ClassID:

233713

H05K1/092 - page 4 - CPC Classification

Classification description:

Printed circuits; Details; Use of materials for the conductive, e.g. metallic pattern Dispersed materials, e.g. conductive pastes or inks

Recent Application in this class:
#901
20070104605
2007-05-10

Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom

#902
20070102710
2007-05-10

Lighting Device And Method

#903
20070080329
2007-04-12

Electrically conductive paste and multilayer ceramic substrate

#904
20070079868
2007-04-12

Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof

#905
20070077687
2007-04-05

METHOD OF PRODUCING CIRCUIT CARRIERS WITH INTEGRATED PASSIVE COMPONENTS

#906
20070057385
2007-03-15

Apparatus for applying conductive paste onto electronic component

#907
20070054104
2007-03-08

Spin-printing of electronic and display components

#908
20070032078
2007-02-08

Suspension for filling via holes in silicon and method for making the same

#909
20070023388
2007-02-01

Conductor composition for use in LTCC photosensitive tape on substrate applications

#910
20070003781
2007-01-04

Electrical components and method of manufacture

#911
20070001152
2007-01-04

Conductive paste for multilayer electronic components and multilayer electronic component using same

#912
20070000686
2007-01-04

System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects

#913
20060286722
2006-12-21

Methods for making microwave circuits

#914
20060284553
2006-12-21

APPLYING A DISCONTINUOUS THIN LAYER ON A SUBSTRATE

#915
20060284280
2006-12-21

Electrodes, inner layers, capacitors, electronic devices and methods of making thereof

#916
20060282999
2006-12-21

Electrodes, inner layers, capacitors and printed wiring boards and methods of making thereof - part II

#917
20060280919
2006-12-14

Wiring substrate and bonding pad composition

#918
20060280918
2006-12-14

Wiring substrate

#919
20060273460
2006-12-07

Structure for determining thermal cycle reliability

#920
20060270079
2006-11-30

Method and circuit structure employing a photo-imaged solder mask

#921
20060266983
2006-11-30

Inhibitor particles, method of production of same, electrode paste, method of production of electronic device

#922
20060255102
2006-11-16

Technique for defining a wettable solder joint area for an electronic assembly substrate

#923
20060251818
2006-11-09

Method for forming transparent conductive film and transparent electrode

#924
20060240231
2006-10-26

Method for improving the thermal cycled adhesion of thick-film conductors on dielectric

#925
20060236533
2006-10-26

Method for LTCC circuitry

#926
20060231804
2006-10-19

Method of manufacture of semiconductor device and conductive compositions used therein

#927
20060231803
2006-10-19

Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom

#928
20060231802
2006-10-19

Electroconductive thick film composition, electrode, and solar cell formed therefrom

#929
20060231801
2006-10-19

Conductive compositions and processes for use in the manufacture of semiconductor devices

#930
20060231800
2006-10-19

Conductive compositions used in the manufacture of semiconductor device

#931
20060228533
2006-10-12

Discharging solution, method for producing patterns and method for producing for producing an electronic device using the discharging solution, and electronic device

#932
20060222889
2006-10-05

Conductivity variable composition, conductivity variable laminated body, and conductive pattern formed body

#933
20060199096
2006-09-07

Process for thick film circuit patterning

#934
20060196599
2006-09-07

Method of processing composite green sheet

#935
20060189502
2006-08-24

Use of dispersions in making electronic devices

#936
20060186382
2006-08-24

Thick film resistor, manufacturing method thereof, glass composition for thick film resistor and thick film resistor paste

#937
20060185474
2006-08-24

Copper powder

#938
20060179975
2006-08-17

Metal powder for electrically conductive paste and electrically conductive paste

#939
20060163989
2006-07-27

Blue color filter, and organic electroluminescent device using the same

#940
20060147746
2006-07-06

Ceramic substrate, ceramic package for housing light emitting element

#941
20060141225
2006-06-29

Oxygen doped firing of barium titanate on copper foil

#942
20060125074
2006-06-15

Method of connecting internal silver traces to external gold to produce a gold external side metal for an LTCC package

#943
20060120015
2006-06-08

Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards

#944
20060118905
2006-06-08

Electronic part and manufacturing method thereof

#945
20060118804
2006-06-08

Wiring substrate for mounting light emitting element

#946
20060107791
2006-05-25

Silver powder and method for producing same

#947
20060103005
2006-05-18

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

#948
20060101639
2006-05-18

Innerlayer panels and printed wiring boards with embedded fiducials

#949
20060097246
2006-05-11

Method for making a passive device structure

#950
20060096780
2006-05-11

Thin film circuit integrating thick film resistors thereon

#951
20060087399
2006-04-27

Fine line thick film resistors by photolithography

#952
20060078829
2006-04-13

Method of patterning a thick-film paste material layer, method of manufacturing cold- cathode field emission device, and method of manufacturing a cold-cathode field emission display

#953
20060070493
2006-04-06

Fine metal hydride particles, their production process, dispersion containing fine metal hydride particles and metallic material

#954
20060065435
2006-03-30

Transparent substrate provided with electroconductive strips

#955
20060057827
2006-03-16

Method for manufacturing in electrically conductive pattern

#956
20060049131
2006-03-09

Ceramic electronic component and method for manufacturing the same

#957
20060046474
2006-03-02

Forming method of stacking structure and manufacturing method of electron source and image display apparatus using such method

#958
20060039821
2006-02-23

Method of suppressing the oxidation characteristics of nickel

#959
20060024901
2006-02-02

Method for fabricating a high-frequency and high-power semiconductor module

#960
20060022173
2006-02-02

Electrically conductive pastes

#961
20060016353
2006-01-26

Apparatus and method for side printing on low temperature co-fired ceramic (LTCC) substrates

#962
20060011896
2006-01-19

Conductive paste and multilayer ceramic electronic device and its method of production

#963
20060009036
2006-01-12

High thermal cycle conductor system

#964
20060001009
2006-01-05

Thick-film conductive paste

#965
20050287789
2005-12-29

Substrate with patterned conductive layer

#966
20050279970
2005-12-22

Spherical silver power and method for producing same

#967
20050277550
2005-12-15

Lead-free and cadmium-free conductive copper thick film pastes

#968
20050262966
2005-12-01

Nickel powders, methods for producing powders and devices fabricated from same

#969
20050257643
2005-11-24

Spherical silver powder and method for producing same

#970
20050254220
2005-11-17

Electronics unit

#971
20050224254
2005-10-13

Electronic device having side electrode, method of manufacturing the same, and apparatus using the same

#972
20050218506
2005-10-06

Non-magnetic, hermetically-sealed micro device package

#973
20050218382
2005-10-06

Uphill screen printing in the manufacturing of microelectronic components

#974
20050205197
2005-09-22

Dual composition ceramic substrate for microelectronic applications

#975
20050205195
2005-09-22

Method of forming one or more base structures on an LTCC cofired module

#976
20050204864
2005-09-22

Thick-film dielectric and conductive compositions

#977
20050200267
2005-09-15

Substrate having fine line, electron source and image display apparatus

#978
20050195554
2005-09-08

High tolerance embedded capacitors

#979
20050195052
2005-09-08

Methods and apparatus for printing conductive thickfilms over thickfilm dielectrics

#980
20050194575
2005-09-08

Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same

#981
20050191412
2005-09-01

Methods for making microwave circuits including a ground plane

#982
20050189630
2005-09-01

Bonding arrangement and method for LTCC circuitry

#983
20050186689
2005-08-25

Method and structure for determining thermal cycle reliability

#984
20050168197
2005-08-04

Power module

#985
20050167640
2005-08-04

Silver powder and method for producing same

#986
20050151303
2005-07-14

Method for producing ceramic substrate and electronic component module using ceramic substrate

#987
20050148164
2005-07-07

Suspension for filling via holes in silicon and method for making the same

#988
20050126682
2005-06-16

Monolithic ceramic substrate and method for making the same

#989
20050126003
2005-06-16

Method of manufacturing electronic component and member to be used in the same method

#990
20050126002
2005-06-16

Method of manufacturing electronic component and member to be used in the same method

#991
20050122018
2005-06-09

Light emitting assembly with heat dissipating support

#992
20050111206
2005-05-26

Method of making interlayer panels

#993
20050106369
2005-05-19

Thick film conductor case compositions for LTCC tape

#994
20050106337
2005-05-19

Transfer sheet

#995
20050104046
2005-05-19

Thick film conductor case compositions for LTCC tape

#996
20050101051
2005-05-12

Method of manufacturing an electroconductive film, and method of manufacturing an image forming apparatus including the electroconductive film

#997
20050097988
2005-05-12

Coated nickel-containing powders, methods and apparatus for producing such powders and devices fabricated from same

#998
20050095866
2005-05-05

Method for forming patterned conductive film, electrooptical device, and electronic appliance

#999
20050089679
2005-04-28

Spin-printing of electronic and display components

#1000
20050087841
2005-04-28

Multilayer electronic substrate, and the method of manufacturing multilayer electronic substrate

#1001
20050084661
2005-04-21

Method for producing wiring substrate

#1002
20050082648
2005-04-21

Ceramic package and chip resistor, and methods for production of the same

#1003
20050079338
2005-04-14

Method of heat treatment, method for forming wiring pattern, method for manufacturing electro-optic device, and electro-optic device and electronic apparatus

#1004
20050070376
2005-03-31

Antenna systems for findable balls

#1005
20050070375
2005-03-31

Apparatuses and methods relating to findable balls

#1006
20050067188
2005-03-31

Method of fabricating a thin film integrated circuit with thick film resistors

#1007
20050063135
2005-03-24

High tolerance embedded capacitors

#1008
20050061107
2005-03-24

Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom

#1009
20050051356
2005-03-10

Copper paste and wiring board using the same

#1010
20050048415
2005-03-03

Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet

#1011
20050042381
2005-02-24

Fully automated paste dispense process for dispensing small dots and lines

#1012
20050040930
2005-02-24

Fuel tank resistor card having improved corrosion resistance

#1013
20050040929
2005-02-24

Fuel tank resistor card having improved corrosion resistance

#1014
20050037278
2005-02-17

Photosensitive thick-film paste materials for forming light-transmitting electromagnetic shields, light-transmitting electromagnetic shields formed using the same, and method of manufacture thereof

#1015
20050035843
2005-02-17

Fuel tank resistor card having improved corrosion resistance

#1016
20050025945
2005-02-03

Dual composition ceramic substrate for microelectronic applications

#1017
20050019534
2005-01-27

Method for producing a hybrid product composed of several wiring planes, as well as a sensor or evaluation circuit and a control device with hybrid product produced by the inventive method

#1018
20050014091
2005-01-20

Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes

#1019
20050013989
2005-01-20

Aluminum nitride sintered compact having metallized layer and method for preparation thereof

#1020
20050000414
2005-01-06

Method and apparatus for applying conductive ink onto semiconductor substrates

#1021
17376718
2022-12-06

Appliance with modular user interface

#1022
17010676
2021-11-16

Electromagnetic interference shielding for packages and modules

#1023
16812972
2020-12-29

Electronic component embedded substrate

#1024
16564907
2020-05-12

Connection of multilayer printed conductive ink through filled microvias

#1025
16381074
2022-03-22

Additively manufactured metal energetic ligand precursors and combustion synthesis

#1026
16158239
2019-07-23

Method for improving adhesion between ceramic carrier and thick film circuit

#1027
16044962
2018-12-18

Attenuation reduction structure for flexible circuit board

#1028
15975279
2018-08-07

Magnetically enhanced electrical signal conduction apparatus and methods

#1029
15872038
2019-12-10

Athletic touch-sensing equipment

#1030
14918620
2016-08-30

Customizing connections of conductors of a printed circuit board

#1031
14683028
2019-06-25

Adhesive based reconfigurable electronic circuit building system

#1032
14593849
2017-01-24

Stretchable conductor design and methods of making

#1033
14482977
2017-06-06

Method of making copper pillar with solder cap

#1034
14310075
2015-11-17

Bonding pad for printed circuit board and semiconductor chip package using same

#1035
13242726
2016-10-04

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