IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD

CHARACTERISTIC IMPEDANCE CONTROL STRUCTURE

PRINTED CIRCUIT BOARD WITH IMPEDANCE MATCHING THROUGH CONNECTIONS

ELECTRONIC CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

COLLAPSE-FREE CIRCUIT STRUCTURE WITH LOW CAPACITANCE EFFECT

VERTICAL CONDUCTIVE STRUCTURE TRANSITION IMPEDANCE OPTIMIZATION

NOVEL HIGH-SPEED VIA IMPEDANCE MATCHING METHODOLOGY USING LOW DIELECTRIC CONSTANT BACKDRILL FILLING MATERIAL

CONTROLLING DEPTH OF PENETRATION OF BACKDRILL CAVITY FILLING BY ADJUSTING INITIAL AMBIENT PRESSURE

PER LAYER ANTI-PAD STRUCTURE FOR BALL GRID ARRAY PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURE

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD

IMPEDANCE TUNING OF MICROSTRIP TRACES

CIRCUIT BOARD DEVICE

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIGNAL PATHS CONNECTING TWO TRACES IN A PRINTED CIRCUIT BOARD

IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD

Stripline Wafer for Wafer Based Connector System

MATCHING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

PACKAGE COMPONENT

Mating backplane for high speed, high density electrical connector

CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE

COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY

MULTILAYER SUBSTRATE

Backplane footprint for high speed, high density electrical connectors

ELECTRONIC DEVICE

Layout of signal traces

DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY

DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY

High-frequency board, high-frequency package, and high-frequency module

Package component and forming method thereof

Wideband routing techniques for PCB layout

Fluoroscopic imaging-compatible and X-ray dose reducing electromagnetic field generator for electromagnetic tracking

PRINTED CIRCUIT BOARD

Branch coupler having U-shaped and L-shaped microstrip lines

Circuit signal enhancement method of circuit board and structure thereof

Grounding structure for a printed circuit board of an information handling system

Circuit board having complementary signal conducting patterns

HIGH-FREQUENCY CIRCUIT MODULE

Systems and methods for break out of interconnections for high-density integrated circuit packages on a multi-layer printed circuit board

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

Mating backplane for high speed, high density electrical connector

Wide band printed circuit board through connector

Integration of passive microwave stop-band filter into a radio frequency (RF) interconnect printed circuit board for opto-electronic module RF bandwidth control

VIA STRUCTURE, METHOD FOR PREPARING SAME AND METHOD FOR REGULATING IMPEDANCE OF VIA STRUCTURE

HIGH-FREQUENCY CIRCUIT

High frequency filter

Electronic-component carrier board and a wiring method for the same

Backplane footprint for high speed, high density electrical connectors

Trace embedded probe device

Substrate, electronic circuit, antenna apparatus, electronic apparatus, and method for producing a substrate

Resonant-coupled transmission line

MODE CONVERTER

CO-AXIAL VIA STRUCTURE AND MANUFACTURING METHOD OF THE SAME

Multilayer circuit board

Capacitive compensation for vertical interconnect accesses

Electronic device including connector

Through-hole via and circuit board

Capacitive compensation for vertical interconnect accesses

Power Divider

High powered RF part for improved manufacturability

Substrate and electronic device

High-data throughput reconfigurable computing platform

Circuit board, apparatus and method for forming via hole structure

High-frequency board, high-frequency package, and high-frequency module

Printed circuit board having commoned ground plane

Backplane footprint for high speed, high density electrical connectors

Structure for circuit interconnects

Backplane footprint for high speed, high density electrical connectors

Component-incorporated substrate and method for manufacturing same

Simultaneous and selective wide gap partitioning of via structures using plating resist

Mating backplane for high speed, high density electrical connector

Methods of manufacturing a high impedance surface (HIS) enhanced by discrete passives

Printed circuit boards with non-functional features

INDUCTOR ASSEMBLY AND APPARATUS WITH IMPEDANCE MATCHING NETWORK

Printed circuit board having commoned ground plane

System and method for via optimization in a printed circuit board

High-frequency board, high-frequency package, and high-frequency module

Millimeter wave impedance matching structures

Sideband conductor resonance mitigation

High frequency filter

Interlayer region having a signal via for coupling between planar signal lines, where a multi-mode signal propagates through the interlayer region

Printed circuit boards with non-functional features

Transmission line and electronic device

Backplane footprint for high speed, high density electrical connectors

Coupled via structure, circuit board having the coupled via structure and method of manufacturing the circuit board

Printed circuit board having commoned ground plane

Impedance control using anti-pad geometries

Backplane footprint for high speed, high density electrical connectors

Printed circuit board and display apparatus

Clearance size reduction for backdrilled differential vias

Systems and methods for interconnecting and isolating antenna system components

Interlayer transmission line

Multilayer printed circuit board and electronic device including the same

Implementing embedded wire repair for PCB constructs

Mating backplane for high speed, high density electrical connector

Simultaneous and selective wide gap partitioning of via structures using plating resist

Flexible printed circuit board

Electronic apparatus having package base substrate

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

Structure for circuit interconnects

Conductor Track With Enlargement-Free Transition Between Conductor Path and Contact Structure

Method of implementing stub-less PCB vias

Signal handling device including a surface integrated waveguide and a resonating cavity formed in multiple substrate layers

Communication channel with tuning structure

Transmission line and electronic device

Conductive polymers within drilled holes of printed circuit boards

Circuit board arrangement for signal supply to a radiator

Stepped vias for next generation speeds

DUAL-DRILL PRINTED CIRCUIT BOARD VIA

Multilayer substrate

Printed circuit board (PCB) with stubs coupled to electromagnetic absorbing material

Coupled via structure, circuit board having the coupled via structure

Via stub elimination by disrupting plating

Via stub elimination by disrupting plating

FLEXIBLE PRINTED CIRCUIT BOARD AND OPTICAL MODULE

Printed circuit board for integrated LED driver

Backplane footprint for high speed, high density electrical connectors

Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion

Circuit substrate

Printed circuit via for KA satcom circuit boards

RF transition assembly comprising an open coaxial structure with a cavity for receiving a conductor that is coupled orthogonal to an RF transmission layer

WIRING BOARD AND MANUFACTURING METHOD FOR WIRING BOARD

Backplane footprint for high speed, high density electrical connectors

Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board

Simultaneous and selective wide gap partitioning of via structures using plating resist

Impedance matching structure of transmission line in multilayer circuit board

Device, system and method to promote the integrity of signal communications

Systems and methods for frequency shifting resonance of an unused via in a printed circuit board

Antenna module and electronic device

Conductive polymers within drilled holes of printed circuit boards

Sideband conductor resonance mitigation

Routing-over-void-T-line-compensation

Mating backplane for high speed, high density electrical connector

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

Circuit board

PACKAGED RF CIRCUITS AND RADIO UNIT

Method for impedance compensation in printed circuit boards

Structure to dampen barrel resonance of unused portion of printed circuit board via

Flexible circuit board having enhanced bending durability

Surface mounted device module

Differential signal transmitting circuit board

Circuit board with return path separated low crosstalk via transition structure

Multilayer printed circuit board and electronic device including the same

HIGH SPEED COMMUNICATION JACK

Via model generation method, information processing device, and non-transitory computer-readable recording medium storing via model generation program

Wiring board and manufacturing method for same

Multilayer substrate comprising a flexible element assembly and conductor layers

Signal transmission component and electronic device

Electrical interface for package and die

Simultaneous and selective wide gap partitioning of via structures using plating resist

Dual-drill printed circuit board via

Backplane footprint for high speed, high density electrical connectors

Mating backplane for high speed, high density electrical connector

Printed circuit board for integrated LED driver

Transmission line structure having orthogonally oriented transmission line segments connected by vias extending through a substrate body

Electrical contact pad for electrically contacting a connector

Antenna module

Impedance matching structure of transmission line

Electrical shielding using bar vias and associated methods

Electrical interposer

High powered RF part for improved manufacturability

Antenna module and electronic device

Multi-layer circuit structure

Method of manufacturing a signal transition component having a C-shaped conducting frame

Impedance compensation structure for broadband near-field magnetic-field probe and its construction method

High speed communication jack

Method for producing a printed circuit board

Multilayer laminated substrate structure

Transmission line and electronic device

Circuit board via configurations for high frequency signaling

Concentric vias and printed circuit board containing same

Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board

Pad-array structure on substrate for mounting IC chip on substrate, and optical module having said pad-array structure

Printed circuit board with a differential line pair having vias in each line that are not equally spaced apart

Conductor track with enlargement-free transition between conductor path and contact structure

Circuit structure

Signal path in radio-frequency module having laminate substrate

Sideband conductor resonance mitigation

Compact via structures and method of making same

Multilayer printed wiring board, and connection structure of multilayer printed wiring board and connector

Printed wiring board

Circuit board, electronic device, and method of manufacturing circuit board

Residual material detection in backdrilled stubs

Breakout via system

Method for producing a printed circuit board

Coreless multi-layer circuit substrate with minimized pad capacitance

Printed circuit board having a circular signal pad surrounded by a ground pad and at least one recess section disposed therebetween

Signal transmission board and method for manufacturing the same

Reducing impedance discontinuities on a printed circuit board (‘PCB’)

Interconnect topology with staggered vias for interconnecting differential signal traces on different layers of a substrate

Printed circuit board copper plane repair

Mating backplane for high speed, high density electrical connector

Mating backplane for high speed, high density electrical connector

Flexible printed circuit board and method for manufacturing same

Mating backplane for high speed, high density electrical connector

Backdrill reliability anchors

Multilayer printed board and layout method for multilayer printed board

Circuit substrate and electronic device

Optical module, optical transceiver, printed circuit board, and flexible printed circuit board

Radio frequency connection arrangement

Signal path in radio-frequency module having laminate substrate

Signal transmission component and electronic device

Architecture of drive unit employing gallium nitride switches

3-D integrated package

Signal transmission circuit and printed circuit board

Printed wiring board, electronic device, and wiring connection method

Method for manufacturing mode converter

Residual material detection in backdrilled stubs

Electronic device assemblies including conductive vias having two or more conductive elements

Printed wiring board and printed circuit board

Method of making a printed circuit board copper plane repair

Printed circuit board and manufacturing method therefor

Attenuation reduction structure for high frequency signal connection pads of circuit board with insertion component

Electromagnetic field manipulation around vias

Backdrilling method, and backdrilling apparatus

Printed circuit board

Wiring board and method of manufacturing wiring board

Circuit component bridge device

Structure to dampen barrel resonance of unused portion of printed circuit board via

Systems and methods for frequency shifting resonance of an unused via in a printed circuit board

Antenna array feeding structure having circuit boards connected by at least one solderable pin

Electric component module

High-frequency signal transmission line and electronic device

Printed circuit board copper plane repair

Methods for manufacturing a Z-directed printed circuit board component having a removable end portion

Adding test access to a back-drilled VIA

Wiring board to mount a semiconductor element

Method of forming micro via in printed circuit board

Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of vias

Circuit board via configurations for high frequency signaling

Interconnection substrate

Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board

Multilayer wiring board with metal foil wiring layer, wire wiring layer, and interlayer conduction hole

High-frequency signal line

High-frequency signal line

Z-directed capacitor components for printed circuit boards

Printed wiring board and method for manufacturing printed wiring board

Multi-layer printed circuit board and method for fabricating multi-layer printed circuit board

Uniform impedance circuit board

Circuit board and electronic device

Coupled vias for channel cross-talk reduction

Simultaneous and selective wide gap partitioning of via structures using plating resist

Wiring substrate for a semiconductor device having differential signal paths

Concept for extracting a signal being exchanged between a device under test and an automatic test equipment

Systems and methods for frequency shifting resonance of an unused via in a printed circuit board

Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects

Optimized via cutouts with ground references

Storage system and printed circuit board

Connector footprints in printed circuit board (PCB)

Apparatus for differential far-end crosstalk reduction

Current breaker and wireless communication device having the same

Structure for connecting electrical trace lines of printed circuit boards and optical transceiver module with the same

High frequency device

Through-hole-vias in multi-layer printed circuit boards

Semiconductor device and circuit board

Multilayer wiring board

Flexible printed circuit board and circuit-board connection structure

High-speed pluggable rigid-end flex circuit

Via structure having open stub and printed circuit board having the same

Transmission system and method for constructing backplane system

High performance connector contact structure

Low cost, high performance RF connector

Printed circuit board for RF connector mounting

Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENTS HAVING A REMOVABLE END PORTION AND METHODS THEREFOR

Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material

Package with integrated pre-match circuit and harmonic suppression

Conductor structure with integrated via element

Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component

Z-directed printed circuit board components having conductive channels for reducing radiated emissions

Z-directed printed circuit board components having different dielectric regions

Method for manufacturing circuit board having holes to increase resonant frequency of via stubs

3-D integrated package

Electronic device assemblies including conductive vias having two or more conductive elements

Printed circuit board

MULTILAYER WIRING BOARD AND ELECTRONIC DEVICE

Structured circuit board and method

Circuit board

Printed circuit board

Circuit boards with vias exhibiting reduced via capacitance

Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission

Process for providing electrical connections with reduced via capacitance on circuit boards

Asymmetrical multilayer substrate, RF module, and method for manufacturing asymmetrical multilayer substrate

Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board

Via structures and compact three-dimensional filters with the extended low noise out-of-band area

Multiple layer printed circuit board with unplated vias

Extrusion process for manufacturing a Z-directed component for a printed circuit board

Wiring substrate and method of manufacturing the same

Wiring substrate and semiconductor package

ELECTROMAGNETIC FIELD COUPLING STRUCTURE, MULTI-LAYER TRANSMISSION-LINE PLATE, METHOD OF MANUFACTURING ELECTROMAGNETIC FIELD COUPLING STRUCTURE, AND METHOD OF MANUFACTURING MULTI-LAYER TRANSMISSION-LINE PLATE

Via structure for transmitting differential signals

Via structure for transmitting differential signals

Via structure for transmitting differential signals

Screening process for manufacturing a Z-directed component for a printed circuit board

Die press process for manufacturing a Z-directed component for a printed circuit board

Spin coat process for manufacturing a Z-directed component for a printed circuit board

Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters

Substrate having a plural diameter via