H05K2201/0263 - CPC Classification Index

ClassID:

234359 ⎘

H05K2201/0263 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials; Fillers and particles Details about a collection of particles

Sub-classes:

H05K2201/0266 » Size distribution 110
H05K2201/0266 » Size distribution 110
H05K2201/0269 » Non-uniform distribution or concentration of particles 53
H05K2201/0269 » Non-uniform distribution or concentration of particles 53
H05K2201/0272 » Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape 110
H05K2201/0272 » Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape 110

Recent Application in this class:

20260101430

2026-04-09

COATING AGENT AND ELECTRONIC COMPONENT MODULE MANUFACTURING METHOD

20250311115

2025-10-02

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

20250220813

2025-07-03

WIRING BOARD

20250048562

2025-02-06

WIRING SUBSTRATE

20240306312

2024-09-12

PRINTED WIRING BOARD

20240155760

2024-05-09

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

20240059863

2024-02-22

RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, RESIN COATED COPPER, AND CIRCUIT BOARD COMPRISING SAME

20230354515

2023-11-02

Circuit structure

20230180385

2023-06-08

Wiring substrate

#10

20230018333

2023-01-19

LAMINATE, BONDING METHOD, AND INTERMEDIATE PRODUCT FOR CIRCUIT BOARD

#11

20220183155

2022-06-09

Printed circuit board and insulating film used therein

#12

20220005626

2022-01-06

Electroconductive particles and signal-transmitting connector having same

#13

20210274652

2021-09-02

Circuit structure

#14

20160100480

2016-04-07

Textile integration of electronic circuits

#15

20130096233

2013-04-18

Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board