Electronic device and method for producing same

Component sheet and method of singulating

Electroacoustic converter, assembly having electroacoustic converter, and electroacoustic converter apparatus having assembly

Hybrid inductor

Resin circuit board and resin circuit board having component mounted thereon

WAFER-LEVEL PACKAGED OPTOELECTRONIC MODULE

Computer circuit board cooling arrangement

Camera module and array camera module based on integral packaging technology

Power modules having an integrated clamp circuit and process thereof

Multilayer substrate and electronic device

Signal transmitting device

Gas sensor module

Thin-film capacitor and electronic component embedded substrate

Tensile stress resistant multilayer ceramic capacitor

Power module with lead component and manufacturing method thereof

Tamper-respondent assemblies with trace regions of increased susceptibility to breaking

Tamper-respondent assembly with nonlinearity monitoring

Tamper-proof electronic packages with two-phase dielectric fluid

Flipped RF filters and components

Semiconductor device

Electronic circuit module

Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated circuit device

Manufacturing method for EMI shielding structure

Mounting of components on a printed circuit board

FOLDED STACKED PACKAGE WITH EMBEDDED DIE MODULE

Method of manufacturing flexible electronic circuits having conformal material coatings

Tamper-respondent assembly with nonlinearity monitoring

Voltage divider circuit assembly and method

Tensile stress resistant multilayer ceramic capacitor

Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated circuit device

Camera module and array camera module based on integral packaging technology

Module

Spread weave induced skew minimization

Solder alloy and package structure using same

Bridge leg circuit assembly and full-bridge circuit assembly

Tamper-proof electronic packages with two-phase dielectric fluid

Electronic circuit package

Contacting arrangement between a stator and a circuit board

Extension module with housing for electronic components

Active composite panel assemblies, systems, and methods

Electronic circuit module and manufacturing method of the same

Computer modules with small thicknesses and associated methods of manufacturing

Light emitting package having a guiding member guiding an optical member

Method of manufacturing printed circuit board

Inter-chip alignment

Appliance User Interface Panel Having Integrated Components

Circuit board with thermal paths for thermistor

Bulk MLCC capacitor module

TRANSFORMER HOLDER AND ELECTRONIC DEVICE USING THE SAME

Circuit assembly, connected busbar structure, and electrical junction box

Electronic circuit assembly having a carrier with holes therein for receiving and connecting waveguides having different dielectric constants

Information carrying card comprising crosslinked polymer composition, and method of making the same

Converter module, transformer module and circuit thereof

Circuit package with internal and external shielding

Rigid-flex module and manufacturing method

Display with color conversion

Electrical device and method for producing an electrical device

Optical apparatus, printed circuit board

Circuit boards and electronic packages with embedded tamper-respondent sensor

Circuit boards and electronic packages with embedded tamper-respondent sensor

Circuit board structure and method for manufacturing the same

Clamp and display device including same

Electrical connector with low-stress, reduced-electrical-length contacts

PCB based semiconductor package having integrated electrical functionality

ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME

PRE-CUT SUBSTRATE AND UNIT CHIP SUBSTRATE COMPRISING HEMISPHERICAL CAVITY

Microstrip band-pass filter having first and second trapezoidal shape coupling portions connected by a connection portion

Tensile stress resistant multilayer ceramic capacitor

Micro assembled LED displays and lighting elements

Information carrying card comprising crosslinked polymer composition, and method of making the same

Non-reciprocal circuit element

Printed circuit board, circuit and method for producing a circuit

Printed circuit board

Low profile connector and assembly of the same

VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES

Power filter

Light emitting package having a guiding member guiding an optical member

Surface mount power inductor component with stacked component accommodation

CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Circuit substrate and method for manufacturing the same

Printed circuit board

Portable terminal and a component mounting method

Printed circuit board with embedded electronic component and manufacturing method thereof

Electronic component embedded printed circuit board and method of manufacturing the same

Embedded board and method of manufacturing the same

Circuit module and method of manufacturing the same

Multi layer ceramic capacitor, embedded board using multi layer ceramic capacitor and manufacturing method thereof

Connection device

Input output for an integrated circuit

Embedded thin film magnetic carrier for integrated voltage regulator

Printed circuit board having electronic component embedded

Device for incoupling and/or outcoupling optical signals

Roller structure and method of using the same

INTEGRATED PASSIVE MODULE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Optoelectronic assembly and method for producing an optoelectronic assembly

Mobile terminal

Substrate for mounting electronic element and electronic device

Direct printed circuit routing to stacked opto-electrical IC packages

Printed circuit board

Method for manufacturing an integrated circuit package

Printed Timer Label

Tensile stress resistant multilayer ceramic capacitor

Capacitors for multilayer printed circuit boards

Package-in-substrate, semiconductor device and module

Optoelectronic component and electronic device having an optoelectronic component

Micro assembled LED displays and lighting elements

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

Micro assembled LED displays and lighting elements

SUBSTRATE WITH ELECTRONIC DEVICE EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF

Flexible printed circuits in marine geophysical streamers

Moving image sensor package

OXIDE, SEMICONDUCTOR DEVICE, MODULE, AND ELECTRONIC DEVICE

MULTILAYER WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR

Embedded package substrate capacitor with configurable/controllable equivalent series resistance

Electronic device

Multilayer ceramic capacitor and circuit board for mounting the same

Method for producing a three-dimensional circuit configuration and circuit configuration

Flexible substrate

Method for manufacturing an electronic package

Backplane module and method of manufacturing same

Noise suppression circuit board design for an inductive heater

Electronic component built-in multi-layer wiring board and method of manufacturing the same

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

LOW-PROFILE PACKAGE WITH PASSIVE DEVICE

Substrate design for semiconductor packages and method of forming same

Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof

Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor

Liquid ejecting head manufacturing method and liquid ejecting head

Integrated circuit package

Mounting structure and method for supplying reinforcing resin material

Semiconductor component with chip for the high-frequency range

Circuit board and method for producing same

Computer modules with small thicknesses and associated methods of manufacturing

Electronic device and car battery charger

High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly

Electrical connector with low-stress, reduced-electrical-length contacts

Segmented electroluminescent device with distributed load elements

Jumper module mounting circuit board and circuit board assembly

Wiring substrate and light emitting device

FUNCTIONAL ELEMENT BUILT-IN SUBSTRATE AND WIRING SUBSTRATE

Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein

Metal-insulator-metal capacitors on glass substrates

Light emitting package having a guiding member guiding an optical member

Insulating material, passive element, circuit board, and method of manufacturing an insulating sheet

Camera module

Wiring substrate and manufacturing method of wiring substrate

Low-profile circuit board assembly

Electronic modules having grounded electromagnetic shields

Control unit having a sacrificial structure

Fiber optic sub-assembly with low profile

Lighting fixture with reflector and template PCB

Fractional order capacitor

Multilayer wiring board for an electronic device

Electronic module

Circuit board assembly using metal plates as conducting medium embedded therein

SEMICONDUCTOR MODULE, CIRCUIT BOARD

Circuit assembly

Substrate with built-in passive element

Carrier device, electrical device having a carrier device and method for producing same

Substrate embedding passive element

Printed circuit board with embedded component and method for manufacturing same

Full graphics in-mold label and applications thereof

Full graphics electronic in-mold label and applications thereof

Method for assembling computer modules small in thickness

EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT THEREIN

Circuit assemblies including thermoelectric modules

MULTI-PIECE SUBSTRATE

Wiring board and method for manufacturing the same

Ceramic electronic component and method for manufacturing the same

Printed circuit board, and method for manufacturing printed circuit board

Twist mount rotary selector switch

THICK-FILM HYBRID CIRCUIT STRUCTURE AND METHOD OF MANUFACTURE THE SAME

Light emitting package having a guiding member guiding an optical member

Ceramic electronic component and method for manufacturing the same

Methods of making packages using thin Cu foil supported by carrier Cu foil

Electronic component and manufacturing method therefor

CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD

Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product

Board and communication device

Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance

Coefficient of thermal expansion compensating compliant component

Metal-insulator-metal capacitors on glass substrates

Formation of DRAM capacitor among metal interconnect

System in package assembly

Connector

Contact and bonding structure of the contact

Light-emitting module

Information carrying card comprising crosslinked polymer composition, and method of making the same

Component assembly

Substrate with built-in component and method for manufacturing the same

Semiconductor module assembly

Component-embedded substrate, and method of manufacturing the component-embedded substrate

Electrical device, system and method for operating with reduced acoustic noise generation

Wiring board and method for manufacturing the same

Flexible circuit assembly with wire bonding

Wireless IC device

Circuit-terminal connecting device

Connector, PCB for LED light bar and LED light bar

Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission

RADIOFREQUENCY CIRCUIT ASSEMBLY

Electronic assembly and a LED retrofit lamp having the Electronic assembly

Package carrier for a microelectronic element

Module board and manufacturing method thereof

PIN ADJUSTER FOR ELECTRONIC COMPONENT

Light emitting package

CIRCUIT BOARD AND METHOD FOR MOUNTING AIR CORE COIL

Electrical current sensor device

Pool lighting assembly

Functional element built-in substrate and wiring substrate

Illumination module

Antenna and a Method of Manufacture Thereof

Inverter and electronic device using the inverter

METHOD AND SYSTEM FOR PREPARING WIRELESS COMMUNICATION CHIPS FOR LATER PROCESSING

MICROWAVE UNIT AND METHOD THEREFORE

Electronic assembly

Circuit assemblies including thermoelectric modules

Modular surface mount package for a system on a chip

Form-less electronic device assemblies and methods of operation

COMBINING PRINTED CIRCUIT BOARDS

Transformer capable of adjusting height

Transformer capable of maintaining height

Light emitting package

APPARATUS FOR FORMING A WIRELESS COMMUNICATION DEVICE

Low profile coil-wound bobbin

Coil-integrated switching power supply module

LED PACKAGE WITH STEPPED APERTURE

Method for producing lamps

Manufacturing method of the electronic component

Illumination system, electro-optic device, and electronic apparatus

Electronic assemblies and methods of forming electronic assemblies

Low profile inductors for high density circuit boards

Electronic Component and Method of Manufacturing the Same

SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM

Thermal pad and method of forming the same

Light emitting device module and lighting system including the same

Light emitting device module

Differential path replacement component, printed board, and electronic device

HIGH POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSCEIVER, AND METHOD FOR MOUNTING HIGH POWER AMPLIFIER

Package carrier for enclosing at least one microelectronic device

Ceramic electronic component and method for manufacturing the same

Package for light emitting device

Package for light emitting device

SUBSTRATE

MOVABLE TRANSFORMER EMBEDDED INTO AN OPENING OF A PCB AND A METHOD OF INSTALLING THE SAME

Multimode signaling on decoupled input/output and power channels

Wiring board and method for manufacturing the same

Form-less electronic device assemblies and methods of operation

SYSTEM AND METHOD FOR ATTACHING A SUBSTANTIALLY THREE DIMENSIONAL STRUCTURE TO A SUBSTANTIALLY TWO DIMENSIONAL STRUCTURE

Transformer and transformer assembly

LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME

LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME

Package for light emitting device

Ball grid array package enhanced with a thermal and electrical connector

Light-emitting diode backlight module

Method of making a communications jack

Electronic component mounting structure

Miniature housing and support arrangement having at least one miniature housing

Memory address management systems in a large capacity multi-level cell (MLC) based flash memory device

OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS

Optical module for a cellular phone

SPACE SAVING CIRCUIT BOARD

Transformer and transformer assembly

PROTECTIVE STRUCTURE OF ELECTRONIC COMPONENT

Component mounting structures for electronic devices

Circuit module and method of manufacturing the same

Multimode signaling on decoupled input/output and power channels

Socket, circuit board assembly, and apparatus having the same

Camera module and assembling method thereof

Portable terminal

Apparatus for stacking integrated circuits

System And Method For Processor Power Delivery And Thermal Management

Power amplifier and signal transceiving system

Regulated output current and slope control

Low pressure molding encapsulation of high voltage circuitry

Light emitting package having screen layer

HIGH VOLTAGE RECESSED CONNECTOR CONTACT

Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method

Stacking multiple devices using single-piece interconnecting element

Downward-facing optical component module

Device for reducing thermal stress on connection points

PACKAGE STRUCTURE OF PRINTED CIRCUIT BOARD AND PACKAGE METHOD THEREOF

Light-Emitting Device and Electronic Device Using The Same

Semiconductor module

Printed circuit board, manufacturing method thereof and radio-frequency device

Weld assembly

Thin electronic device

Printed circuit board with an adaptable connector module

Apparatus for forming a wireless communication device

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY OVER POST

Optical sensing module and optical mouse with the same

Computer modules with small thicknesses and associated methods of manufacturing

CARD SOCKET ASSEMBLY AND PORTABLE ELECTRONIC DEVICE USING SAME