234339 ⎘
Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials Fillers and particles
Sub-classes:CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF
#2Stretchable interconnects for flexible electronic surfaces
#3Stretchable interconnects for flexible electronic surfaces
#4Stretchable interconnects for flexible electronic surfaces
#5Multilayer laminate and method for producing multilayer printed wiring board using same
#6Wearable smart device
#7MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY OR ELECTRO-MAGNETIC CARRIER
#8Stretchable interconnects for flexible electronic surfaces
#9Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier
#10Conductive patterns and methods of using them
#11Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive paste
#12Conductor composition ink, conductor, laminate, laminated wiring board and electronic equipment
#13Connection body and connection body manufacturing method
#14Method for making a circuit board
#15ELECTROSTATIC DISCHARGE PROTECTION BOARD
#16Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit
#17Electronic Component and Method of Manufacturing the Electronic Component
#18Method for producing a high-aspect ratio conductive pattern on a substrate