Noise suppression structure

Corles multi-layer circuit substrate with minimized pad capacitance

Coreless multi-layer circuit substrate with minimized pad capacitance

High-frequency circuit board

Circuit board

Providing selective via plating using laser resin activation

Resonant via structures in multilayer substrates and filters based on these via structures

PRINTED CIRCUIT BOARD WITH REFERENCE LAYER HOLE

Signal Wiring Board and Signal Transmission Circuit

CIRCUIT BOARD

THROUGH VIA INDUCTOR OR TRANSFORMER IN A HIGH RESISTANCE SUBSTRATE WITH PROGRAMMABILITY

Printed circuit board

SIGNAL TRANSFER CIRCUIT

Relief plug-in connector and multilayer circuit board

Differential signal pair transmission structure, wiring board and electronic module

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

Printed wiring board and method for manufacturing the same

Printed circuit board

Z-DIRECTED CAPACITOR COMPONENTS FOR PRINTED CIRCUIT BOARDS

Printed circuit board via model design for high frequency performance

Through-hole-vias in multi-layer printed circuit boards

Equalizer circuit and printed circuit board

Through-hole-vias in multi-layer printed circuit boards

SYSTEMS FOR SURFACE MOUNTING AN INTEGRATED CIRCUIT USING A Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENT

MICROWAVE FILTER

CORE VIA FOR CHIP PACKAGE AND INTERCONNECT

Printed circuit board with compound via

PRINTED CIRCUIT BOARD HAVING DIFFERENTIAL VIAS

Resonant elements designed vertically in a multilayer board and filters based on these elements

Z-directed pass-through components for printed circuit boards

Self referencing pin

SPLIT WAVE COMPENSATION FOR OPEN STUBS

Printed circuit board

Etching device and method for manufacturing printed circuit board using same

Noise suppressor for semiconductor packages

Back Drill Verification Feature

Through via inductor or transformer in a high-resistance substrate with programmability

Wiring board and method for manufacturing the same

Broadband transition from a via interconnection to a planar transmission line in a multilayer substrate

Computer motherboard

Circuit board having holes to increase resonant frequency of via stubs

Printed circuit board and method of manufacturing the same

Filter based on a combined via structure

Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters

Circuit board having improved ground vias

PRINTED CIRCUIT BOARD WITH ANTENNA FOR RFID CHIP AND METHOD FOR MANUFACTURING THE SAME

Wiring board

Electronic circuit

Coreless multi-layer circuit substrate with minimized pad capacitance

Interconnect for high-frequency printed circuit

Via structure for multi-gigahertz signaling

Method and structure for coaxial via routing in printed circuit boards for improved signal integrity

Structure for enhancing reference return current conduction

High impedance electrical connection via

Printed circuit board

Multilayer substrate

Through hole-vias in multi-layer printed circuit boards

Z-directed filter components for printed circuit boards

Z-directed pass-through components for printed circuit boards

Z-directed variable value components for printed circuit boards

Z-directed connector components for printed circuit boards

Z-directed capacitor components for printed circuit boards

Z-Directed Components for Printed Circuit Boards

Core via for chip package and interconnect

PRINTED CIRCUIT BOARD AND METHOD FOR DRILLING HOLE THEREIN

Method for assuring counterbore depth of vias on printed circuit boards and printed circuit boards made accordingly

Impedance matched circuit board

Printed wiring board and electronic-component package

Electronic device assemblies including conductive vias having two or more conductive elements

Multi-layer substrate

METHOD FOR REMOVING A STUB OF A VIA HOLE AND A PRINTED CIRCUIT BOARD DESIGNED BASED ON THE METHOD

High frequency and wide band impedance matching via

Automatic system and method for providing PCB layout

Via design apparatus and via design method based on impedance calculations

PRINTED CIRCUIT BOARD

Filter

Using dielectric substrates, embedded with vertical wire structures, with slotline and microstrip elements to eliminate parallel-plate or surface-wave radiation in printed-circuits, chip packages and antennas

Printed wiring board, and design method for printed wiring board

Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages

Radio frequency interconnect circuits and techniques

Printed Circuit Boards, Printed Circuit Board Capacitors, Electronic Filters, Capacitor Forming Methods, and Articles of Manufacture

Printed wiring board

System and method for stub tuning in an information handling system

Radio frequency multilayer substrate and manufacturing method of radio frequency multilayer substrate

Radio frequency interconnect circuits and techniques

PRINTED CIRCUIT BOARD

Wiring board and electrical signal transmission system

Printed circuit board

Semiconductor chip package and printed circuit board having through interconnections

System for interconnecting two substrates each comprising at least one transmission line

S-TURN VIA AND METHOD FOR REDUCING SIGNAL LOSS IN DOUBLE-SIDED PRINTED WIRING BOARDS

Integrated circuit package for high-speed signals

CIRCUIT BOARD AND CONDUCTIVE THROUGH HOLE STRUCTURE THEREOF

Printed circuit board with differential traces

Compact via transmission line for printed circuit board and design method of the same

Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages

Printed wiring board

METHOD AND SYSTEM FOR REDUCING VIA STUB RESONANCE

Non-coplanar high-speed interconnects

Broadband transition from a via interconnection to a planar transmission line in a multilayer substrate

Via structure for improving signal integrity

Split wave compensation for open stubs

High-speed router with backplane using tuned-impedance thru-holes and vias

Multilayer high-frequency circuit board

Via structure of printed circuit board

Calibration method of insulating washer in circuit board

Printed circuit board

Methods of designing multilayer circuitry, multilayer circuit design apparatuses, and computer-usable media

SEMICONDUCTOR SUBSTRATE FOR TRANSMITTING DIFFERENTIAL PAIR

Composite via structures and filters in multilayer printed circuit boards

Apparatus and method for a printed circuit board that reduces capacitance loading of through-holes

VIA STRUCTURE OF PRINTED CIRCUIT BOARD

High-speed signal transmission structure having parallel disposed and serially connected vias

Printed wiring board

PRINTED CIRCUIT BOARDS AND THE LIKE WITH IMPROVED SIGNAL INTEGRITY FOR DIFFERENTIAL SIGNAL PAIRS

Method and apparatus for a high frequency coaxial through hole via in multilayer printed circuit boards

Semiconductor package substrate

Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods

Impedance matching via structure for high-speed printed circuit boards and method of determining same

Suppression method and structure for reducing a via stub effect of a substrate

Multilayer printed circuit board for high-speed differential signal, communication apparatus, and data storage apparatus

Adjusting a characteristic of a conductive via stub in a circuit board

System to control signal line capacitance

Printed circuit board including pads with vacancies

Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers

Printed circuit board with differential vias arrangement

Impedance controlled via structure

Compact via transmission line for printed circuit board and its designing method

Apertures for signal shaping using ground and signal PTH back-drilling

Via connection structure with a compensative area on the reference plane

Electronic circuit for high speed signal transmission

Transmission line and wiring forming method

Multilayer interconnection board

High frequency and wide band impedance matching via

Printed circuit boards and the like with improved signal integrity for differential signal pairs

Multilayer board and a semiconductor device

Component for impedance matching

Multi-layer printed circuit board comprising a through connection for high frequency applications

Radio frequency (RF) circuit board topology

Method and structure to wire electronic devices

Printed circuit board for high-speed electrical connectors

Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies

Wiring board providing impedance matching

High frequency via

Printed circuit board including via contributing to superior characteristic impedance

Signal transmitting device with vias and solder balls

Preferential ground and via exit structures for printed circuit boards

Radio frequency (RF) circuit board topology

Multilayered circuit board for high-speed, differential signals

Structure of stacked vias in multiple layer electrode device carriers

Multi-layer substrate having impedance-matching hole

Method of fabricating the routing of electrical signals

High-frequency signal transmitting device

Printed wiring board having impedance-matched differential pair signal traces

Alternating voided areas of anti-pads

Partially voided anti-pads

Ground terminal and electronic device

Shared vias for differential pair trace routing

Circuit board devices with reconfigurable connections

Circuit fabrication method that includes reconfiguration of via connections between circuit elements

Reconfigurable circuit devices

Measuring effective dielectric constant using via-stub resonance

Substrate-integrated device and method for making the same

Implementing embedded wire repair for PCB constructs

Printed circuit board with connector header mounted to bottom surface