233658 ⎘
Printed circuits; Details; Electrical arrangements not otherwise provided for; High frequency adaptations Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
FLEX CIRCUIT AND ELECTRICAL COMMUNICATION ASSEMBLIES RELATED TO SAME
#2CONDUCTIVE POLYMER ENHANCED SOCKET
#3WIRING BOARD AND ELECTRONIC DEVICE
#4PCB ROUTING TOPOLOGY OF M-LVDS WITH FILTERS
#5WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE INCLUDING WIRING BOARD, AND ELECTRONIC MODULE
#6VIA HOLE STRUCTURE OF CIRCUIT BOARD, AND CIRCUIT BOARD
#7CIRCUIT BOARD
#8BGA ANTIPAD DESIGN FOR REDUCED CROSS TALK
#9CHARACTERISTIC IMPEDANCE CONTROL STRUCTURE
#10OPTIMIZED TABBED ROUTING
#11LOSS REDUCTION HIGH-SPEED DIFFERENTIAL TRANSMISSION LINES
#12ELECTRONIC CIRCUIT BOARD
#13COMMON MODE DETECTION IN HIGH SPEED DIFFERENTIAL TRACES
#14WIDE-BAND COMMON MODE REDUCTION IN HIGH SPEED DIFFERENTIAL TRACES
#15DUAL DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD
#16COLLAPSE-FREE CIRCUIT STRUCTURE WITH LOW CAPACITANCE EFFECT
#17PRINTED CIRCUIT BOARD TRACE WITH FORMATIONS
#18VERTICAL CONDUCTIVE STRUCTURE TRANSITION IMPEDANCE OPTIMIZATION
#19WIRING BOARD AND MOUNTING STRUCTURE
#20CROSSTALK REDUCTION USING TRACE COUPLING IN INTEGRATED CIRCUIT COMPONENTS
#21RECEPTACLE ASSEMBLY AND CIRCUIT BOARD
#22BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
#23FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE
#24Core Resonance Suppression in Signal Integrity Optimized Package
#25CABLE DEVICE AND METHOD OF PRODUCING THE SAME
#26Printed Circuit Board and Signal Transmission System
#27POWER SUPPLY CIRCUIT, PCB CIRCUIT BOARD AND POWER SUPPLY DEVICE
#28PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
#29WIRING BOARD, ELECTRONIC COMPONENT STORAGE PACKAGE, AND ELECTRONIC DEVICE
#30WIRING BOARD AND ELECTRONIC DEVICE
#31CIRCUIT BOARD AND ELECTRONIC DEVICE
#32Integrated circuit and signal transmission method
#33INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR
#34Transmission line for radio frequency signals
#35STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL
#36Microstrip delay matching using printed dielectric material
#37DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY
#38GROUND-PENETRATING RADAR SCANNER WITH BALANCED UWB DIRECTIONAL COUPLER
#39Backplane footprint for high speed, high density electrical connectors
#40WIRING BOARD AND ELECTRONIC EQUIPMENT
#41Platform Supports the Shortest Direct Electrical Connections between Two OSFP Transceivers
#42Layout of signal traces
#43DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY
#44DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY
#45Inhomogeneous dielectric medium high-speed stripline trace system
#46SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM
#47Interlaced crosstalk controlled traces, vias, and capacitors
#48Electronic substrate having differential coaxial vias
#49Interconnect structure having conductor extending along dielectric block
#50Resetting different pair skew of printed circuit board traces
#51DIFFERENTIAL PAIR INNER-SIDE IMPEDANCE COMPENSATION
#52Multilayer substrate
#53Multilayer substrate
#54Edge connector, circuit board, and connector component
#55Wideband routing techniques for PCB layout
#56PRINTED CIRCUIT BOARD
#57OPTO-ELECTRIC HYBRID BOARD
#58Wiring Board and Signal Connecting Structure
#59Contact arrangement and electronic assembly
#60Component carrier for microwave applications with stack pieces interconnected at an electrically conductive connection interface
#61Transmission module, electronic unit, and electronic device
#62Systems and methods for break out of interconnections for high-density integrated circuit packages on a multi-layer printed circuit board
#63Connecting electrical circuitry in a quantum computing system
#64Circuit board and semiconductor module
#65Component carrier and method of manufacturing a component carrier
#66Crosstalk suppression microstrip line
#67Quad-trace structures for high-speed signaling
#68Guard trace ground via optimization for high-speed signaling
#69ELECTRONIC DEVICE WITH DIFFERENTIAL TRANSMISSION LINES EQUIPPED WITH CAPACITORS SEPARATED BY A CAVITY, AND CORRESPONDING MANUFACTURING METHOD
#70MULTI-BAND RADIATION REDUCTION FILTER FOR A HIGH-SPEED DIFFERENTIAL SIGNAL TRACE
#71Interlaced crosstalk controlled traces, vias, and capacitors
#72Interconnect structure having conductor extending along dielectric block
#73CIRCUIT BOARD AND COMMUNICATION DEVICE
#74Backplane footprint for high speed, high density electrical connectors
#75Printed circuit board for transmitting signal in high-frequency band and electronic device including same
#76High-frequency high-voltage waveguide device
#77MULTILAYER CIRCUIT BOARD
#78Printed board and printed board assembly
#79Common mode filter
#80Method and system for adjusting line width and line gap of differential signal pair
#81Inhomogeneous dielectric medium high-speed stripline trace system
#82INHOMOGENEOUS DIELECTRIC MEDIUM HIGH-SPEED STRIPLINE TRACE SYSTEM
#83Zoned dielectric loss circuit board system
#84Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line
#85Capacitive compensation for vertical interconnect accesses
#86Dual-spiral common-mode filter
#87Flexible circuit board for multiple signal transmission
#88Circuit board structure for increasing isolation
#89Composite wiring board, package, and electronic device
#90Signal transmission apparatus and signal transmission method
#91Printed circuit board and display device including the same
#92Flex Circuit And Electrical Communication Assemblies Related To Same
#93Capacitive compensation for vertical interconnect accesses
#94Wideband antenna, in particular for a microwave imaging system
#95Differential circuit board and semiconductor light emitting device
#96Information handling system with split trace for high speed routing
#97Electronic substrate having differential coaxial vias
#98Connector for low loss interconnection system
#99TWISTED DIFFERENTIAL COMPENSATION FOR ROUTING HIGH-SPEED SIGNALS NEAR POWER DELIVERY INDUCTORS AND SYSTEM MINIATURIZATION
#100EMBEDDED MICROSTRIP WITH OPEN SLOT FOR HIGH SPEED SIGNAL TRACES
#101Edge connector, circuit board, and connector component
#102OPTICAL MODULE
#103Circuit board and optical module
#104Method to improve PCB trace conductivity and system therefor
#105Asymmetric differential via stubs for skew compensation
#106Wired circuit board and production method thereof
#107Layout routing structure and layout routing method for improving SI performance of signal
#108Backplane footprint for high speed, high density electrical connectors
#109Conductor arrangement and production method
#110Cable connector for high speed in interconnects
#111Electronic apparatus and electrical element
#112Printed circuit board, optical module, and optical transmission equipment
#113Wireless communication system and computer tomography apparatus
#114Connecting electrical circuitry in a quantum computing system
#115CIRCUIT BOARD
#116Electrostatic discharge mitigation for differential signal channels
#117Method for examining differential pair transmission lines
#118Printed circuit board and electronic device including same
#119Functional panel, method for manufacturing the same and terminal
#120Calibration of digital isolators
#121Differential signal routing line of circuit board and circuit board
#122Method for use with superconducting devices
#123Interconnect structure having conductor extending along dielectric block
#124Circuit board and connector
#125Printed circuit boards with non-functional features
#126Printed circuit board having a differential pair routing topology with negative plane routing and impedance correction structures
#127Panel, manufacturing method thereof, and terminal
#128Method and apparatus for digital leak detection in liquid-cooled information handling systems
#129Wired circuit board and production method thereof
#130Electronic apparatus equipped with flexible boards
#131System and method for ground via optimization for high speed serial interfaces
#132Signal transmission method and apparatus, and display device
#133Hybrid transmission line
#134Method for providing an electrical connection and printed circuit board
#135Sideband conductor resonance mitigation
#136Asymmetric dual bend skew compensation for reducing differential mode to common mode conversion
#137Wiring board and electronic device
#138Printed circuit board and switching power supply
#139Information handling system comprising a processor coupled to a board and including a differential trace pair having a first straight differential trace and a second serpentine shape differential trace
#140Printed circuit boards with non-functional features
#141Transmission line and electronic device
#142Low loss and low cross talk transmission lines having l-shaped cross sections
#143Flexible resonant trap circuit
#144Electronic apparatus and electrical element
#145Print circuit board, optical module, and optical transmission equipment
#146PRINTED CIRCUIT BOARD USING TWO-VIA GEOMETRY
#147Coupled via structure, circuit board having the coupled via structure and method of manufacturing the circuit board
#148Method of utilizing serpentine regions
#149Electronic apparatus
#150Circuit board and electrical connector with the same
#151Circuit board structure and conductive transmission line structure thereof
#152Differential trace pair system
#153ELECTRICAL ROUTING COMPONENT LAYOUT FOR CROSSTALK REDUCTION
#154Backplane footprint for high speed, high density electrical connectors
#155Printed circuit board and optical transceiver with the printed circuit board
#156Clearance size reduction for backdrilled differential vias
#157Circuit board
#158Printed circuit board, optical module, and optical transmission equipment
#159Circuit board structure
#160Substrate comprising plurality of signal lines and electronic device comprising same
#161Flexible printed circuit board
#162Differential pair group equalization system
#163Low frequency reduced passive equalizer
#164Electronic apparatus and electrical element
#165Differential transmission line formed on a wiring substrate and having a metal conductor ground layer, where a metal conductor removal block is formed in the ground layer at a location of curved sections of the differential transmission line
#166Interface arrangement on a system board and computer system
#167Differential signal traces including a solder mask disposed thereon
#168Apparatus and methods for enhancing signaling bandwidth in an integrated circuit package
#169Differential trace pair system
#170Method for manufacturing a high-current printed circuit board
#171Printed circuit board having vias arranged for high speed serial differential pair data links
#172System and method of utilizing serpentine regions
#173Stubbed differential trace pair system
#174Transmission line and electronic device
#175Circuit board arrangement for signal supply to a radiator
#176DUAL-DRILL PRINTED CIRCUIT BOARD VIA
#177Multilayer substrate
#178Connector and display device including same
#179Electronic apparatus
#180Printed circuit board, memory module and memory system including the same
#181Coupled via structure, circuit board having the coupled via structure
#182Method of manufacturing a wiring structure of a head suspension
#183Release material
#184Differential trace pair system
#185High speed differential trace with reduced radiation in return path
#186Test apparatus for signal integrity testing of connectors
#187Printed circuit board and optical transceiver with the printed circuit board
#188Electronic substrate having differential coaxial vias
#189Communication module packaging
#19090 degree differential signal layout transition
#191Backplane footprint for high speed, high density electrical connectors
#192Clearance size reduction for backdrilled differential vias
#193Waveguide system, high-frequency line and radar sensor
#194STACKED INSERTION STRUCTURE FOR FLEXIBLE CIRCUIT BOARD
#195Printed circuit board and method for manufacturing the same
#196CIRCUIT BOARD
#197Stacked transmission line
#198Transmission line
#199Apparatus comprising conductive traces configured to transmit differential signals in printed circuit boards
#200Device, system and method to promote the integrity of signal communications
#201Dielectric coating for crosstalk reduction
#202Cable connector for high speed interconnects
#203Connector for low loss interconnection system
#204Reduction of skew between positive and negative conductors carrying a differential pair of signals
#205Shielded twisted pair of conductors using conductive ink
#206Anti-pad for signal and power vias in printed circuit board
#207Connecting electrical circuitry in a quantum computing system
#208Sideband conductor resonance mitigation
#209Defected ground structure with void having resistive material along perimeter to improve EMI suppression
#210Electrical receptacle connector with grounding plates intersecting with contact wafer assembly
#211WAVEGUIDE DEVICE MODULE, MICROWAVE MODULE, RADAR DEVICE, AND RADAR SYSTEM
#212On-chip coplanar waveguide having a shielding layer comprising a capacitor formed by sets of interdigitated fingers
#213Printed circuit board and integrated circuit package
#214Compact broadband common-mode filter
#215Edge connector, circuit board, and connector component
#216Wiring board, optical semiconductor element package, and optical semiconductor device
#217Configuration element for printed circuit board assemblies
#218Electrical interconnect for a flexible electronic package
#219Waveguide RF filtering using rigid-flexible substrate
#220Golden finger structure
#221Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#222Cable assembly for an information handling system
#223Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs
#224Multilayer wiring board and differential transmission module
#225Flexible Printed Circuit Wiring Structure And Mobile Terminal
#226Printed circuit board and electronic apparatus
#227Printed circuit board and switching power supply
#228WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
#229Circuit layout structure comprising a single-ended signal transmission line disposed between first and second differential signal transmission line pairs
#230Systematic coupling balance scheme to enhance amplitude and phase matching for long-traveling multi-phase signals
#231ANGLED FIBERGLASS CLOTH WEAVES
#232SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#233Absorber assemblies having a dielectric spacer, and corresponding methods of assembly
#234Stranded transmission line and uses thereof
#235MIXED BALL GRID ARRAY PITCH FOR INTEGRATED CIRCUIT PACKAGE
#236Differential signal transmitting circuit board
#237Circuit board with return path separated low crosstalk via transition structure
#238Printed circuit board, optical module, and optical transmission equipment
#239Driver circuit for optical transmitter
#240Communications connectors including transmission lines having impedance discontinuities that improve return loss and/or insertion loss performance and related methods
#241Multilayer substrate comprising a flexible element assembly and conductor layers
#242Differential signal traces including a solder mask disposed thereon
#243Multilayer transmission line plate
#244System and method of cancelling floquet mode resonance and far end crosstalk, and mitigating crosstalk in a printed circuit board
#245Amplifier and optical transmitter using the same
#246Capacitive compensation
#247Imaging apparatus
#248PCB MICROSTRIP PROPAGATION DELAY MATCHING THROUGH CONTROL OF TRACE WIDTH
#249Configuration element for printed circuit board assemblies
#250Dual-drill printed circuit board via
#251Printed circuit board and method of manufacturing the same
#252Signal transmitting apparatus and image forming apparatus
#253Printed circuit board via design
#254Method for producing a printed circuit board
#255Modular connector plug for high speed data transmission networks
#256Interconnect structure and method of manufacturing the same
#257WIRING BOARD AND METHOD FOR DESIGNING SAME
#258ESD protection circuit, differential transmission line, common mode filter circuit, ESD protection device, and composite device
#259Transmission line structure having orthogonally oriented transmission line segments connected by vias extending through a substrate body
#260Band pass filter-based galvanic isolator
#261Printed circuit board for reducing common mode current and a method thereof
#262Circuit board and electronic circuit module using the same
#263Spread weave induced skew minimization
#264Printed circuit board and optical module
#265Differential signal line wiring method and PCB board
#266Circuit board structure with selectively corresponding ground layers
#267Resource allocation for traffic-profile-dependent scheduling request
#268Crosstalk reduction in electrical interconnects
#269Wiring board and electronic device
#270Printed circuit board including differential transmission lines thereon and having a conductive structure which provides immunity to common-mode noise
#271Defected ground structure to minimize EMI radiation
#272Electrical interposer
#273Printed wiring board
#274Printed circuit board, printed wiring board, and differential transmission circuit
#275Printed circuit board and method of manufacturing the same
#276Patterned ground structure filter designs with improved performance
#277Triangular routing for high speed differential pair length matching
#278Multi-layer circuit structure
#279Connecting adapter for a connecting terminal assembly
#280Backplane footprint for high speed, high density electrical connectors
#281Multilayer substrate
#282Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#283Compensating for intra-pair skew in differential signaling
#284High-speed data communications connector
#285Printed wiring board, information communication device, and display system
#286Spanning tree protocol optimization
#287Cable having improved arrangement of power wires
#288Rigid-flex assembly for high-speed sensor module comprising a flexible wiring section with dual flexible strips stacked and attached together
#289Printed circuit and circuit board assembly configured for quad signaling
#290Electronic device
#291Transmission line cable
#292Method for producing a printed circuit board
#293Transmission line and electronic device
#294Circuit board via configurations for high frequency signaling
#295Method of fabricating an electrical filter for use with superconducting-based computing systems
#296Capacitive compensation structures using partially meshed ground planes
#297Optical module
#298Interconnect structure for E/O engines having impedance compensation at the integrated circuits' front end
#299Edge fingers of multi-layer printed circuit board
#300Electronic apparatus, electrical element, and electrical element tray