCTURE
#40OPTICAL MODULE AND FLEXIBLE PRINTED CIRCUIT BOARD
#41DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES FOR SHIELDING APPLICATIONS
#42ELECTRONIC DEVICE
#43RADIATION SHIELDING CONFORMAL COAT FOR PRINTED BOARD ASSEMBLY
#44VIA AND PAD ARRANGEMENT FOR PRINTED CIRCUIT BOARD
#45ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
#46CIRCUIT BOARD
#47BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE
#48CIRCUIT BOARD STRUCTURE WITH SHIELDING AND HEAT DISSIPATION FUNCTIONS, AND MANUFACTURING METHOD THEREFOR
#49SHIELDABLE CIRCUIT BOARD STRUCTURE
#50PRINTED WIRING BOARD
#51DISPLAY DEVICE AND MOBILE ELECTRONIC DEVICE INCLUDING THE SAME
#52CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
#53PRINTED WIRING BOARD
#54HIGH-SPEED OPTICAL PACKAGE WITH CONTINUOUS RADIO FREQUENCY (RF) FLEXIBLE PRINTED CIRCUIT
#55Circuit board local electromagnetic shielding
#56Circuit board
#57PRINTED CIRCUIT BOARD
#58FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
#59MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERIAL LINKS
#60PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME
#61AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPANSION CAPABILITY
#62HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
#63High Speed Communication Jack
#64VERTICAL CAVITY SURFACE EMITTING LASER DEVICE WITH AN INTEGRATED GROUND LAYER
#65Circuit board module and touch display apparatus
#66HEAT SPREADER FOR MODIFIED EDGE COOLING
#67SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURING WITH REDUCED INTERFERENCE AND NOISE
#68ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTING VOLUME OF COMPONENT
#69CIRCUIT BOARD AND LAYOUT METHOD THEREOF
#70VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
#71CIRCUIT BOARD AND ELECTRONIC DEVICE
#72DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME
#73CURRENT SENSOR FOR A PRINTED CIRCUIT BOARD
#74Shield Can as Stiffener on Flexible Printed Circuits
#75ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FOR REDUCING DEFORMATION
#76MANUFACTURING METHOD OF ELECTRONIC DEVICE
#77ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#78LARGE AREA MONITORING APPARATUS
#79Electromagnetic wave shielding film and shielded printed wiring board
#80PRINTED CIRCUIT BOARDS INCLUDING STRUCTURES FOR SUPPRESSING RADIATION
#81APPARATUS AND METHODS FOR STAIRCASE ANTENNAS
#82Circuit board module and touch display apparatus
#83SURGE PROTECTIVE DEVICES
#84Printed circuit board
#85ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD
#86MULTILAYER SUBSTRATE
#87ELECTRICAL CONNECTOR WITH INTEGRATED GROUND PLANE
#88Circuit board and electronic device
#89FLEXIBLE PHASED ARRAY ANTENNA SYSTEMS AND METHODS
#90FILTER CIRCUIT
#91Electronic device including high-frequency transmission circuit
#92Electromagnetic wave absorber
#93Interlaced crosstalk controlled traces, vias, and capacitors
#94Connection member and display device including same
#95Electronic device
#96Resetting different pair skew of printed circuit board traces
#97Efficient wave guide transition between package and PCB using solder wall
#98Circuit board and electronic device
#99Flexible printed circuit cable assembly with electromagnetic shielding
#100PCB for heatsink based power delivery
#101EMC filter for a control device
#102Printed circuit board for galvanic effect reduction
#103Micro-ground vias for improved signal integrity for high-speed serial links
#104MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS
#105Multilayer circuit board having signal and power isolation circuit
#106Shielded electronic component package
#107Selected Reject Band Non-Radiofrequency-Coupling Tile and Associated Methods and Systems
#108High-frequency module and communication device
#109ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD ASSEMBLY
#110Battery module printed circuit board assembly system and method
#111CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
#112Electronic component module, and method of manufacturing the same
#113Printed circuit board
#114Circuit board with rigid portion and flexible portion having connecting end and electronic package using the same
#115HIGH-FREQUENCY MODULE, COMMUNICATION DEVICE, AND METHOD FOR MANUFACTURING PLURALITY OF HIGH-FREQUENCY MODULES
#116MODULE
#117OPTO-ELECTRIC HYBRID BOARD
#118Electronic device including multiple printed circuit boards
#119Circuit board with polymer conductive members
#120Circuit board assembly and manufacturing method thereof
#121Flexible printed circuit board and display device
#122Circuit board
#123POWER CONVERSION DEVICE
#124CIRCUIT BOARD STRUCTURE FOR MOBILE PCI EXPRESS MODULE
#125STACKED SSD SEMICONDUCTOR DEVICE
#126Electronic device including high-frequency transmission circuit
#127Bus bar link for battery cell interconnections in a battery module
#128Computing device and series power supply method
#129Printed circuit board (PCB) including heatsinks
#130Multilayer resin substrate and method for producing same
#131Display module and manufacturing method therefor, and display device
#132METHODS AND APPARATUS TO INCREASE RIGIDITY OF PRINTED CIRCUIT BOARDS
#133CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME
#134Wiring board
#135Method and procedure for miniaturing a multi-layer PCB
#136ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES
#137Assembly structure
#138Scanning radar system with substrate integrated waveguides and heat dissipating structures
#139Substrate with buried component and manufacture method thereof
#140Flexible flat cable and method of producing the same
#141Optical module and manufacturing method of the same
#142INSULATING MEMBER ARRANGEMENT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
#143Crosstalk suppression microstrip line
#144Add-in card connector edge finger optimization for high-speed signaling
#145Electromagnetic wave transmission board comprising an inner board with a plated through hole covered by outer plates, where the electromagnetic waves propagate in the through hole without leakage
#146Method and procedure for miniaturing a multi-layer PCB
#147CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMBLY USING EMBEDDED NICKEL-METAL COMPOSITE MATERIALS
#148METHOD OF MANUFACTURING CONDUCTIVE PATTERN, TOUCH SENSOR, ELECTROMAGNETIC WAVE SHIELD, ANTENNA, WIRING BOARD, CONDUCTIVE HEATING ELEMENT, AND STRUCTURE
#149Circuit board comprising via
#150Electronic module
#151Flexible printed circuit board and display touch apparatus
#152METHOD OF MANUFACTURING CIRCUIT BOARD
#153Printed circuit board assembly and electronic device comprising same
#154Interlaced crosstalk controlled traces, vias, and capacitors
#155Electronic assembly that includes interconnected circuit boards
#156CIRCUIT BOARD AND COMMUNICATION DEVICE
#157Semiconductor Device and Method of Forming Multi-Layer Shielding Structure Over the Semiconductor Device
#158ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD
#159Printed circuit board design for high speed application
#160Printed circuit board
#161Resin multilayer substrate
#162System and method for shielding attenuation of electromagnetic interference emissions
#163Devices and methods related to metallization of ceramic substrates for shielding applications
#164Electronic device
#165METHOD FOR MANUFACTURING ELECTROMAGNETIC SHIELDING FILM
#166WIRED CIRCUIT BOARD
#167CIRCUIT BOARD TO REDUCE FAR END CROSS TALK
#168Connection member and display device including same
#169Flexible circuit board assembly, display assembly and display device
#170Printed circuit board and optical transceiver
#171Axial field rotary energy device with PCB stator with thermal expansion capability
#172Display panel and displaying device
#173Shielding process for SIP packaging
#174Circuit board for high frequency transmission and shielding method
#175Flexible circuit board, driving structure and display device
#176Flexible printed circuit and display device
#177Microelectronic package with substrate-integrated components
#178Transmission line and circuit board
#179Method for manufacturing a circuit board
#180Printed circuit board
#181FORMATION METHOD OF CHIP PACKAGE
#182Flexible printed circuit board
#183Module
#184Electromagnetic wave shielding film and shielding printed wiring board
#185Apparatus, system, and method for mitigating the swiss cheese effect in high-current circuit boards
#186Semiconductor device
#187Electronic device comprising printed circuit board assembly
#188Electrode assembly for mass spectrometer
#189Printed circuit board
#190Printed wiring board and electronic device
#191Scanning element and inductive position measuring device therewith
#192Electronic device comprising printed circuit board with slits
#193Ground member and shielded printed wiring board
#194Printed circuit board and display device
#195Component package and printed circuit board for the same
#196Shielded electronic component package
#197Shielded printed wiring board, method for manufacturing shielded printed wiring board, and connecting member
#198Electrical Arrangement with a Transformer for Transmitting Signals from a Primary Side to a Secondary Side
#199Radiation shield with zipper
#200Circuit board and manufacturing method thereof
#201Methods of manufacturing circuit board and circuit board assembly
#202Hybrid boards with embedded planes
#203Semiconductor module
#204Method for manufacturing flexible circuit board
#205Wireless communication device
#206Power module for operating an electric vehicle drive with improved thermal conduction for drive electronics
#207Module
#208High speed communication jack
#209Electronic device including multiple printed circuit boards
#210Method for manufacturing a circuit board
#211Method and procedure for miniaturing a multi-layer PCB
#212Multilayer wiring substrate
#213Circuit board and optical module
#214Extensible and contractible wiring board
#215Circuit board
#216Printed circuit board including ground line for canceling electromagnetic waves generated by power line, and electronic device including same
#217MULTICORE CABLE-WITH-CONNECTOR
#218Electronic device including printed circuit board having shielding structure
#219Electronic component module and manufacturing method of electronic component module
#220Wiring substrate and current measuring device
#221Display device including flexible substrate with bubble-prevention layer
#222Electronic device including connector mounted on circuit board
#223Electronic device including high-frequency transmission circuit
#224METHOD FOR PREPARING ELECTROMAGNETIC SHIELDING FILM
#225Electronic device including structure for stacking substrates
#226Adhesive film for printed wiring board
#227Electronic module
#228Control of electric field effects in a printed circuit board assembly using embedded nickel-metal composite materials
#229Electromagnetic interference (EMI) shielding film, circuit board, and preparation method for EMI shielding film
#230Door handle assembly for a motor vehicle having a capacitive sensor and near-field communication
#231Electromagnetic interference shielding film, circuit board, and preparation method for electromagnetic interference shielding film
#232Microelectronic package with substrate-integrated components
#233Device for a vehicle for detecting an activation action in a detection region
#234Axial field rotary energy device with PCB stator panel having thermally conductive layer
#235Axial field rotary energy device having PCB stator with non-linear traces
#236Axial field rotary energy device with PCB stator having interleaved PCBS
#237Axial field rotary energy device with segmented PCB stator having thermally conductive layer
#238Electrical interconnection system and method for electrically interconnecting electrical components of a module
#239Inter-layer slot for increasing printed circuit board power performance
#240Electromagnetic wave shielding film
#241Vehicular electronic accessory module with enhanced grounding contact
#242HMN unit cell class
#243Method for shielding system-in-package assemblies from electromagnetic interference
#244High frequency module, board equipped with antenna, and high frequency circuit board
#245Printed circuit board shielding and power distribution via edge plating
#246Printed Wiring Board
#247Flexible shielded position sensor
#248Printed circuit board and electronic device including same
#249Electromagnetic Shielding Film and Shielded Printed Wiring Board Including the Same
#250FERROMAGNETIC MATERIAL TO SHIELD MAGNETIC FIELDS IN SUBSTRATE
#251Cryptographic device arranged to compute a target block cipher
#252Methods related to metallization of ceramic substrates for shielding applications
#253Lighting apparatus a pi-filter and non-isolated switch driving circuit and a base comprising a metal connector
#254Printed circuit board and printed circuit board strip
#255Power supplies including shielded multilayer power transmission boards
#256ULTRA-THIN COPPER FOIL STRUCTURE, ELECTROMAGNETIC INTERFERENCE SHIELD, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD
#257COLLECTOR PLATE
#258Electromagnetic wave shielding sheet and printed wiring board
#259Assembly structure and electronic device having the same
#260Detector array for a radiation system, and related system
#261Radio frequency module
#262Printed circuit board and motherboard with the same
#263Electromagnetic shields with bonding wires for sub-modules
#264Low parasitic inductance structure for power switched circuits
#265Electronic device including high-frequency transmission circuit
#266PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
#267WEARABLE ELECTRONIC DEVICE INCLUDING BIOMETRIC SENSOR AND WIRELESS CHARGING MODULE
#268Wireless power transmitter and wireless power receiver including multiple grounds for reducing electro-magnetic interference
#269METHODS AND SYSTEMS TO IMPROVE PRINTED ELECTRICAL COMPONENTS AND FOR INTEGRATION IN CIRCUITS
#270Reducing Capacitive Coupling On Metal Core Boards
#271Sideband conductor resonance mitigation
#272ELECTRONIC APPARATUS HAVING NOISE SUPPRESSION MECHANISM
#273Flexible flat cable and method of producing the same
#274PRINTED CIRCUIT BOARD AND APPARATUS INCLUDING THE SAME
#275Apparatus related to conformal coating implemented with surface mount devices
#276Microelectronic assemblies having conductive structures with different thicknesses
#277Print circuit board, optical module, and optical transmission equipment
#278Multilayer rigid flexible printed circuit board and method for manufacturing the same
#279Printed circuit board having embedded electronic device
#280FPC integrated capacitance switch and method of manufacturing the same
#281Battery module constant current relay control systems and methods
#282Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
#283Flexible wiring circuit board and imaging device
#284Circuit module
#285Floating EMI shield
#286Method of manufacturing circuit board
#287Display device
#288Method and structure for layout and routing of PCB
#289Electromagnetic-wave shielding film, preparation method, and use thereof
#290Multilayer substrate, multilayer substrate array, and transmission/ reception module
#291Systems, methods, and devices for pre-charge control of a battery module
#292High sensitivity photodetector with high-gain transimpedance amplifier
#293CONDUCTIVE INK FOR FORMING SIGNAL CONNECTION, SIGNAL REFERENCING, AND SHIELDING FEATURESON PRINTED CIRCUIT BOARDS
#294Method for shielding system-in-package assemblies from electromagnetic interference
#295ELECTROMAGNETIC WAVE SHIELDING FILM AND MANUFACTURING METHOD AND APPLICATION THEREOF
#296Circuit board
#297High speed communication jack
#298Electrical component
#299Systems and methods for providing electrical signals to electrical devices within an interior cabin of a vehicle
#300Structure and formation method of chip package with shielding structure