Electronic component mounting board

Method for fabricating ceramic insulator for electronic packaging

Printed wiring board and method for manufacturing the same

Component carrier comprising a copper filled multiple-diameter laser drilled bore

Fingerprint sensor and button combinations and methods of making same

Printed wiring board

Component carrier with different surface finishes

Tamper-respondent assemblies with enclosure-to-board protection

Fingerprint sensing device

Semiconductor device having polyimide layer

Method of forming an electrical interconnect

Ceramic insulator for electronic packaging and method for fabricating the same

Flexible printed circuit board for optical module

Semiconductor package assemblies with system-on-chip (SOC) packages

DIMM connector region vias and routing

Chiplets with connection posts

Printable component structure with electrical contact

Circuit substrate, semiconductor package and process for fabricating the same

Module substrate

Contact-distance transformer, electrical testing device, and method for producing a contact-distance transformer

COMPONENT-MOUNTED BOARD, METHOD OF MANUFACTURING COMPONENT-MOUNTED BOARD AND COMPONENT-EMBEDDED BOARD

Mounting substrate, manufacturing method for the same, and component mounting method

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Stencil set and system for printing solder paste for printed circuit boards

Method and apparatus for forming multi-layered vias in sequentially fabricated circuits

Mounting structure of leaded electronic component which reduces occurrence of blow hole

Hermetic feedthrough for an implantable medical device

Wiring board

High voltage polymer dielectric capacitor isolation device

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Glass core substrate for integrated circuit devices and methods of making the same

Selective segment via plating process and structure

Wiring module including wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring module

ELECTRONIC DEVICE AND ELECTRONIC PACKAGE THEREOF

Electronic module power supply

Partially depopulated interconnection arrays for packaged semiconductor devices and printed circuit boards

PRINTED WIRING BOARD CAPABLE OF SUPPRESSING MOUNTING FAILURE OF SURFACE MOUNT DEVICE FOR FLOW SOLDERING

Printed circuit board with thermal via

Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks

WIRING BOARD WITH EMBEDDED INTERPOSER INTEGRATED WITH STIFFENER AND METHOD OF MAKING THE SAME

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE

Dielectric filmless electronic module and method for manufacturing same

Zero-misalignment via-pad structures

Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit board

Printed circuit board, ball grid array package and wiring method of printed circuit board

Multilayer circuit board

Backdrill reliability anchors

Apparatus and method for solid state source array design and fabrication

System of package (SoP) module and mobile computing device having the SoP

Carrier substrate

Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same

Electronic card having an external connector

Flex-rigid wiring board

Electronic devices with molded insulator and via structures

Semiconductor package assemblies with system-on-chip (SOC) packages

INTERPOSER AND FABRICATION METHOD THEREOF

Electronic package with narrow-factor via including finish layer

Multilayer wiring substrate, manufacturing method therefor, and substrate for probe card

Porous alumina templates for electronic packages

Architecture of drive unit employing gallium nitride switches

Wiring board

Wiring substrate and semiconductor device

3-D integrated package

Wiring substrate and semiconductor package

Circuit structure and fabrication method thereof

Circuit interconnect system and method

Substrate and metal layer manufacturing method

Substrate components for packaging IC chips and electronic device packages of the same

Package substrate and method for manufacturing package substrate

Substrate pad structure

WIRING BOARD

Wiring board, mounting structure equipped with the wiring board, and method for manufacturing wiring board

Package substrate comprising surface interconnect and cavity comprising electroless fill

Printed wiring board

MULTILAYER SUBSTRATE STRUCTURE FOR FINE LINE

Multilayer wiring board, and method for manufacturing multilayer wiring board

Wiring substrate and semiconductor device

Printed circuit board with warpage prevention layer

Paddle card with improved performance

MULTILAYER WIRING BOARD

Printed wiring board and method for manufacturing the same

MICROVIA PAD REPAIR

Substrates for packaging flip-chip light emitting device and flip-chip light emitting device package structures

High voltage polymer dielectric capacitor isolation device

MULTI-LAYER PRINTED CIRCUIT BOARD

Wiring board

Wiring board and electronic device

Buttoned soldering pad for use with fine-pitch hot bar soldering

Printed wiring board and method for manufacturing printed wiring board

Method of fabricating packaging substrate having embedded through-via interposer

Packaging substrate having embedded through-via interposer

Partially depopulated interconnection arrays for packaged semiconductor devices and printed circuit boards

Method of manufacturing printed circuit board having electronic component embedded

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIRING BOARD

Flex-rigid wiring board and method for manufacturing flex-rigid wiring board

PRINTED CIRCUIT BOARD

Printed wiring board, method for manufacturing printed wiring board and package-on-package

Electrical connector and manufacturing method thereof

Multilayer substrate

Wiring substrate, method of manufacturing the same, and semiconductor device

DEVICE-EMBEDDED PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Wiring substrate and semiconductor package

Printed circuit board, semiconductor device connection structure, and method of manufacturing a printed circuit board

Control unit for a motor vehicle

Package for multiple light emitting diodes

WIRING BOARD

Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices

SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE MODULE

Stacked microelectronic assemblies

Carrier substrate and manufacturing method thereof

Land grid array interconnect formed with discrete pads

Materials, structures and methods for microelectronic packaging

Ceramic multilayer wiring substrate and module including the same

Dual interface module and dual interface card having a dual interface module manufactured using laser welding

Chip interposer, semiconductor device, and method for manufacturing a semiconductor device

Circuit substrate, semiconductor package and process for fabricating the same

Wiring substrate and method of manufacturing the same

Printed circuit board

Microelectronic substrate for alternate package functionality

Circuit board having tie bar buried therein and method of fabricating the same

Multi-layer wiring board

Electronic assembly

Embedded architecture using resin coated copper

Packaging substrate, method for manufacturing same, and chip packaging body having same

Package substrate and electronic device

Contact surface arranged on a carrier for connecting to a counter contact surface arranged on a further carrier, and device comprising a contact surface and a counter contact surface connected thereto

EMI FILTERING DETECTOR AND METHOD FOR SAME

Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices

Electronic module power supply

Circuit substrate for mounting chip, method for manufacturing same and chip package having same

Plug via stacked structure, stacked substrate having via stacked structure and manufacturing method thereof

Flexible light emitting semiconductor device

WIRING BOARD AND MOUNTING STRUCTURE

Wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring substrate

Electronic component

Electronic card having an external connector

Electronic components assembly

3-D integrated package

Front end module and method of operation in different circuit environments

Suspended lattice for electrical interconnects

Patch on interposer assembly and structures formed thereby

Wave soldering of surface-mounting electronic devices on printed circuit board

Packaging substrate having embedded through-via interposer and method of fabricating the same

Patterning method for component boards

Wiring substrate, method of manufacturing the same, and semiconductor device

De-pop on-device decoupling for BGA

Ball grid array formed on printed circuit board

SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM IN PACKAGE

SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM IN PACKAGE

Method of forming a land grid array with discrete pads

Insulator for a feedthrough

Circuit board and optical modulator

Microelectronic substrate for alternate package functionality

REDUCED STRESS GULL WING SOLDER JOINTS FOR PRINTED WIRING BOARD CONNECTIONS

Printed circuit board assembly chip package component and soldering component

Semiconductor package with embedded spiral inductor

Wiring substrate and method for manufacturing wiring substrates

Printed circuit board

Printed circuit board

Method of making glass core substrate for integrated circuit devices

Plug connector and multi-layer circuit board

Materials, structures and methods for microelectronic packaging

Method of attaching an electronic module power supply

Interposer-embedded printed circuit board

Printed wiring board

Method for manufacturing a printed wiring board

Module board

Multilayer printed wiring board and method of manufacturing the same

Organic light emitting diode and circuit board for control thereof

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing a multilayered printed wiring board

Electronic devices formed of two or more substrates connected together, electronic systems comprising electronic devices, and methods of forming electronic devices

Connector system having contact overlapping vias

Multilayered wiring board and method of manufacturing the same

Metal interconnect structure with a side wall spacer that protects an ARC layer and a bond pad from corrosion and method of forming the metal interconnect structure

Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate

SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE MODULE

ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment

Patch on interposer assembly and structures formed thereby

Glass core substrate for integrated circuit devices and methods of making the same

Method of manufacturing a wired circuit board

Electronic component mounting structure

Printed circuit board

High-frequency module

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Wireless IC device and manufacturing method thereof

Method for forming a current distribution structure

Heat resistant substrate incorporated circuit wiring board

Printed circuit board having electromagnetic bandgap structure

Wiring board with built-in capacitor

MULTI-LAYER CERAMIC CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRIC DEVICE MODULE USING THE SAME

Method for manufacturing interposer

LED module and lighting device using the same

MULTILAYER LAMINATED CIRCUIT

Multilayer circuit board

Image reading apparatus and multilayer substrate

CIRCUIT PACKAGE WITH INTEGRATED DIRECT-CURRENT (DC) BLOCKING CAPACITOR

WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD OF MANUFACTURING WIRING BOARD

Printed circuit board

DISPLAY MODULE

Mounting substrate and electronic apparatus

Multilayer ceramic substrate and manufacturing method thereof

System and method for coupling a lens to a printed circuit

Package for multiple light emitting diodes

SPACE TRANSFORMER CONNECTOR PRINTED CIRCUIT BOARD ASSEMBLY

Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices

Pad structure for liquid crystal display and method of manufacturing thereof

Mounting board and display device

Interconnect structure

Circuit board

Electronic component mounting substrate and method for manufacturing electronic component mounting substrate

Method of manufacturing a substrate structure

Printed wiring board and method for manufacturing the same

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Method for manufacturing a wiring board

Printed circuit board

Semiconductor package with passivation island for reducing stress on solder bumps

Semiconductor package with embedded spiral inductor

Circuit board including stubless signal paths and method of making same

Method for producing an LTCC substrate

PACKAGE STRUCTURE AND PACKAGE SUBSTRATE

Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density

Package substrate with a conductive connecting pin

Semiconductor device and method for manufacturing the same

Stacked microelectronic assemblies

Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing

Semiconductor chip assembly with post/base heat spreader and vertical signal routing

Wireless IC device and manufacturing method thereof

Light emission device

Conductive pin attached to package substrate

Flex Circuit Apparatus and Method for Adding Capacitance while Conserving Circuit Board Surface Area

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

APPARATUS AND METHOD OF VIA-STUB RESONANCE EXTINCTION

REMOVABLE MEMORY CARD

Solution for package crosstalk minimization

SEMICONDUCTOR PACKAGE, MOUNTING CIRCUIT BOARD, AND MOUNTING STRUCTURE

Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor

Printed circuit board having embedded RF module power stage circuit

Printed circuit board having embedded RF module power stage circuit

Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board

Heat resistant substrate incorporated circuit wiring board

Semiconductor package and associated methods

Wiring board and ceramic chip to be embedded

Heat resistant substrate incorporated circuit wiring board

WIRING BOARD AND SOLID-STATE IMAGING DEVICE

Capacitor-incorporated printed wiring board and electronic component

Mounting structure and electro optical device

Capacitor devices having multi-sectional conductors

Capacitor devices with co-coupling electrode planes

Heat dissipation structure of a print circuit board

SUBSTRATE FOR MOUNTING SEMICONDUCTOR DEVICE

Manufacturing method of wiring board

INSULATIVE WIRING BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR PRODUCING THE INSULATIVE WIRING BOARD

SEMICONDUCTOR SYSTEM HAVING BGA PACKAGE WITH RADIALLY BALL-DEPOPULATED SUBSTRATE ZONES AND BOARD WITH RADIAL VIA ZONES

Signal transmission device

Conductive connecting pin and package substrate

Wired circuit board

SUBSTRATE STRUCTURE AND METHOD FOR WIDEBAND POWER DECOUPLING

Substrate for wiring, semiconductor device for stacking using the same, and stacked semiconductor module

Multilayer wiring board and semiconductor device

Wiring substrate including a reinforcing structural body

Device and method for reducing impedance

Multilayer printed wiring board with a built-in capacitor

Implementing enhanced wiring capability for electronic laminate packages

WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD OF MANUFACTURING WIRING BOARD

Double-sided wiring board, manufacturing method of double-sided wiring board, and mounting double-sided wiring board

Method and apparatus to reduce impedance discontinuity in packages

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Device mounting board, semiconductor module, and mobile device

Electrically conductive structure of circuit board and circuit board using the same

Current distribution structure and method

Heat resistant substrate incorporated circuit wiring board

Semiconductor package with passivation island for reducing stress on solder bumps

Electric device, stack of electric devices, and method of manufacturing a stack of electric devices

Multilayer substrate with interconnection vias and method of manufacturing the same

SYSTEMS AND METHODS FOR BALL GRID ARRAY (BGA) ESCAPE ROUTING

Printed wiring board

Conductive connecting pins for a package substrate

Semiconductor device and printed circuit board

WIRING SUBSTRATE AND METHOD OF MANUFACTURING SAME, AND DISPLAY DEVICE

Assembly substrate and method of manufacturing the same

MULTI-LAYER CAPACITOR AND WIRING BOARD HAVING A BUILT-IN CAPACITOR

Method of manufacturing printed wiring board

TEST ACCESS FOR HIGH DENSITY INTERCONNECT BOARDS

High performance chip carrier substrate

High performance chip carrier substrate

Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density

METHODS OF FABRICATING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE, AND CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE FABRICATED USING THE METHODS

Rugged Chip Packaging

Semiconductor package substrate

System and Method for Capacitive Coupled VIA Structures in Information Handling System Circuit Boards

Method of manufacturing a wired circuit board

Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs

Integrated power supply system analyzing system, integrated power supply system analyzing method, and multiplayer printed circuit board

VIA AND SOLDER BALL SHAPES TO MAXIMIZE CHIP OR SILICON CARRIER STRENGTH RELATIVE TO THERMAL OR BENDING LOAD ZERO POINT

Structure of packaging substrate and method for making the same

Layout circuit

Interposer and electronic device fabrication method

Wiring structure of laminated capacitors