233641 ⎘
Printed circuits; Details; Electrical arrangements not otherwise provided for; Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
Sub-classes:COMMUNICATION DEVICE FOR VEHICLE AND THERMAL MANAGEMENT INTEGRATED CONTROLLER INCLUDING THE SAME
#2CONTROLLING IMPEDANCE AND PHASE SHIFT OF A TRANSMISSION LINE
#3ELECTRONIC DEVICE TO WHICH COPLANAR WAVEGUIDE STRUCTURE IS APPLIED
#4Signaling Trace with Width-Modulated Discontinuity Mitigation
#5MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
#6WIRING BOARD AND MOUNTING STRUCTURE
#7MANAGING CROSSTALK FOR HIGH DATA RATE INTERFACES
#8WEARABLE DEVICE INCLUDING STRUCTURE FOR PREVENTING NOISE CAUSED BY STATIC ELECTRICITY
#9INPUT/OUTPUT APPARATUS
#10POWER ELECTRONIC SYSTEM WITH CONDUCTOR HAVING DAMPING FUNCTION
#11Automotive Electronic Control Unit
#12OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA
#13DISK DEVICE
#14PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
#15CONNECTOR INCLUDING SIGNAL PINS SHIELDED BY BURIED GROUND VIAS
#16BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
#17TECHNOLOGIES FOR REDUCING THE IMPACT OF RADIOFREQUENCY INTERFERENCE ON A CIRCUIT BOARD
#18ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD
#19GROUND BUS FOR A CABLE CARD ASSEMBLY OF AN ELECTRICAL CONNECTOR
#20WIRING SUBSTRATES AND ELECTRONIC APPARATUSES
#21ENHANCED MICROSTRIP TRACE
#22ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
#23ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD
#24MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
#25CARRIER STRUCTURE
#26WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
#27Flexible Hybrid Interconnect Circuits
#28TERMINATION OF CABLES FOR A CONNECTOR
#29CIRCUIT BOARD AND LAYOUT METHOD THEREOF
#30WIRING BOARD AND ELECTRONIC DEVICE
#31WEARABLE ELECTRONIC DEVICE
#32WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE
#33MULTILAYER RESIN SUBSTRATE AND ELECTRONIC COMPONENT
#34Low-loss transmission line structure comprising a dielectric layer stacked with conductive layers having signal strips and ground strips and including air grooves close to the signal strips
#35SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
#36Mating backplane for high speed, high density electrical connector
#37INTERPOSER AND ELECTRONIC DEVICE COMPRISING SAME
#38Integrated circuit and signal transmission method
#39Connector including signal pins shielded by buried ground vias
#40Electronic device
#41WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE
#42WIRING BASE AND ELECTRONIC DEVICE
#43HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
#44MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE, AND ELECTRONIC DEVICE
#45Sensor interposer employing castellated through-vias
#46Backplane footprint for high speed, high density electrical connectors
#47PRINTED CIRCUIT BOARD AND PRINTING APPARATUS
#48MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
#49CIRCUIT BOARD WITH LOWER DIELECTRIC CONSTANT AND ELECTRICAL CONNECTOR HAVING THE SAME
#50Layout of signal traces
#51CIRCUIT BOARD
#52ELECTRONIC DEVICE
#53Interlaced crosstalk controlled traces, vias, and capacitors
#54CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
#55Electrical connector with ground terminals and shielding ground terminals around signal terminals
#56Edge connector, circuit board, and connector component
#57MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
#58RESIN FILM WITH CONDUCTOR LAYER, MULTILAYER SUBSTRATE, AND METHOD FOR PRODUCING RESIN FILM WITH CONDUCTOR LAYER
#59ELECTRICAL STRUCTURE WITH NON-LINEAR ELECTRICAL INTERCONNECT
#60Breakout structure for an integrated circuit device
#61Circuit module and communication device
#62Circuit board with rigid portion and flexible portion having connecting end and electronic package using the same
#63CIRCUIT BOARD HAVING ELECTROMAGNETIC SHIELDING STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
#64Flexible hybrid interconnect circuits
#65Mating backplane for high speed, high density electrical connector
#66High frequency module and communication device
#67Wide band printed circuit board through connector
#68A MULTI CHANNEL FILTER FOR LOW ELECTRON TEMPERATURES
#69Rigid flexible printed circuit board and electronic device including the same
#70Crosstalk suppression microstrip line
#71Guard trace ground via optimization for high-speed signaling
#72HIGH-FREQUENCY CIRCUIT
#73PRINTED CIRCUIT BOARD COMPRISING GROUND WIRE
#74Flexible circuit board and manufacturing method therefor, and related apparatus
#75Wiring board, electronic module, and electronic apparatus
#76WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
#77Interlaced crosstalk controlled traces, vias, and capacitors
#78Flexible Printed Circuit Board
#79Backplane footprint for high speed, high density electrical connectors
#80Printed circuit board design for high speed application
#81Circuit board and electronic apparatus using the same
#82Communication module and electronic device
#83Printed circuit board and printing apparatus
#84Electronic equipment
#85Electronic device
#86Printed circuit board
#87Circuit board, method for manufacturing circuit board, and electronic device
#88Flexible circuit board for multiple signal transmission
#89Connector including signal pins shielded by buried ground vias
#90Lens moving apparatus, and camera module and optical device comprising same
#91Spiral antenna and related fabrication techniques
#92ELECTRICAL JUNCTION BOX
#93Electrical connector with ground terminals and shielding ground terminals around signal terminals
#94Sensor interposer employing castellated through-vias
#95Superconducting flex circuit boards having metal structures for improved interfacing characteristics
#96Differential circuit board and semiconductor light emitting device
#97Flexible hybrid interconnect circuits
#98Method for manufacturing the same
#99Low profile phased array
#100Information handling system with split trace for high speed routing
#101Shield printed wiring board and method of manufacturing shield printed wiring board
#102Medium voltage planar DC bus distributed capacitor array
#103Systems for shielding bent signal lines
#104Method for manufacturing flexible circuit board
#105Electronic device comprising conductive member disposed to have dielectric-fillable interval space along wire
#106High-frequency circuit board and method for manufacturing the same
#107Power conversion device
#108Edge connector, circuit board, and connector component
#109Circuit board, semiconductor device, and electronic device
#110Flexible connection member and electronic device comprising same
#111Backplane footprint for high speed, high density electrical connectors
#112High-frequency module, high-frequency circuit, and communication device
#113Printed circuit board assembly and electronic apparatus using the same
#114Modular printed circuit board wafer connector with reduced crosstalk
#115Printed circuit board and antenna module comprising the same
#116Electronic device having heat-radiating structure
#117Backplane footprint for high speed, high density electrical connectors
#118Backplane and method for producing same
#119Trace routable radiation shield
#120High frequency module, board equipped with antenna, and high frequency circuit board
#121Mating backplane for high speed, high density electrical connector
#122Flexible hybrid interconnect circuits
#123High-speed signal connector and receptacle assembly equipped therewith and transceiver module assembly equipped therewith
#124Method of manufacturing radio frequency interconnections
#125Cryptographic device arranged to compute a target block cipher
#126Printed circuit board and printing apparatus
#127Display device
#128Differential signal routing line of circuit board and circuit board
#129Flexible circuit board
#130Wiring substrate and method for manufacturing wiring substrate
#131Circuit board
#132Electronic component built-in wiring board and method for manufacturing the same
#133Flexible cable including a transmission line having an air gap configured to prevent signals from propagating to the air gap
#134PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION
#135Electronic apparatus equipped with flexible boards
#136Circuit module and method for manufacturing circuit module
#137HIGH-FREQUENCY ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#138Sideband conductor resonance mitigation
#139Resin multilayer substrate, electronic component, and mounting structure thereof
#140Resin multilayer substrate, electronic component, and mounting structure thereof
#141Wiring board and electronic device
#142Connection module
#143Sensor interposer employing castellated through-vias
#144Flexible hybrid interconnect circuits
#145Backplane footprint for high speed, high density electrical connectors
#146Component carrier having a component shielding and method of manufacturing the same
#147Shielding portions of an electronic device
#148HIGH DENSITY FLEXIBLE INTERCONNECT DESIGN FOR MULTI-MODE SIGNALING
#149Printed board
#150Organic light emitting display apparatus
#151Flexible hybrid interconnect circuit
#152Flexible printed circuits for USB 3.0 interconnects in mobile devices
#153Antenna assembly
#154Backplane footprint for high speed, high density electrical connectors
#155High-frequency module and communication device
#156Multilayer printed circuit board and electronic device including the same
#157Circuit board structure
#158Uniformization of parasitic capacitance around wiring of a circuit substrate
#159Mating backplane for high speed, high density electrical connector
#160Printed circuit board design for high speed application
#161Method for manufacturing circuit board
#162Electronic device and rigid-flexible substrate module
#163Discrete electronic device embedded in chip module
#164Method for manufacturing a surface mount technology (SMT) pad structure for next generation speeds
#165Additive manufacturing technology (AMT) low profile signal divider
#166SNAP-RF interconnections
#167Sensor interposer employing castellated through-vias
#168Flexible circuit board having enhanced bending durability and method for preparing same
#169Flexible circuit board having enhanced bending durability and method for preparing same
#170Circuit board with electrostatic discharge protection mechanism and electronic apparatus having the same
#171Stepped vias for next generation speeds
#1723D high-inductive ground plane for crosstalk reduction
#173Transmission line, flat cable, and electronic device
#174Amplifying device
#175Shielding portions of an electronic device
#176Backplane footprint for high speed, high density electrical connectors
#177Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion
#178Additive manufacturing technology (AMT) low profile radiator
#179Spiral antenna and related fabrication techniques
#180Low profile phased array
#181Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line
#182Communication module packaging
#183Transformer thermal radiator for power field effect transistors
#184Circuit board and method for manufacturing the same
#185Backplane footprint for high speed, high density electrical connectors
#186Waveguide system, high-frequency line and radar sensor
#187Transmission line
#188Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards
#189PRINTED-CIRCUIT CABLE AND MANUFACTURE METHOD THEREOF, CONNECTION CABLE, AND ELECTRICALLY ADJUSTED ANTENNA SYSTEM
#190Substrate conductor structure and method
#191Sideband conductor resonance mitigation
#192Printed circuit board having EMI shielding function, method for manufacturing the same, and flat cable using the same
#193Printed circuit board and semiconductor package structure
#194Circuit board
#195Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices
#196Printed circuit board and semiconductor package structure
#197Printed circuit board and semiconductor package structure
#198Surface mount technology (SMT) pad design with differential contact strips having converging narrowing distal ends that facilitate high speed communication
#199Edge connector, circuit board, and connector component
#200Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices
#201Mating backplane for high speed, high density electrical connector
#202Optical module
#203Cable assembly for an information handling system
#204Composite cable to be connected to flat panel-shaped electrical equipment
#205Connection structure between optical device and circuit substrate, and optical transmission apparatus using the same
#206Shield structure for a low crosstalk single ended clock distribution circuit
#207Discrete electronic device embedded in chip module
#208Flexible circuit board having enhanced bending durability and method for preparing same
#209High-frequency electronic device and manufacturing method thereof
#210Flex flat cable structure and assembly of cable connector and flex flat cable
#211Optical module
#212Multilayer printed circuit board and electronic device including the same
#213Electrical connector assembly and conductive assembly having an intervening wall
#214PCB transmission lines having reduced loss
#215Communications connectors including transmission lines having impedance discontinuities that improve return loss and/or insertion loss performance and related methods
#216Printed circuit board design for high speed application
#217Uniformization of parasitic capacitance around wiring of a circuit substrate
#218Microwave transmission line having a 3-D shielding with a laterally separated region
#219Ball-grid-array radio-frequency integrated-circuit printed-circuit-board assembly for automated vehicles
#220Liquid discharge apparatus
#221High frequency module, board equipped with antenna, and high frequency circuit board
#222Backplane footprint for high speed, high density electrical connectors
#223Circuit board having conductive polymer
#224Multilayer resin substrate, and method of manufacturing multilayer resin substrate
#225Mating backplane for high speed, high density electrical connector
#226HIGH-DENSITY STACKED GROUNDED COPLANAR WAVEGUIDES
#227Electro-optical device and electronic apparatus
#228Discrete electronic device embedded in chip module
#229Interconnection between printed circuit boards
#230Method for making conductive polymer, and composite film and circuit board having the conductive polymer
#231Circuit board structure with selectively corresponding ground layers
#232Resource allocation for traffic-profile-dependent scheduling request
#233Electronic component containing package and electronic device
#234Circuit structure having two transmission lines separated by a guard pattern defined by a first longitudinal pattern and second patterns orthogonal to the first pattern
#235Shielded, folded connector for a sensor
#236Transmission line and flat cable
#237Multichannel RF feedthroughs
#238Edge fingers of multi-layer printed circuit board
#239Driving printed circuit board for display device and display device having the same
#240Printed circuit board and card reader
#241Integrated circuit, electronic device and method for transmitting data in electronic device
#242Signal transmission path comprised of first and second plurality of signal lines laminated with an interval regulation member
#243Pad-array structure on substrate for mounting IC chip on substrate, and optical module having said pad-array structure
#244Flexible circuit board and method for making the same
#245Connection structures for providing a reference potential to a flexible circuit device
#246Method, sensor, and printed circuit board for sensing position or motion of a shaft
#247Flexible printed circuit board for optical module
#248High-frequency signal line and manufacturing method thereof
#249Transmission line
#250Printed circuit board and semiconductor packages including the same
#2513D EMI suppression structure and electronic device having the same
#252Printed circuit board, display apparatus having a printed circuit board and method of manufacturing the printed circuit board
#253Capacitive tactile sensor with nested matrix electrodes
#254Sideband conductor resonance mitigation
#255Substrate conductor structure and method
#256Control of electric field effects in a printed circuit board assembly using embedded nickel-metal composite materials
#257Touch screen, touch panel, display device and electronic apparatus
#258Flexible printed circuit board
#259Non-contact communication apparatus and system using the same
#260High-frequency signal transmission line and electronic apparatus
#261Signal transmission cable
#262Cable structure
#263Flexible printed circuit board, method for manufacturing the same, and capacitive touch display device
#264Integrated circuit, electronic device and method for transmitting data in electronic device
#265Repeater
#266Printed wiring board and connector connecting the wiring board
#267Multi-mode filter having a dielectric resonator mounted on a carrier and surrounded by a trench
#268Mating backplane for high speed, high density electrical connector
#269Mating backplane for high speed, high density electrical connector
#270Mating backplane for high speed, high density electrical connector
#271Wiring member for shielding noise, and method of manufacturing, method of designing, and electronic apparatus thereof
#272Noise blocking printed circuit board and manufacturing method thereof
#273Robot
#274Method of forming an interference shield on a substrate
#275GROUNDING PATTERN STRUCTURE FOR HIGH-FREQUENCY CONNECTION PAD OF CIRCUIT BOARD
#276Stack structure of high frequency printed circuit board
#277Communications connectors including transmission lines having impedance discontinuities that improve return loss and/or insertion loss performance and related methods
#278Multilayer resin substrate, and method of manufacturing multilayer resin substrate
#279Printed circuit board for mobile platforms
#280Floating connector shield
#281Multi-layer printed circuit board structure, connector module and memory storage device
#282RFID SHIELDING
#283High-frequency transmission line
#284Printed wiring board
#285Edge plated printed circuit board
#286High-frequency circuit package and sensor module
#287Board assembly for transmitting high-speed signal and method of manufacturing the same
#288Multilayer wiring board
#289Flexible printed circuit board and method for manufacturing same
#290Via layout techniques for improved low current measurements
#291Apparatus for performing communication control
#292PCB trace connection of ion smoke sensor
#293Components and circuits for output termination
#294Printed wiring board
#295High-frequency signal line and manufacturing method thereof
#296High-frequency signal line and method for producing base layer with signal line
#297Electrical connector
#298High-frequency signal line
#299Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system
#300High speed plug connector having improved high frequency performance