High-speed pluggable rigid-end flex circuit

Electric element-embedded multilayer substrate and method for manufacturing the same

Method for making an electrical inductor and related inductor devices

Circuit board and method of manufacturing same

Horn antenna including integrated electronics and associated method

Method for making an electrical inductor and related inductor devices

High strength through-substrate vias

METHOD FOR PRODUCING LAMINATE, AND LAMINATE

Insulating layer composition for substrate, and prepreg and substrate using the same

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD INCLUDING THE SAME

Method for making electrical structure with air dielectric and related electrical structures

Circuit board laminate and metal-based circuit board

Method to make a multilayer circuit board with intermetallic compound and related circuit boards

Structure

Flexible circuit board and its method for production

Liquid composition and metal-based circuit board

LAMINATE

METHOD FOR PRODUCING LIQUID CRYSTAL POLYESTER-IMPREGNATED BASE MATERIAL

FLEXIBLE PRINTED CIRCUIT AND METHOD OF MANUFACTURING THE SAME

Lighting device with LEDs mounted on flexible circuit board self maintained in bellows shape and manufacturing method thereof

RESIN-IMPREGNATED BASE SUBSTRATE AND METHOD FOR PRODUCING THE SAME

Luminous-Body Flexible Board and Luminous Device

Fabricating method of flexible circuit board

METHOD FOR PRODUCING HEAT-TREATED LIQUID CRYSTAL POLYESTER-IMPREGNATED BASE MATERIAL

METHOD FOR PRODUCING HEAT-TREATED LIQUID CRYSTAL POLYESTER-IMPREGNATED BASE MATERIAL

METAL BASE CIRCUIT BOARD AND PRODUCTION METHOD THEREOF

Method of making a flexible circuit electrode array

Liquid crystal polyester-containing liquid composition

Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices

Method of making an electronic device having a liquid crystal polymer solder mask and related devices

Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices

Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods

Multilayer substrate

Flexible circuit board

RESIN-IMPREGNATED SHEET AND METHOD FOR PRODUCING RESIN-IMPREGNATED SHEET LAMINATE WITH METAL FOIL

Liquid crystal polyester composition and electronic circuit board using the same

Covering Device for an Organic Substrate, Substrate with a Covering Device, and Method for Producing a Covering Device

Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates

Circuit board and method for manufacturing the same

Method of manufacturing and insulating sheet

THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD INCLUDING BATTERY AND RELATED METHODS

Flexible board

Method for producing laminated base material

Printed circuit board with reinforced thermoplastic resin layer

Thermosetting composition and printed circuit board using the same

METHOD FOR PRODUCING LIQUID CRYSTALLINE POLYESTER IMPREGNATED FIBER SHEET

Apparatus and method for embedding components in small-form-factor, system-on-packages

Process for fabricating a three dimensional molded feed structure

PRINTED CIRCUIT BOARD AND FUEL CELL

Method for Producing Liquid Crystalline Polyester Prepreg and Liquid Crystalline Polyester Prepreg

Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications

Metal-clad laminate and method for production thereof

Method and Apparatus for Building Multilayer Circuits

Composition for forming substrate, and prepreg and substrate using the same

LAMINATE, METHOD FOR PRODUCING LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

Heat Radiation Substrate and Illumination Module Substrate Having Hybrid Layer

PREPREG HAVING UNIFORM PERMITTIVITY, AND METAL CLAD LAMINATES AND PRINT WIRING BOARD USING THE SAME

MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC

Maleimide based compound, composition for forming board, and board fabricated using the same

Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin

AROMATIC LIQUID-CRYSTALLINE POLYESTER AMIDE COPOLYMER, PREPREG INCLUDING THE SAME, PREPREG LAMINATE INCLUDING THE PREPREG, METAL FILM LAMINATE INCLUDING THE PREPREG, AND PRINTED WIRING BOARD INCLUDING THE PREPREG

System and method for improving performance of coplanar waveguide bends at mm-wave frequencies

Package for semiconductor devices

Package for semiconductor devices

Composition for producing a board and printed circuit board using the same

CURABLE RESIN COMPOSITION, COMPOSITE BODY, MOLDED BODY, LAMINATED BODY AND MULTILAYERED CIRCUIT BOARD

Multilayer electronic component systems and methods of manufacture

SUBSTRATE APPLICABLE IN CHIP LED PACKAGE

Laminated product and production method therof, and circuit substrate using the same

THERMALLY CONDUCTIVE POLYMER BASED PRINTED CIRCUIT BOARD

COPPER-CLAD LAMINATE, PRINTED-WIRING BOARDS, MULTILAYER PRINTED-WIRING BOARDS, AND METHOD FOR MANUFACTURING THE SAME

Crosslinkable thermoset monomer, composition for producing printed circuit board comprising the thermoset monomer and printed circuit board using the composition

Microfiller-Reinforced Polymer Film

Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board

Insulating sheet and printed circuit board having the same

Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the same

Method for producing copper-clad laminate

THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD INCLUDING BATTERY AND RELATED METHODS

Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods

Method for making three-dimensional liquid crystal polymer multilayer circuit boards

FLEXIBLE FILM AND DISPLAY DEVICE COMPRISING THE SAME

FLEXIBLE FILM AND DISPLAY DEVICE COMPRISING THE SAME

Resin composition and flexible printed circuit board

Multilayer wiring board and method of making the same

Composition for producing printed circuit board and printed circuit board using the same

Composite resin molded article, laminate, multi-layer circuit board, and electronic device

RELEASE FILM FOR USE IN MANUFACTURE OF PRINTED CIRCUIT BOARDS

Liquid crystal polyester resin composition and printed circuit board using the same

Multi-layer circuit board and method of making the same

Methods for manufacturing magnetic components

Partially rigid flexible circuits and method of making same

Flexible cable comprising liquid crystal polymer

Method of making wiring boards covered by thermotropic liquid crystal polymer film

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

Method and Apparatus for Forming Plated Liquid Crystalline Polymer Substrate

Method for Metallizing Liquid Crystal and Polymer

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF

Flexible circuit electrode array

Method for producing laminate comprising liquid-crystalline polyester layer

Flexible circuit with cover layer

Circuit materials, multilayer circuits, and methods of manufacture thereof

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Multi-layered interconnect structure using liquid crystalline polymer dielectric

METHOD FOR PREPARING FILMS

Laminate for flexible printed wiring board

Metal-clad laminate and method for production thereof

Resin composition and flexible printed circuit board

Insulating material for printed circuit board

Printed circuit board and method of manufacturing the same

Method for producing liquid crystal polymer molded article

Package for semiconductor devices

ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

Method for fabricating three-dimensional all organic interconnect structures

Flexible printed circuit board

Moisture resistant printed circuit board

METHOD AND APPARATUS FOR FORMING MULTI-LAYERED CIRCUITS USING LIQUID CRYSTALLINE POLYMERS

METHOD AND APPARATUS FOR FORMING MULTI-LAYERED CIRCUITS USING LIQUID CRYSTALLINE POLYMERS

Fluoropolymer laminates and a process for manufacture thereof

Metal-coated resin molded article and production method therefor

Liquid-crystalline polyester and solution composition comprising the same

Resin molded article with reduced dielectric loss tangent and production method therefor

ETCHED DIELECTRIC FILM IN HARD DISK DRIVES

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM

PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITORS USING HYBRID MATERIAL AND METHOD OF MANUFACTURING THE SAME

Polymer composite formed article, printed wiring board using the formed article, and methods of producing them

Resin-impregnated base substrate and method for producing the same

PROCESS DEVELOPMENT AND OPTIMIZATION OF EMBEDDED THIN FILM RESISTOR ON BODY

Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications

Substrate for flexible wiring and method for producing the same

Magnetic components

Fluoropolymer-glass fabric for circuit substrates

Laminate of liquid crystalline polyester with copper foil

Method and apparatus for forming multi-layered circuits using liquid crystalline polymers

Multilayer wiring board and fabricating method of the same

Graded liquid crystal polymer package

Composites, method of manufacture thereof, and articles formed therefrom

Laminate for printed circuit board and method of manufacturing the same

Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same

Method for etching microchannel networks within liquid crystal polymer substrates

Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof

Fluoropolymer laminates and a process for manufacture thereof

Laminated film and method for producing same

Integral molded heat sinks on DC-DC converters and power supplies

Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them

Method for producing laminate

Copperless flexible circuit

Method for producing aramid laminate

Apparatus and method for manufacturing copper clad laminate with improved peel strength

Anisotropic conductive adhesive having PTC characteristics

Method of constructing a structural circuit

Aromatic liquid-crystalline polyester composition and film of the same

Multi-layer board manufacturing method

Method and apparatus for sealing flex circuits made with an LCP substrate

Films

Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof

Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin

Resin-impregnated substrate

Film and laminate of the same

Electronic package with optimized lamination process

Resin-impregnated substrate

Laminated plate and part using the laminated plate

Sheet material especially useful for circuit boards

Disc drives having flexible circuits with liquid crystal polymer dielectric

Method for making a multilayer circuit

Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto

Method of making liquid crystal polymer films

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Interconnection circuit and electronic module utilizing same

Composite dielectric, composite dielectric sheet, composite dielectric paste, metal-layered composite dielectric, wiring board and multilayer wiring board

Lamination of liquid crystal polymer dielectric films

Package for semiconductor devices

Multilayer carrier foil