ClassID:

234339

H05K2201/0203 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials Fillers and particles

Sub-classes:
Recent Application in this class:
#1
20240276640
2024-08-15

CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF

#2
20240029916
2024-01-25

Stretchable interconnects for flexible electronic surfaces

#3
20210350949
2021-11-11

Stretchable interconnects for flexible electronic surfaces

#4
20200294686
2020-09-17

Stretchable interconnects for flexible electronic surfaces

#5
20190110364
2019-04-11

Multilayer laminate and method for producing multilayer printed wiring board using same

#6
20190053546
2019-02-21

Wearable smart device

#7
20180376591
2018-12-27

MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY OR ELECTRO-MAGNETIC CARRIER

#8
20170200527
2017-07-13

Stretchable interconnects for flexible electronic surfaces

#9
20170188455
2017-06-29

Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier

#10
20170164484
2017-06-08

Conductive patterns and methods of using them

#11
20170144220
2017-05-25

Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive paste

#12
20170130085
2017-05-11

Conductor composition ink, conductor, laminate, laminated wiring board and electronic equipment

#13
20160381801
2016-12-29

Connection body and connection body manufacturing method

#14
20160366766
2016-12-15

Method for making a circuit board

#15
20160029479
2016-01-28

ELECTROSTATIC DISCHARGE PROTECTION BOARD

#16
20160007477
2016-01-07

Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit

#17
20140353010
2014-12-04

Electronic Component and Method of Manufacturing the Electronic Component

#18
20080137316
2008-06-12

Method for producing a high-aspect ratio conductive pattern on a substrate