COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

ULTRAVIOLET-CURABLE RESIN COMPOSITION, ADHESIVE, SEALANT, INSULATING PROTECTIVE AGENT, AND ELECTRONIC CIRCUIT BOARD

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

Heat-dissipating circuit board, heat-dissipating member, and production method for heat-dissipating circuit board

CIRCUIT BOARD

Protective Coating

IMMERSION COOLING WITH WATER-BASED FLUID USING NANO-STRUCTURED COATING

LAMINATED SHEET FOR METAL-CLAD LAMINATE, METHOD OF MANUFACTURING LAMINATED SHEET FOR METAL-CLAD LAMINATE, METAL-CLAD LAMINATE, AND METHOD OF MANUFACTURING METAL-CLAD LAMINATE

COATING BY ALD FOR SUPPRESSING METALLIC WHISKERS

Thin film capacitor, circuit board incorporating the same, and thin film capacitor manufacturing method

Electronic component

Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor

Membrane circuit board and keyboard device with same

Thin film capacitor and circuit board incorporating the same

Capacitor

Black liquid-crystal polymer film and multilayer board

Protective coating

Flame retardant structure for component carrier

Wiring board

Flexible display device

Electronic device and manufacturing method thereof

Flexible LED assembly with UV protection

Display device

Thin-film capacitor

Surface-treated copper foil, manufacturing method therefor, printed circuit board copper-clad laminate, and printed circuit board

METHOD FOR COATING DEVICE AND RESULTING DEVICE

Method for coating a device and devices having nanofilm thereon

Method for coating devices and resulting products

Adhesion Promoting Material-Coated Electrically Conductive Carrier With Thermally Conductive Layer

Flexible LED assembly with UV protection

Substrate for light emitting devices and light emitting device

Method of producing a fine line 3D non-planar conforming circuit

Fine line 3D non-planar conforming circuit

Semiconductor package with printed sensor

APPARATUS AND METHODS FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION OF POLYMER COATINGS

Method for producing substrate with transparent electrode, and substrate with transparent electrode

Element and formation method of film

Flexible display device and curved display device

Method of forming a multi-level thin film capacitor

Flexible display device

Interposer and electronic component package

Multi-layered film, electronic device, and manufacturing methods thereof

Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same

Method for manufacturing printed circuit boards

CIRCUIT BOARD WITH HEAT SINK AND METHOD OF FABRICATING THE SAME

Multilayer printed wiring board

CIRCUITIZED SUBSTRATE WITH INTERNAL THIN FILM CAPACITOR AND METHOD OF MAKING SAME

Multilayer printed wiring board and method of manufacturing the same

Light emitting diode submount with high thermal conductivity for high power operation

Multi-layer circuit assembly and process for preparing the same

SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY

SINTERED AND NANOPORE ELECTRIC CAPACITOR, ELECTROCHEMICAL CAPACITOR AND BATTERY AND METHOD OF MAKING THE SAME

Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor

High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof

Apparatus with a multi-layer coating and method of forming the same

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

COATINGS FOR SUPPRESSING METALLIC WHISKERS

High thermal performance packaging for optoelectronics devices

Surface-treated copper foil

Process for forming an isolated electrically conductive contact through a metal package

Electronic Substrate Having Low Current Leakage and High Thermal Conductivity and Associated Methods

Wiring board and method of manufacturing the same

PAIRED LOW-CHARACTERISTIC IMPEDANCE POWER LINE AND GROUND LINE STRUCTURE

Multilayer printed wiring board

Method for manufacturing interposer

ELECTRO-MAGNETIC BAND-GAP STRUCTURE, METHOD FOR MANUFACTURING THE SAME, FILTER ELEMENT AND PRINTED CIRCUIT BOARD HAVING EMBEDDED FILTER ELEMENT

Multilayer ceramic board and manufacturing method thereof

FLEXIBLE CIRCUIT BOARD MATERIAL AND METHOD FOR PRODUCING THE SAME

HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF

Electronic component mounting substrate and method for manufacturing electronic component mounting substrate

METAL LAYER LAMINATE HAVING ROUGHENED METAL SURFACE LAYER AND METHOD FOR PRODUCING THE SAME

COMBINED ELECTRICAL AND FLUIDIC INTERCONNECT VIA STRUCTURE

MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME

MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME

ATOMIC LAYER DEPOSITION PROCESS FOR MANUFACTURE OF BATTERY ELECTRODES, CAPACITORS, RESISTORS, AND CATALYZERS

Electric drive with a circuit board

Arrangement for hermetically sealing components, and method for the production thereof

Surface Coating

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Circuit board structure and manufacturing method thereof

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD

Printed circuit boards

Capacitor material, production method of the same, and capacitor, wiring board and electronic device containing that material

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Light emitting diode submount with high thermal conductivity for high power operation

Light emitting diode lamp with high heat-dissipation capacity

METHOD FOR APPLYING A METAL ON PAPER

Methods of making an environment protection coating system

Environmental protection coating system and method

Environmental protection coating system and method

Circuit board with high thermal conductivity and method for manufacturing the same

METHOD AND APPARATUS TO COAT OBJECTS WITH PARYLENE

Support substrate structure for supporting electronic component thereon and method for fabricating the same

ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Thin-film device and method of manufacturing same

Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH A THIN FILM CAPACITOR EMBEDDED THEREIN HAVING A DIELECTRIC FILM BY USING LASER LIFT-OFF, AND PRINTED CIRCUIT BOARD WITH A THIN FILM CAPACITOR EMBEDDED THEREIN MANUFACTURED THEREBY

Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same

Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same

FABRICATION METHOD OF COMPOSITE METAL OXIDE DIELECTRIC FILM, AND COMPOSITE METAL OXIDE DIELECTRIC FILM FABRICATED THEREBY

Circuit carrier

Multilayer printed wiring board

Thin film capacitor-embedded printed circuit board and method of manufacturing the same

METAL-CERAMIC COMPOSITE SUBSTRATE AND METHOD OF ITS MANUFACTURE

SUBSTRATE STRUCTURE AND METHOD FOR WIDEBAND POWER DECOUPLING

Circuit component, electrode connection structure and display device including the same

Multilayer printed wiring board with a built-in capacitor

Structure and manufacturing method of substrate board

PRINTED WIRING BOARD

MULTILAYER CIRCUIT DEVICES AND MANUFACTURING METHODS USING ELECTROPLATED SACRIFICIAL STRUCTURES

Structure of embedded capacitor

Method for manufacturing printed circuit board

LED device and back panel of liquid crystal display

High-capacitance density thin film dielectrics having columnar grains formed on base-metal foils

Miniature circuitry and inductive components and methods for manufacturing same

Circuit system with circuit element

Printed Circuit Board and Method for Manufacturing the Same

Thin-film capacitor, laminated structure and methods of manufacturing the same

Capacitor built-in substrate and method of manufacturing the same and electronic component device

Process for forming an isolated electrically conductive contact through a metal package

Semiconductor device and wiring part thereof

Electronic Device Installed in an Engine Room

Capacitor and manufacturing method thereof

Interposer and electronic device fabrication method

Interposer

Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor

System For And Method Of Planarizing The Contact Region Of A Via By Use Of A Continuous Inline Vacuum Deposition Process

Trimming Of Embedded Passive Components Using Pulsed Heating

Environmental protection coating system and method

Thin film capacitor, manufacturing method of the same, and electronic component

Modular board device, high frequency module, and method of manufacturing the same

Capacitor and multi-layer board embedding the capacitor

Method for fabricating an interposer

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

Method of making thin-film capacitors on metal foil using thick top electrodes

Printed circuit board with embedded capacitors therein and manufacturing process thereof

Capacitor embedded printed circuit board and manufacturing method thereof

Embedded capacitors for reducing package cracking

Interposer and method for manufacturing the same

Sensor substrate and method of fabricating same

Methods of making thin film capacitors comprising a manganese doped barium titantate dielectric

Articles comprising manganese doped barium titanate thin film compositions

Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby

Multilayer substrate

Electronic component and method for manufacturing same

Miniature circuitry and inductive components and methods for manufacturing same

Multilayer wiring substrate and manufacturing method thereof

Methods for manufacturing miniature circuitry and inductive components

Miniature circuitry and inductive components and methods for manufacturing same

Method of manufacturing non-shrinkage ceramic substrate

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Method of making circuitized substrate with internal organic memory device

Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same

Wiring board and method for fabricating the same

Method for manufacturing capacitor embedded in PCB

Nickel substrate thin film capacitor and method of manufacturing nickel substrate thin film capacitor

Multi-layer circuit assembly and process for preparing the same

Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor

Acceptor Doped Barium Titanate Based Thin Film Capacitors on Metal Foils and Methods of Making Thereof

Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same

Multilayer printed board, electronic apparatus, and packaging method

Multi-layer board with decoupling function

Method for manufacturing printed circuit board with thin film capacitor embedded therein

Glass material for radio-frequency applications

Insulated implantable electrical circuit

Flexible carrier with an electrically conducting structure

PRINTED CIRCUIT BOARD INCLUDING EMBEDDED CAPACITOR HAVING HIGH DIELECTRIC CONSTANT AND METHOD OF FABRICATING SAME

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor

High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof

Printed circuit board

Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength

Barium Titanate Thin Films with Titanium Partially Substituted by Zirconium, Tin or Hafnium

Package substrate

Thin film-capacitor-embedded printed circuit board and method of manufacturing the same

Thin-film device and method of manufacturing same

Method for manufacturing a printed circuit board with a film capacitor embedded therein, and a printed circuit board obtained thereby

Interposer and method for fabricating the same

Capacitor-built-in substrate and method of manufacturing the same

Printed circuit board with film capacitor embedded therein and method for manufacturing the same

Method of manufacturing thin film capacitor and printed circuit board having thin film capacitor embedded therein

Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same

Interposer and electronic device fabrication method

Pre-patterned thin film capacitor and method for embedding same in a package substrate

Substrate structure and method for wideband power decoupling

Methods and devices for cooling printed circuit boards

Circuit substrate

Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board

Fabrication method of composite metal oxide dielectric film, and composite metal oxide dielectric film fabricated thereby

Embedded thin layer capacitor, layered structure, and fabrication method of the same

Electronic component and method for manufacturing the same

Wiring substrate

Pre-patterned thin film capacitor and method for embedding same in a package substrate

Manganese doped barium titanate thin film compositions, capacitors, and methods of making thereof

Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof

Integrated thin-film capacitor with etch-stop layer, process of making same, and packages containing same

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

Method for manufacturing crystalline dielectric film,crystalline dielectric film manufactured thereby and thin film capacitor having the same

Printed circuit board structure and manufacturing method thereof

Insulated implantable electrical circuit

Circuit board and manufacturing method thereof

Printed circuit patterned embedded capacitance layer

Printed circuit board with embedded capacitors therein and manufacturing process thereof

Multilayer printed wiring board and a process of producing same

High reliability multilayer circuit substrates and methods for their formation

Wiring board and method for fabricating the same

Miniature circuitry and inductive components and methods for manufacturing same

Forming a substrate core with embedded capacitor and structures formed thereby

Forming a substrate core with embedded capacitor and structures formed thereby

Method of forming a substrate core with embedded capacitor and structures formed thereby

System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition

Multilayer printed wiring board

Method of manufacturing wiring substrate to which semiconductor chip is mounted

Method for manufacturing wiring board

Insulating substrate and semiconductor device having a thermally sprayed circuit pattern

Integrated thin film capacitor/inductor/interconnect system and method

Wiring apparatus, protecting cap for device package using the same, and a method for manufacturing them

Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer

Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same

Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same

Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same

Flexible circuit corrosion protection

Multilayer printed wiring board and a process of producing same

Modular board device, high frequency module, and method of manufacturing same

Multilayer printed board, electronic apparatus, and packaging method

Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures

High reliability multilayer circuit substrates

Printed circuit embedded capacitors

Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor

Method and system for non-vascular sensor implantation

Method of making electromagnetic wave shielded write and read wires on a support for a magnetic media drive

Peelable circuit board foil

Thin-film capacitor and method of producing the capacitor

Adhesiveless flexible substrate and method of manufacturing the same

Low temperature bonding of multilayer substrates