Patents-Review.com
ClassID:

234323 ⎘

H05K2201/0137 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Dielectrics Materials

Sub-classes:
Recent Application in this class:
#1
20260104479
2026-04-16

CURRENT SENSOR FOR PRINTED CIRCUIT BOARD

 #2
20250172641
2025-05-29

CURRENT SENSOR FOR PRINTED CIRCUIT BOARD

 #3
20250024601
2025-01-16

PRINTED CIRCUIT BOARD

 #4
20240322626
2024-09-26

MAGNETIC MATERIAL FILLED PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARD STATORS

 #5
20240268037
2024-08-08

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY SENSING AND DELIVERY OF THERAPEUTICS

 #6
20240260190
2024-08-01

INDUCTION COOKING HOB HAVING TWO BOARD ELEMENTS ELECTRICALLY AND MECHANICALLY COUPLED TO EACH OTHER

 #7
20230413427
2023-12-21

ELECTRONIC DEVICE COMPRISING SEALING MEMBER

 #8
20230240009
2023-07-27

WIRING BOARD

 #9
20230139276
2023-05-04

Nanocomposite material for ultraviolet curable direct write semiconductor applications

 #10
20230036536
2023-02-02

Magnetic material filled printed circuit boards and printed circuit board stators

 #11
20220287174
2022-09-08

Circuit board

 #12
20220145460
2022-05-12

Hydrophobic Low-Dielectric-Constant Film and Preparation Method Therefor

 #13
20210298174
2021-09-23

Electronic device comprising ceramic layer and ceramic housing

 #14
20200315020
2020-10-01

Circuit assembly

 #15
20200305278
2020-09-24

PROCESS FOR MANUFACTURING A FUNCTIONAL FLEXIBLE CELLULOSIC SUBSTRATE, SETUP FOR IMPLEMENTING SAID PROCESS

 #16
20200098344
2020-03-26

Circuit board with dielectric surface switch and embedded metamaterials providing increased arc resistance

 #17
20190279935
2019-09-12

SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE CONTAINING NON-HOMOGENEOUS DIELECTRIC LAYER

 #18
20190171311
2019-06-06

Method of forming a composite conductive film

 #19
20190110364
2019-04-11

Multilayer laminate and method for producing multilayer printed wiring board using same

 #20
20180270954
2018-09-20

Pluggable printed circuit board and optical module having a gap between solder resist and electro-conductive contact sheet group

 #21
20180263117
2018-09-13

FLEXIBLE ELECTRONIC ASSEMBLY METHOD

 #22
20180139842
2018-05-17

Printed circuit board with high-capacity copper circuit

 #23
20180027668
2018-01-25

Method of manufacturing conductive layer and wiring board

 #24
20180022919
2018-01-25

Low-dielectric resin composition

 #25
20170332488
2017-11-16

Metal base circuit board and method of manufacturing the metal base circuit board

 #26
20170273180
2017-09-21

OVERMOLDED PLASTIC COMPONENTS FORMED ON METALLIC PLATES

 #27
20170228055
2017-08-10

Method of forming a composite conductive film

 #28
20170226302
2017-08-10

CURABLE COMPOSITION, PREPREG, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

 #29
20170181283
2017-06-22

Printed circuit board and optical module comprising solder resist having no contact with an electro-conductive contact sheet group on a same substrate

 #30
20160300644
2016-10-13

Polyhexahydrotriazine dielectrics

 #31
20160297931
2016-10-13

Polyhexahydrotriazine dielectrics

 #32
20160249451
2016-08-25

Ultra low loss dielectric thermosetting resin compositions and high performance laminates manufactured therefrom

 #33
20160163611
2016-06-09

Laminate substrates having radial cut metallic planes

 #34
20160105970
2016-04-14

Fine line 3D non-planar conforming circuit

 #35
20150382459
2015-12-31

Printed Circuit Board And Method For Fabricating The Same, And Apparatus For Fabricating Printed Circuit Borad

 #36
20150373853
2015-12-24

Insulation film and method for making insulation film

 #37
20150257260
2015-09-10

Vertically spaced electrode structure

 #38
20150250050
2015-09-03

EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME

 #39
20150237741
2015-08-20

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

 #40
20150237710
2015-08-20

Substrate for light-emitting diode

 #41
20150189747
2015-07-02

Thermosetting resin composition and use thereof

 #42
20150179560
2015-06-25

Wiring substrate and semiconductor device

 #43
20150163921
2015-06-11

Flexible electronic assembly method

 #44
20150156891
2015-06-04

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

 #45
20150156887
2015-06-04

METHOD OF FORMING AMORPHOUS ALLOY FILM AND PRINTED WIRING BOARD MANUFACTURED BY THE SAME

 #46
20150156877
2015-06-04

STRIP LEVEL SUBSTRATE INCLUDING WARPAGE PREVENTING MEMBER AND METHOD OF MANUFACTURING THE SAME

 #47
20150156866
2015-06-04

Transparent conductor, method for preparing the same, and optical display including the same

 #48
20150140296
2015-05-21

Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board

 #49
20150136468
2015-05-21

Method of forming micro via in printed circuit board

 #50
20150109748
2015-04-23

Active chip package substrate and method for preparing the same

 #51
20150107885
2015-04-23

Layer stack for a touch panel and method for forming a layer stack

 #52
20150090479
2015-04-02

Method for producing a flexible transparent electrode using cesium and a flexible transparent electrode produced thereby

 #53
20150077953
2015-03-19

Display apparatus having protective layer on the pad unit and method of fabricating the same

 #54
20150075845
2015-03-19

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

 #55
20150057413
2015-02-26

Prepreg comprising polyphenylene ether particles

 #56
20150056472
2015-02-26

Laminate for Printed Circuit Board and Printed Circuit Board Using The Same

 #57
20150047882
2015-02-19

Graphitic substrates with ceramic dielectric layers

 #58
20150034373
2015-02-05

WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF

 #59
20150022984
2015-01-22

EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

 #60
20150021071
2015-01-22

CIRCUIT BOARD, CONDUCTIVE FILM FORMING METHOD AND ADHESIVENESS IMPROVER

 #61
20150000960
2015-01-01

Composite conductive films with enhanced surface hardness

 #62
20140377534
2014-12-25

CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

 #63
20140345910
2014-11-27

METHOD OF FORMING CONDUCTIVE LINE, AND DEVICE COMPRISING THE SAME

 #64
20140326486
2014-11-06

PRINTED CIRCUIT BOARD

 #65
20140127462
2014-05-08

Prepreg comprising polyphenylene ether particles

 #66
20110290540
2011-12-01

Embedded printed circuit board and method of manufacturing the same

 #67
16424338
2024-07-16

Interconnect structure surface modifications by passivating agents

 #68
15442699
2018-01-02

Electrical connection of electrical wires to flexible conductive elements

 #69
15394735
2018-02-27

Method for manufacturing a printed circuit board with high-capacity copper circuit

 #70
14928289
2017-03-14

Wire bonded electronic devices to round wire

 #71
14859857
2016-11-01

Flexible circuit board and method for manufacturing same

 #72
14565267
2016-12-13

Mechanical measures to limit stress and strain in deformable electronics

 #73
14266700
2017-06-06

Method of making stretchable interconnect using magnet wires