233649 ⎘
Printed circuits; Details; Electrical arrangements not otherwise provided for; Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances Capacitors or dielectric substances
ELECTRONIC DEVICE AND METHOD OF SUPPRESSING SIGNAL NOISE GENERATED BY BUCK-BOOST CIRCUIT
#2POWER SUPPLY MODULE AND ELECTRONIC DEVICE
#3BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
#4VERTICAL POWER SUPPLY SYSTEM AND MANUFACTURING METHOD OF CONNECTION BOARD
#5COMMON MODE DETECTION IN HIGH SPEED DIFFERENTIAL TRACES
#6POWER MODULE
#7PACKAGE SUBSTRATE WITH A RESERVE CAPACITOR
#8IN-LINE CAPACITOR MODULE
#9ELECTRICAL MAGNETIC INTERFERENCE FILTER BOARD FOR POWER BUSBAR
#10MULTI-LAYER LINE STRUCTURE
#11VEHICLE ELECTRIC SYSTEM
#12ELECTRONIC DEVICE WITH DIFFERENTIAL TRANSMISSION LINES EQUIPPED WITH CAPACITORS SUPPORTED BY A BASE, AND CORRESPONDING MANUFACTURING METHOD
#13MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
#14Component Carrier With Embedded Electronic Switch Components and a Capacitor Device
#15BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
#16CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#17SWITCHING POWER SUPPLY DEVICE
#18ELECTRONIC DEVICE
#19WIRING BOARD AND LAMINATED WIRING BOARD
#20MANUFACTURING METHOD OF CIRCUIT BOARD
#21Multilayer Capacitor and Circuit Board Containing the Same
#22POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES
#23STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES
#24CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT BOARD
#25MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS
#26CONTROL CIRCUIT AND POWER SUPPLY DEVICE
#27ELECTRONIC DEVICE
#28POWER SUPPLY APPARATUS, LOAD AND ELECTRONIC DEVICE
#29HIGH PERFORMANCE CAPACITORS AND CURRENT PATH ARRANGEMENTS
#30Signal processing board and image forming apparatus
#31Multi-layer line structure
#32CIRCUIT ARRANGEMENT, PRINTED CIRCUIT BOARD ARRANGEMENT, ELECTRIC DRIVE AND MOTOR VEHICLE
#33Optical receiver
#34Circuit board
#35Power Semiconductor Device, Power Conversion Device, and Electric System
#36MICROSTRIP ROUTING CIRCUITS WITH DIELECTRIC FILMS
#37Interlaced crosstalk controlled traces, vias, and capacitors
#38VERTICAL POWER SUPPLY SYSTEM AND MANUFACTURING METHOD OF CONNECTION BOARD
#39Bonded structures with integrated passive component
#40STAND OFF STRUCTURES FOR ELECTRONIC CIRCUITS
#41MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
#42Display device and circuit board
#43GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICONDUCTOR PACKAGES AND RELATED METHODS
#44Printed circuit board including on-board integrated enclosure for electromagnetic compatibility shielding
#45ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACITOR COUPLED TO COMPONENT PADS
#46FILTER CIRCUIT
#47Circuit board with compact passive component arrangement
#48Glass core wiring substrate incorporating high-frequency filter, high-frequency module using the same, and method of manufacturing glass core wiring substrate incorporating high-frequency filter
#49MICROWAVE DIELECTRIC ANALYZER
#50Method and procedure for miniaturing a multi-layer PCB
#51PACKAGING STRUCTURE FOR CIRCUIT UNITS
#52Capacitor integrated structure
#53Multilayer capacitor and circuit board containing the same
#54Interlaced crosstalk controlled traces, vias, and capacitors
#55High-frequency line structure with lead pin-connected substrates
#56Electronic device with differential transmission lines equipped with capacitors supported by a base, and corresponding manufacturing method
#57Electronic module and electronic apparatus
#58PRINTED CIRCUIT BOARD INCLUDING INTERDIGITAL SLOTS AND/OR SPLITS ON REFERENCE PLANES FOR REDUCING EMI
#59Circuit board and manufacturing method thereof and electronic device
#60Metamaterial electromagnetic absorber
#61Power supply system and electronic device
#62Multi-dielectric printed circuit board
#63Method for reducing influence of remote reference power noise on signal quality
#64Filter module for reducing differential and common mode noise and method to manufacture such a filter module
#65High density power module
#66LOW-INDUCTANCE CONNECTING DEVICE FOR CONNECTING A SEMICONDUCTOR MODULE AND AN INTERMEDIATE CIRCUIT CAPACITOR
#67Semiconductor device
#68Circuit board and display device including the same
#69Circuit board and method for manufacturing the same
#70Substrate comprising an inductor and a capacitor located in an encapsulation layer
#71Co-axial grid array capacitor assembly
#72ELECTROMAGNETIC WAVE REDUCING STRUCTURE
#73Method and procedure for miniaturing a multi-layer PCB
#74INTEGRAL SUPER-CAPACITOR FOR LOW POWER APPLICATIONS
#75Multi-phase step-down DC/DC power source device
#76Multi-layer line structure and method for manufacturing thereof
#77On-board integrated enclosure for electromagnetic compatibility shielding
#78Multilayer ceramic capacitor and board having the same
#79MULTICORE CABLE-WITH-CONNECTOR
#80Method of forming a capacitive loop substrate assembly
#81Method of manufacturing a computer device
#82A SUBSTRATE STRUCTURE AND METHOD FOR CONTROLLING THE SAME
#83Semiconductor device
#84Power conversion circuit module
#85Module board and printed board
#86Printed circuit board shielding and power distribution via edge plating
#87Electronic device including heat dissipation structure
#88Printed circuit board including auxiliary power supply and electronic apparatus including the same
#89Electronic device comprising connector
#90Capacitor
#91Combination stiffener and capacitor
#92Redundant circuit device
#93Method of forming an electronic device
#94Mirrored voltage regulator for high-current applications and method the same
#95Galvanic isolation circuit
#96Sideband conductor resonance mitigation
#97Wiring board, semiconductor device, and method of manufacturing wiring board
#98Lighting apparatus for a vehicle, method of installing a lighting apparatus onto a vehicle, and lighting apparatus kit for a vehicle
#99Printed circuit board and switching power supply
#100Thin film capacitors for core and adjacent build up layers
#101Circuit board with compact passive component arrangement
#102NOISE SUPPRESSION CIRCUIT DEVICE
#103Line structure and a method for producing the same
#104Line structure and a method for producing the same
#105Electrical device comprising filter and feedthrough capacitor
#106Thin film capacitor and circuit board incorporating the same
#107PCB based semiconductor device
#108Electronic component
#109Multilayer ceramic electronic component array
#110Packaged semiconductor device
#111Device with USB port
#112Hermetic terminal for an AIMD having a pin joint in a feedthrough capacitor or circuit board
#113Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates
#114Microwave dielectric analyzer
#115Printed circuit board and switching power supply for electronic appliance
#116Resonant circuit element and circuit module
#117Integrated circuit voltage-controlled oscillator with late-stage fabrication tuning
#118BLDC motor integrated with inverter
#119Packaged semiconductor device
#120Multilayer ceramic capacitor and board having the same
#1213D electromagnetic bandgap circuit
#122Voltage noise reduction of power delivery networks for integrated circuits
#123Multilayer capacitor and board having the same
#124Compact design of multilevel power converter systems
#125PUF-film and method for producing the same
#126Apparatus, method and system for a light fixture driving circuit
#127Capacitor loop structure
#128Electronic component and method of producing electronic component
#129Combiner and antenna apparatus
#130Printed wiring board
#131Filter comprising printed circuit board and busbars
#132Circuit device with monolayer bonding between surface structures
#133FAN-OUT SEMICONDUCTOR PACKAGE
#134In-vehicle electronic device
#135Multilayer ceramic capacitor and board having the same
#136Integrated circuit with capacitor in different layer than transmission line
#137Multi terminal capacitor within input output path of semiconductor package interconnect
#138Electromagnetic interference (EMI) evaluation system for image sensors
#139Thin film capacitors for core and adjacent build up layers
#140Method and apparatus for reducing electromagnetic interference
#141Power module having a multilayered structure with liquid cooled busbar and method for manufacturing same
#142Component embedding in thinner core using dielectric sheet
#143Multilayer laminate and method for producing multilayer printed wiring board using same
#144PCB based semiconductor package with impedance matching network elements integrated therein
#145Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board
#146Module component
#147Multilayer capacitor and board having the same
#148Compact printed circuit board assembly with insulating endcap via
#149Power conversion device
#150Dielectric coating for crosstalk reduction
#151Printed circuit board
#152Line structure and a method for producing the same
#153Sideband conductor resonance mitigation
#154Adjustable impedance high speed data connector, and methods of assembling and operating thereof
#155High-frequency module
#156Printed circuit board and semiconductor package structure
#157Printed circuit board and semiconductor package structure
#158Printed circuit board and semiconductor package structure
#159Capacitor
#160Multilayer ceramic capacitor and board having the same
#161Multilayer capacitor and circuit board containing the same
#162Discrete packaging adapter for connector
#163Circuit board module
#164Reduction of passive components in system-in-package devices
#165Multilayer ceramic capacitor and board having the same
#166Electronic device
#167Semiconductor device and method for manufacturing the same
#168Semiconductor device and electronic equipment
#169Printing apparatus and power supply unit for printing apparatus
#170DECOUPLING ARRANGEMENT
#171Printed circuit board and switching power supply
#172PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#173Semiconductor device
#174Circuit board device
#175Power supply device having multiple power modules physically connected with each other and electronic device comprising the same
#176Tag board, RFID tag, and RFID system
#177Printed circuit board
#178Embedding discrete components having variable dimensions in a substrate
#179Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
#180Absorber assemblies having a dielectric spacer, and corresponding methods of assembly
#181Bonded structures with integrated passive component
#182Semiconductor device
#183Hermetic terminal for an AIMD having a pin joint in a feedthrough capacitor or circuit board
#184Multilayer capacitor and board having multilayer capacitor mounted thereon
#185High current flexible feedthrough for use with a power converter
#186High-frequency filter and communication device module
#187Filtered feedthrough assembly for implantable medical electronic devices
#188Power conversion circuit board and electric compressor
#189Electronic device, method for producing same, and circuit substrate
#190Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors
#191Power converter
#192Power decoupling attachment
#193Electronic component package structure and electronic device
#194Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated circuit device
#195Filter comprising printed circuit board and busbars
#196CAPACITIVE INTERPOSER FOR METAL SLOT ANTENNA AND METHODS
#197Component carrier with a bypass capacitance comprising dielectric film structure
#198Semiconductor device
#199Probe card for a testing apparatus of electronic devices with enhanced filtering properties
#200Plug connector for tuning crosstalk and return loss
#201Power circuit device
#202Capacitive structures for crosstalk reduction
#203COMPACT PARTITIONED CAPACITOR FOR MULTIPLE VOLTAGE DOMAINS WITH IMPROVED DECOUPLING
#204Component stability structure
#205Embedding discrete components having variable dimensions in a substrate
#206Capacitive interconnect in a semiconductor package
#207Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated circuit device
#208Method of fabricating package structure with an embedded electronic component
#209Filtered connector and filter board thereof
#210Capacitor and electronic device having a plurality of surface electrodes electrically connected to each other by an intermediate electrode
#211Mounted structure of laminated capacitor, and method of mounting laminated capacitor
#212Electronic circuit and method for mounting electronic circuit
#213Electronic circuit card with connector edge having alternated TX and RX pins assignment
#214Power supply converter and method for manufacturing the same
#215Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
#216Development of the advanced component in cavity technology
#217Semiconductor device
#218Multilayer capacitor and board having the same
#219Multilayer electronic component and board having the same
#220Multilayer ceramic capacitor and board having the same
#221Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board
#222Discrete packaging adapter for connector
#223Composite electronic component and board on which composite electronic component is mounted
#224Supercapacitor structures
#225Electronics assembly with interference-suppression capacitors
#226Elastic composite filter
#227Electronic apparatus
#228FILTERED FEEDTHROUGH ASSEMBLY FOR IMPLANTABLE MEDICAL ELECTRONIC DEVICES
#229Multilayer ceramic capacitor and board having the same
#230Structure and method for reducing electromagnetic interference
#231Communication device
#232Absorbing termination in an interconnect
#233Sideband conductor resonance mitigation
#234Decoupling arrangement
#235Printed circuit board assembly for filtering noise of network signal transmission
#236Printed circuit board and electronic device
#237Multi-layered circuit board and semiconductor device
#238Electronic device for vehicles
#239Coreless multi-layer circuit substrate with minimized pad capacitance
#240Surface mounted electronic component
#241Circuit board and method of manufacturing the same
#242Substrate comprising embedded elongated capacitor
#243Multi-mode filter having a dielectric resonator mounted on a carrier and surrounded by a trench
#244Printed circuit board
#245Circuit board
#246Printed circuit board
#247Multilayer electronic component
#248MULTILAYER ELECTRONIC COMPONENT
#249Capacitors for multilayer printed circuit boards
#250Package structure with an embedded electronic component and method of fabricating the package structure
#251Decoupling capacitive arrangement to manage power integrity
#252Absorbing termination in an interconnect
#253Signal transmission cable and communication device module
#254Composite electronic component and board having the same
#255Chip capacitors
#256Printed circuit board
#257Circuit board device and circuit board device for reducing acoustic noise
#258Composite electronic component and board for mounting thereof
#259Reflected signal absorption in interconnect
#260Package structure and method of manufacturing the same
#261PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME
#262Companion integrated circuit having decoupling capacitor and mobile device having the same
#263Two-stage power delivery architecture
#264Controlling apparatus for electric power steering apparatus
#265Printed circuit board and electric filter
#266Embedded package substrate capacitor with configurable/controllable equivalent series resistance
#267Electronic component package structure and electronic device
#268Printed circuit board
#269CERAMIC INTERPOSER CAPACITOR
#270Passive electrical devices with a polymer carrier
#271Electronic device package with vertically integrated capacitors
#272Filtered feedthrough assembly for implantable medical electronic devices
#273Vehicular electronic control device
#274Electronic device
#275Plane connected embedded substrate capacitor
#276Wireless communications circuit protection structure
#277Electronic control unit and electric power steering apparatus having the same
#278Methods for manufacturing a Z-directed printed circuit board component having a removable end portion
#279Circuit board equipped with a high-frequency component emitting interference waves
#280Electronic apparatus, method of optimizing de-coupling capacitor and computer-readable recording medium
#281Printed circuit boards including strip-line circuitry and methods of manufacturing same
#282Decoupling arrangement
#283PCB capacitor variable device and method
#284Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board
#285FACSIMILE MACHINE
#286Reducing Far End Crosstalk in Single Ended Interconnects and Buses
#287EBG structure, semiconductor device, and circuit board
#288Electronic device, test board, and semiconductor device manufacturing method
#289Mounting circuit board of multilayer ceramic capacitor
#290Capacitor arrangement assisting method and capacitor arrangement assisting device
#291Multilayer ceramic capacitor and board for mounting the same
#292Z-directed capacitor components for printed circuit boards
#293Inverter unit
#294ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
#295Multilayer ceramic capacitor and mounting board therefor
#296Circuit board and electronic device
#297Liquid ejection device and printing device
#298Electronic component and electronic component package
#299Implantable medical device and assembly thereof
#300Two-stage power delivery architecture