233718 ⎘
Printed circuits; Details; Printed elements for providing electric connections to or between printed circuits; Pads for surface mounting, e.g. lay-out directly combined with via connections
Sub-classes:PRINTED CIRCUIT BOARD
#2PRINTED WIRING BOARD
#3SUBSTRATE STRUCTURE
#4NON-SHARED ANTIPADS OF POWER VIAS IN A PRINTED CIRCUIT BOARD
#5PRINTED CIRCUIT BOARD
#6SUBSTRATE STRUCTURE
#7SEMICONDUCTOR PACKAGE
#8TRANSDUCER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#9Coil Structure
#10WIRING SUBSTRATE
#11CIRCUIT BOARD ASSEMBLY AND PREPARATION METHOD FOR CIRCUIT BOARD ASSEMBLY
#12PLACEMENT OF POWER SWITCHING DEVICES ON THROUGH HOLES VIA PADS
#13WIRING SUBSTRATE
#14GRID ARRAY ELECTRICAL CONNECTORS
#15PRINTED CIRCUIT BOARD
#16CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
#17Thermal Management in Circuit Board Assemblies
#18ELECTRONIC DEVICE
#19MEMORY MODULE AND ELECTRONIC DEVICE ASSEMBLY INCLUDING THE SAME
#20BGA Radio Frequency Module, Substrate for BGA Radio Frequency Module and Optical Communication Module
#21ADAPTER BOARD AND MANUFACTURING METHOD THEREFOR, AND BOARD CARD CONNECTING STRUCTURE
#22PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#23THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME
#24FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM
#25ELECTRONIC MODULE AND ELECTRONIC TIMEPIECE
#26PRINTED CIRCUIT BOARD
#27ELECTRONIC DEVICE
#28CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS
#29WIRING BOARD AND LAMINATED WIRING BOARD
#30CIRCUIT BOARD
#31REUSABLE MODULAR SUBSTRATE
#32ELECTRONIC COMPONENT
#33SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME
#34SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME
#35WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD
#36PRINTED CIRCUIT BOARD
#37REDUCED BALL GRID ARRAY PAD CAPACITANCE
#38PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
#39THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH THE SAME
#40CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME
#41PRINTED WIRING BOARD
#42ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AND DISCRETE HEAT SINKS
#43ENDOSCOPE, PRINTED CIRCUIT BOARD OF AN ENDOSCOPE, AND METHOD FOR ELECTRICALLY CONNECTING A PRINTED CIRCUIT BOARD TO A STRUCTURAL ASSEMBLY
#44CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
#45CIRCUIT BOARD FOR SEMICONDUCTOR TESTING AND METHOD OF MANUFACTURING THE SAME
#46CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AND COMMUNICATION DEVICE
#47SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION
#48REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE
#49Thermal Management in Circuit Board Assemblies
#50SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
#51PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING
#52ELECTRONIC MODULE AND ELECTRONIC DEVICE
#53PRINTED CIRCUIT BOARD
#54HIGH-FREQUENCY SIGNAL TRANSMISSION DEVICE AND HIGH-FREQUENCY SIGNAL TRANSMISSION CABLE
#55CHIPLETS WITH CONNECTION POSTS
#56CIRCUIT BOARD WITH LOW GRAIN BOUNDARY DENSITY AND FORMING METHOD THEREOF
#57ELECTRICAL MODULE AND PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING AN ELECTRICAL MODULE
#58COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
#59INTEGRATED SUBSTRATE AND POWER INTEGRATED CIRCUIT
#60Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure
#61FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
#62CIRCUIT BOARD
#63Sensor interposer employing castellated through-vias
#64MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL WAVEGUIDE TRANSITION
#65Printed circuits with embedded resistive thermal devices
#66VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
#67POWER CONVERSION MODULE
#68Coil Structure
#69WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD
#70GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS CORE AND METAL VIAS AND PADS
#71Probe card device and circuit protection assembly thereof
#72Multilayer substrate
#73Multilayer substrate
#74CIRCUIT BOARD
#75Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure
#76PRINTED WIRING BOARD
#77Multi-layer printed circuit board
#78Circuit board assembly and electronic device including the same
#79WIRING SUBSTRATE
#80Circuit board structure
#81Power delivery network noise isolation in a computing device
#82Circuit board structure and manufacturing method thereof
#83Circuit board structure and manufacturing method thereof
#84CIRCUIT STRUCTURE
#85Wiring substrate
#86Display apparatus having grooved terminals
#87Printed circuit board
#88Contact arrangement and electronic assembly
#89Printed circuit board
#90Chiplets with connection posts
#91Printed circuit board
#92Systems and methods for break out of interconnections for high-density integrated circuit packages on a multi-layer printed circuit board
#93Wiring substrate
#94THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE
#95Method of improving wire structure of circuit board and improving wire structure of circuit board
#96Heat Sink Component With Land Grid Array Connections
#97SUBSTRATE STRUCTURE
#98Splicing display screen
#99Circuit board
#100Circuit board structure
#101Package board, antenna package including the same and image display device including the same
#102Guard trace ground via optimization for high-speed signaling
#103Auxiliary module for an electrical switching device, and associated switching device and monitoring system
#104Wiring substrate
#105Printed circuit board comprising via portions
#106Module substrate and semiconductor module including the same
#107INTEGRATED RF PASSIVE DEVICES ON GLASS
#108Control device and manufacturing method of control device
#109Display apparatus
#110MANUFACTURING METHOD OF PACKAGE STRUCTURE
#111Printed wiring board
#112Wiring substrate and method for manufacturing wiring substrate
#113Method for Forming Flipped-Conductor-Patch
#114Camera module and electronic device including the same
#115Printed circuit board
#116Electronic component mounting structure
#117Co-axial via structure
#118Circuit board and manufacture method of the circuit board
#119Wiring board and semiconductor module including the same
#120Substrate layered structure and interposer block
#121Printed circuit board for gallium nitride elements
#122Electronic component
#123Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
#124Lantern Battery Adapter
#125Printed circuit board
#126Electronic device including shielding member
#127Module substrate and semiconductor module including the same
#128Printed circuit board and electronic package comprising the same
#129Sensor interposer employing castellated through-vias
#130Adapter board and method for making adapter board
#131Probe card testing device
#132Board-to-board connecting structure and method for manufacturing the same
#133Storage devices and methods of operating storage devices
#134Circuit board with an embedded an electronic component and method for manufacturing the same
#135Circuit board
#136Display apparatus
#137Power conversion module and method of forming the same
#138Wiring board, composite substrate, and electric device
#139Fingerprint sensor and button combinations and methods of making same
#140Multilayer ceramic capacitor
#141Multilayer ceramic capacitor
#142Optical integration device
#143ALTERNATIVE CIRCUIT APPARATUS FOR LONG HOST ROUTING
#144Multi-dielectric structure in two-layer embedded trace substrate
#145Printed circuit board (PCB) connector interface module with heat and scratch resistant coverlay and accessory system
#146Printed circuit board and camera device comprising same
#147Circuit module and power supply chip module
#148Wiring board and electronic device module
#149ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD
#150Thermal management in circuit board assemblies
#151Component-incorporated substrate and method for manufacturing same
#152Manufacturing method of package structure
#153Wiring board and manufacture method thereof
#154Manufacturing method of carrier structure
#155Display apparatus having grooved terminals
#156Passive component adapter for downhole application
#157Fabricating transmon qubit flip-chip structures for quantum computing devices
#158Hermetic chip on board
#159Reel-to-reel lamination methods and devices in FPC fabrication
#160Reel-to-reel laser sintering methods and devices in FPC fabrication
#161Flipped-conductor-patch lamination for ultra fine-line substrate creation
#162Reel-to-reel flexible printed circuit fabrication methods and devices
#163Reel-to-reel laser ablation methods and devices in FPC fabrication
#164Sn—Bi and copper powder conductive paste in through hole of insulating substrate
#165Printed circuit board including auxiliary power supply and electronic apparatus including the same
#166Fastening flat conductor in an electrical assembly
#167Method for manufacturing interposer
#168Sandwich-molded cores for high-inductance architectures
#169Circuit board and method for manufacturing the same
#170Printed circuit board having a differential pair routing topology with negative plane routing and impedance correction structures
#171Fabricating transmon qubit flip-chip structures for quantum computing devices
#172Printed circuit board
#173Multilayer ceramic substrate and method of manufacturing multilayer ceramic substrate
#174Flexible circuit board and electronic device comprising same
#175Wiring substrate
#176Printed wiring board and method for manufacturing printed wiring board
#177Hermetic chip on board
#178Method for fabricating electronic package
#179Wiring substrate
#180System and method to provide connection pads for high speed cables
#181Printed circuit board stack structure and method of forming the same
#182Multilayer flex circuit with non-plated outer metal layer
#183Wiring substrate
#184Wiring substrate
#185Multilayer board insulating sheet, multilayer board, and method of manufacturing multilayer board
#186Wiring substrate
#187Electronic device
#188Coil assembly
#189Wiring board and method for manufacturing the same
#190Circuit Board with Improved Thermal, Moisture Resistance, and Electrical Properties
#191Information handling system comprising a processor coupled to a board and including a differential trace pair having a first straight differential trace and a second serpentine shape differential trace
#192Sensor interposer employing castellated through-vias
#193Chiplets with connection posts
#194DISPLAY APPARATUS
#195Method for producing a printed circuit board having thermal through-contacts
#196Implantable connector including at least one electrical component
#197Wiring board
#198Reflow grid array to support late attach of components
#199Printed circuit board and method of manufacturing a printed circuit board
#200Printed circuit board
#201Method of utilizing serpentine regions
#202Circuit board and electrical connector with the same
#203Circuit board assembly and electronic device including the same
#204Additive manufactured 3D electronic substrate
#205Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Creation
#206Chiplets with connection posts
#207Circuit substrate, component-mounted substrate, and methods of manufacturing circuit substrate and component-mounted substrate
#208High bandwidth memory package for high performance processors
#209PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#210Substrate pad structure
#211Electronic switch module with an integrated flyback diode
#212Electronic switch module with oppositely-arranged power switches and discrete heat sinks
#213Manufacturing method of double layer circuit board
#214Low-frequency treatment device, body for low-frequency treatment device, and combination of pad and holder for low-frequency treatment device
#215Chiplets with connection posts
#216Electronic components
#217Trace/via hybrid structure multichip carrier
#218Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
#219Component carrier connected with a separate tilted component carrier for short electric connection
#220Electronic module power supply
#221Antenna structure with integrated coupling element and semiconductor package using the same
#222Printed circuit board assembly
#223Connection assembly for connecting a thin conductor piece to a thick conductor piece
#224Method for manufacturing a high-current printed circuit board
#225Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure
#226Embedded power module
#227Electronic package and method for fabricating the same
#228Sensor interposer employing castellated through-vias
#229System and method of utilizing serpentine regions
#230Electronic components
#231Fingerprint sensor and button combinations and methods of making same
#232Method for manufacturing flexible printed circuit board
#233Package structure and manufacturing method thereof
#234Component carrier comprising a copper filled multiple-diameter laser drilled bore
#235ALTERNATIVE CIRCUIT APPARATUS FOR LONG HOST ROUTING
#236Wiring board
#237Printed circuit board, memory module and memory system including the same
#238Display device and electronic apparatus
#239Solder resist layer structures for terminating de-featured components and methods of making the same
#240Glass
#241Display apparatus having grooved terminals
#242PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD
#243Hybrid interconnect device and method
#244Fine pitch component placement on printed circuit boards
#245Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion
#246Capacitor module, resonator, wireless power transmission device, wireless power reception device, and wireless power transmission system
#247Component carrier having a three dimensionally printed wiring structure
#248Area-efficient connections to SIP modules
#249CIRCUIT FOR MEMORY SYSTEM AND ASSOCIATED METHOD
#250Segmented via for vertical PCB interconnect
#251Multilayer ceramic substrate and electronic device
#252Printed circuit board and method for manufacturing the same
#253Component-embedded substrate and method for manufacturing component-embedded substrate
#254Electronic module power supply
#255Electronic module and method for producing same
#256Multilayer structure and related method of manufacture for electronics
#257PCB optical isolation by nonuniform catch pad stack
#258Wiring substrate
#259Semiconductor device
#260Trace/via hybrid structure multichip carrier
#261Pad patterns
#262Electronic assembly
#263Method for manufacturing an electronic assembly
#264Cable assembly for an information handling system
#265Circuit board including dummy electrode formed on substrate
#266Apparatus and method for RF isolation in a packaged integrated circuit
#267Implantable connector with two electrical components
#268Printing apparatus and power supply unit for printing apparatus
#269Photosensitive and via-forming circuit board
#270Multi-layer circuit member with reference planes and ground layer surrounding and separating conductive signal pads
#271Solder resist layer structures for terminating de-featured components and methods of making the same
#272Substrate and method for manufacturing the same
#273Method for impedance compensation in printed circuit boards
#274Wiring substrate
#275Semiconductor device, chip module, and semiconductor module
#276Wiring substrate and semiconductor device
#277Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board
#278Manufacturing method of double layer circuit board
#279SYSTEM AND METHOD FOR IMPROVING ISOLATION IN HIGH-DENSITY LAMINATED PRINTED CIRCUIT BOARDS
#280Circuit board and circuit device
#281Tamper-respondent assemblies with enclosure-to-board protection
#282Display device on a substrate connected to another substrate with contact pads, vias, and conductive traces
#283Stretchable and flexible electrical substrate interconnections
#284Suspension board with circuit having thinned insulating second portion overlapping second terminal
#285Flexible circuit with redundant connection points for ultrasound array
#286Printed circuit board and vibration actuator including the same
#287Wiring substrate and semiconductor package
#288Embedded power module
#289Electrical device, model series of electrical devices, and production method
#290PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#291Substrates with ultra fine pitch flip chip bumps
#292Interposers with electrically conductive features having different porosities
#293Porous alumina templates for electronic packages
#294Display apparatus having grooved terminals
#295Printed circuit board and method of manufacturing the same
#296Substrate pad structure
#297Wiring board for fingerprint sensor
#298Connections between laminated heater and heater voltage inputs
#299Double layer circuit board
#300Printed wiring board and method for manufacturing the same