234332 ⎘
Indexing scheme relating to printed circuits covered by; Dielectrics; Materials Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
PRINTED CIRCUIT BOARD
#2PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
#3PRINTED CIRCUIT BOARD
#4SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
#5WIRING SUBSTRATE
#6PRINTED CIRCUIT BOARD
#7WIRING BOARD
#8PRINTED CIRCUIT BOARD
#9CAMERA MODULE
#10SILICA GLASS SUBSTRATE
#11PRINTED WIRING BOARD
#12STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES
#13CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF
#14Camera module having a soldering portion coupling a driving device and a circuit board
#15CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE
#16CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR
#17SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
#18WIRING BOARD
#19WIRING BOARD
#20MULTI-LAYERED DIAMOND-LIKE CARBON COATING FOR ELECTRONIC COMPONENTS
#21Low dielectric substrate for high-speed millimeter-wave communication
#22PRINTED WIRING BOARD
#23Multi-layered diamond-like carbon coating for electronic components
#24COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
#25LAMINATED SHEET FOR METAL-CLAD LAMINATE, METHOD OF MANUFACTURING LAMINATED SHEET FOR METAL-CLAD LAMINATE, METAL-CLAD LAMINATE, AND METHOD OF MANUFACTURING METAL-CLAD LAMINATE
#26PACKAGING STRUCTURE FOR CIRCUIT UNITS
#27Low dielectric substrate for high-speed millimeter-wave communication
#28Thermally conductive board
#29Camera module having a soldering portion coupling a driving device and a circuit board
#30MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
#31Method for manufacturing a ceramic copper circuit board
#32Ceramic copper circuit board and method for manufacturing the same
#33Semiconductor package and semiconductor device
#34Shear wave methods, systems, and gyroscope
#35LAMINATED SHEET
#36Electronic component
#37Camera module having a reinforcing portion coupling a surface of a first circuit board and a terminal of a second circuit board
#38Manufacturing method of carrier structure
#39Passive component adapter for downhole application
#40Ceramic copper circuit board and method for manufacturing the same
#41Bus bar connection and coating technology
#42Modulated inductance module
#43Substrate
#44Printed wiring board and method for manufacturing printed wiring board
#45Ceramic and polymer composite, methods of making, and uses thereof
#46Multilayer ceramic substrate
#47Camera module having a soldering portion coupling a driving device and a circuit board
#48Highly conductive transparent glass-based circuit board
#49Glass-free dielectric layers for printed circuit boards
#50Flame retardant structure for component carrier
#51Wiring board
#52CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON
#53CERAMIC ELECTRONIC COMPONENT
#54Flexible display device
#55WIRING BOARD AND PLANAR TRANSFORMER
#56Insulating resin material, metal layer-equipped insulating resin material using same, and wiring substrate
#57Multilayer ceramic substrate and electronic device
#58Multilayer ceramic substrate
#59Ceramic electronic component
#60Circuit board, method for manufacturing circuit board, and electronic device
#61Wiring board, electronic device, and wiring board manufacturing method
#62Camera module having a soldering portion coupling a driving device and a circuit board
#63Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
#64Colored thin covering film and manufacturing method
#65Filter circuit, multiplexer, and module
#66Electrically isolated assembly and method for the electrical isolation of an assembly
#67Ceramic multilayer substrate
#68Boron nitride nanotubes (BNNT) in polymers for extreme environment
#69ELECTRONIC TILE PACKAGING
#70Multilayer ceramic substrate and method for manufacturing multilayer ceramic substrate
#71Ceramic and polymer composite, and uses thereof
#72Circuit board element
#73Manufacturing method of a molded photosensitive assembly of an array imaging module
#74METHOD FOR COATING DEVICE AND RESULTING DEVICE
#75Method for coating a device and devices having nanofilm thereon
#76Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
#77Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
#78Surface-treated copper foil, method for producing same, copper-clad laminate for printed wiring board, and printed wiring board
#79PROBE CARD AND MULTILAYER CIRCUIT BOARD THIS PROBE CARD INCLUDES
#80Ceramic wiring board and method for producing the same
#81Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
#82Embedded thin films
#83Printed circuit board and manufacturing method thereof
#84High voltage polymer dielectric capacitor isolation device
#85Flexible electronic substrate
#86Via Transition and Method of Fabricating the Same
#87EMBEDDED THIN FILMS
#88Transparent display panel and method of manufacturing the same
#89Devices formed with techniques for bonding substrates using an intermediate layer
#90Power management module and method of manufacture
#91Wiring board, mounting structure equipped with the wiring board, and method for manufacturing wiring board
#92Metal-ceramic substrate and method for producing a metal-ceramic substrate
#93Method for producing substrate with transparent electrode, and substrate with transparent electrode
#94Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
#95High voltage polymer dielectric capacitor isolation device
#96Optoelectronic chip-on-board module
#97High strength through-substrate vias
#98Flexible display device and curved display device
#99CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#100Method of forming a multi-level thin film capacitor
#101Display apparatus having protective layer on the pad unit and method of fabricating the same
#102Electrical components and method of manufacture
#103CERAMIC CIRCUIT BOARD AND LED PACKAGE MODULE USING THE SAME
#104Wiring board, mounting structure using same, and method of manufacturing wiring board
#105Flexible display device
#106Wiring board
#107Electrostatic protection device
#108Capacitive blind-mate module interconnection
#109Silicon nitride substrate and method for producing silicon nitride substrate
#110Multilayered substrate and method of manufacturing the same
#111Electronic component package
#112Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package
#113Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
#114Package substrate and die spacer layers having a ceramic backbone
#115Circuit substrate, laminated board and laminated sheet
#116Solid electrolytic capacitor and circuit board having the same
#117PRINTABLE ELECTRONICS SUBSTRATE
#118Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board module
#119High strength through-substrate vias
#120Multilayer printed wiring board
#121TRANSPARENT CONDUCTIVE STRUCTURE APPLIED TO A TOUCH PANEL AND METHOD OF MAKING THE SAME
#122Support for electronic circuits
#123Dielectric protective layer for a self-organizing monolayer (SAM)
#124Structure for circuit board used in electronic devices and method for manufacturing the same
#125STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#126Techniques for bonding substrates using an intermediate layer
#127FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#128Package substrate and die spacer layers having a ceramic backbone
#129Method of manufacturing printed circuit board
#130Metal-Ceramic Substrate
#131PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#132METHOD OF MANUFACTURING THIN-FILM DIELECTRICS AND CAPACITORS ON METAL FOILS
#133Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
#134High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof
#135CIRCUIT BOARD AND STRUCTURE USING THE SAME
#136Fabrication method for resin-encapsulated semiconductor device
#137Electronic Substrate Having Low Current Leakage and High Thermal Conductivity and Associated Methods
#138Wiring board and mount structure
#139Circuit substrate, laminated board and laminated sheet
#140Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing
#141Multilayer printed wiring board
#142SUBSTRATE HAVING IMPRINTED STRUCTURE
#143CAPACITOR-FORMING MATERIAL AND PRINTED WIRING BOARD PROVIDED WITH CAPACITOR
#144Printed wiring board and method for manufacturing the same
#145Dielectric device and method of manufacturing the same
#146Multilayer ceramic board and manufacturing method thereof
#147THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES AND METHODS OF MAKING
#148Thin-film capacitor structures embedded in semiconductor packages and methods of making
#149Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers
#150Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch
#151SEMICONDUCTOR DEVICE
#152Method of manufacturing a dielectric structure
#153Fabrics with high thermal conductivity coatings
#154METHOD OF MANUFACTURING ELECTRONIC DEVICE
#155HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF
#156Electronic component mounting substrate and method for manufacturing electronic component mounting substrate
#157Printed wiring board and method of manufacturing the same
#158FLEXIBLE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#159COMPONENT HAVING A METALIZED CERAMIC BASE
#160FLEXIBLE SUBSTRATE
#161COMPONENT HAVING A CERAMIC BASE THE SURFACE OF WHICH IS METALIZED
#162Electronic Component Module and Method for the Production Thereof
#163Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
#164Thin film capacitors on metal foils and methods of manufacturing same
#165Multilayer printed wiring board
#166Capacitor material, production method of the same, and capacitor, wiring board and electronic device containing that material
#167Reduced Porosity High-K Thin Film Mixed Grains for Thin Film Capacitor Applications
#168Interface module with high heat-dissipation
#169Embedded thin films
#170Printed wiring board
#171Ceramic metal composite and semiconductor device using the same
#172Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor
#173POLYIMIDE-METAL LAMINATED BODY AND POLYIMIDE CIRCUIT BOARD
#174Electronic component and electronic component module
#175Method for fabricating package substrate and die spacer layers having a ceramic backbone
#176Fabrics with high thermal conductivity coatings
#177LARGE AREA THIN FILM CAPACITORS ON METAL FOILS AND METHODS OF MANUFACTURING SAME
#178Capacitor-incorporated printed wiring board and electronic component
#179Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
#180METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH A THIN FILM CAPACITOR EMBEDDED THEREIN HAVING A DIELECTRIC FILM BY USING LASER LIFT-OFF, AND PRINTED CIRCUIT BOARD WITH A THIN FILM CAPACITOR EMBEDDED THEREIN MANUFACTURED THEREBY
#181Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same
#182Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same
#183FABRICATION METHOD OF COMPOSITE METAL OXIDE DIELECTRIC FILM, AND COMPOSITE METAL OXIDE DIELECTRIC FILM FABRICATED THEREBY
#184Package substrate with built-in capacitor and manufacturing method thereof
#185Multilayer printed wiring board
#186Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them
#187Package substrate with built-in capacitor and manufacturing method thereof
#188Thin film capacitor-embedded printed circuit board and method of manufacturing the same
#189SUBSTRATE STRUCTURE AND METHOD FOR WIDEBAND POWER DECOUPLING
#190Method of manufacturing printed circuit board
#191Multilayer printed wiring board
#192Structure and manufacturing method of substrate board
#193PRINTED WIRING BOARD
#194Circuit board assembly and backlight module comprising the same
#195Display device
#196Circuit board structure with capacitor embedded therein and method for fabricating the same
#197Method for manufacturing printed circuit board
#198High-capacitance density thin film dielectrics having columnar grains formed on base-metal foils
#199Methods for integration of thin-film capacitors into the build-up layers of a PWB
#200Method for Forming Oxide Dielectric Layer, and Capacitor Layer Forming Material Provided with Oxide Dielectric Layer Obtained by the Forming Method
#201Thin-film capacitor, laminated structure and methods of manufacturing the same
#202Polyimide-Metal Laminated Body and Polyimide Circuit Board
#203Material for forming capacitor layer and method for manufacturing the material for forming capacitor layer
#204Semiconductor device and wiring part thereof
#205Electronic Device Installed in an Engine Room
#206Methods of making thin film capacitors
#207Capacitor and manufacturing method thereof
#208Capacitor Layer Forming Material, Manufacturing Method Thereof, and Printed Wiring Board with Embedded Capacitor Layer Obtained Using Capacitor Layer Forming Material
#209Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor
#210Composite Films Suitable For Use In Opto-Electronic And Electronic Devices
#211Trimming Of Embedded Passive Components Using Pulsed Heating
#212Method of manufacturing circuit board embedding thin film capacitor
#213Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same
#214Method for fabricating an interposer
#215Method of making thin-film capacitors on metal foil using thick top electrodes
#216Printed circuit board with embedded capacitors therein and manufacturing process thereof
#217iTFC with optimized C(T)
#218iTFC with optimized C(T)
#219Method of manufacturing printed wiring board
#220Embedded capacitors for reducing package cracking
#221CIRCUIT BOARD
#222Thin film capacitors and methods of making the same
#223Sensor substrate and method of fabricating same
#224METHOD FOR MANUFACTURING MULTI-LAYER CERAMIC SUBSTRATE
#225Methods of making thin film capacitors comprising a manganese doped barium titantate dielectric
#226Articles comprising manganese doped barium titanate thin film compositions
#227Methods of forming individual formed-on-foil thin capacitors for embedding inside printed wiring boards and semiconductor packages
#228Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
#229Electronic component and method for manufacturing same
#230Multilayer wiring substrate and manufacturing method thereof
#231Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor
#232Method of providing a pre-patterned high-k dielectric film
#233Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same
#234Method for manufacturing capacitor embedded in PCB
#235Circuit substrate and electronic apparatus, fabrication process thereof
#236Nickel substrate thin film capacitor and method of manufacturing nickel substrate thin film capacitor
#237Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
#238Acceptor Doped Barium Titanate Based Thin Film Capacitors on Metal Foils and Methods of Making Thereof
#239Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
#240Method for forming multi-layer embedded capacitors on a printed circuit board
#241Multilayer printed board, electronic apparatus, and packaging method
#242Method for manufacturing printed circuit board with thin film capacitor embedded therein
#243Capacitance laminate and printed circuit board apparatus and method
#244PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITOR HAVING HIGH DIELECTRIC CONSTANT AND METHOD OF FABRICATING SAME
#245Power management module and method of manufacture
#246Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor
#247Dielectric device and method of manufacturing the same
#248High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof
#249Printed circuit board
#250Capacitor and method of manufacturing same
#251Barium Titanate Thin Films with Titanium Partially Substituted by Zirconium, Tin or Hafnium
#252Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure
#253Illumination system for use with display signage
#254Conductive material patterning methods
#255Printed wiring board and method of manufacturing the same
#256Thin film-capacitor-embedded printed circuit board and method of manufacturing the same
#257Method for manufacturing a printed circuit board with a film capacitor embedded therein, and a printed circuit board obtained thereby
#258Interposer and method for fabricating the same
#259Capacitor-built-in substrate and method of manufacturing the same
#260Printed circuit board with film capacitor embedded therein and method for manufacturing the same
#261Method of manufacturing thin film capacitor and printed circuit board having thin film capacitor embedded therein
#262Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same
#263Pre-patterned thin film capacitor and method for embedding same in a package substrate
#264Substrate structure and method for wideband power decoupling
#265Integrating three-dimensional high capacitance density structures
#266Methods and devices for cooling printed circuit boards
#267Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board
#268Dielectric film production process and capacitor
#269Fabrication method of composite metal oxide dielectric film, and composite metal oxide dielectric film fabricated thereby
#270Embedded thin layer capacitor, layered structure, and fabrication method of the same
#271Electrical components and method of manufacture
#272Thin film capacitors and methods of making the same
#273Pre-patterned thin film capacitor and method for embedding same in a package substrate
#274Manganese doped barium titanate thin film compositions, capacitors, and methods of making thereof
#275Electrodes, inner layers, capacitors, electronic devices and methods of making thereof
#276Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof
#277Method for manufacturing crystalline dielectric film,crystalline dielectric film manufactured thereby and thin film capacitor having the same
#278Reactively formed integrated capacitors on organic substrates and fabrication methods
#279Peelable circuit board foil
#280Package substrate with built-in capacitor and manufacturing method thereof
#281Reduced porosity high-k thin film mixed grains for thin film capacitor applications
#282High-k thin film grain size control
#283Circuit board and manufacturing method thereof
#284Printed circuit patterned embedded capacitance layer
#285Ceramic circuit substrate and manufacturing method thereof
#286Printed circuit board with embedded capacitors therein and manufacturing process thereof
#287Multilayer printed wiring board and a process of producing same
#288Method of forming film pattern, device, method of manufacturing the same, electro-optical apparatus, and electronic apparatus
#289Forming a substrate core with embedded capacitor and structures formed thereby
#290Forming a substrate core with embedded capacitor and structures formed thereby
#291Method of forming a substrate core with embedded capacitor and structures formed thereby
#292Multilayer printed wiring board
#293Method for manufacturing wiring board
#294Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
#295Buried capacitors for multi-layer printed circuit boards
#296Dielectric structure
#297Multilayer printed wiring board and a process of producing same
#298Conductive material patterning methods
#299Fabrics with high thermal conductivity coatings
#300Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit