MATERIAL SHEET HAVING LCP FIBERS AND LOW-LOSS DIELECTRIC

LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BOARD INCLUDING SAME

Elastic printed conductors

Elastic printed conductors

Electronic functional member, electronic component, and wearable device

FIBER COMPOSITE LAMINATE INCLUDING SELF-ASSEMBLED CONDUCTIVE PASTE AND METHOD OF MANUFACTURING SAME

Integrally formed product, and composite material, terminal for electrical contact and printed wiring board including the integrally formed product

Connector integration for smart clothing

Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure

Sensor device for detecting pressure

Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same

Connector integration for smart clothing

Wearable device and method for manufacturing same

Film material, electronic component using film material, and method for producing electronic component

Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure

SYNTHETIC PAPER

Hybrid PCB with multi-unreinforced laminate

Circuit materials, circuit laminates, and articles formed therefrom

Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board

SUBSTRATE RAW MATERIAL AND METHOD FOR MANUFACTURING THE SAME, AND CIRCUIT BOARD MANUFACTURED USING THE SAME

Method of manufacturing a patterned transparent conductor

Method of making conducting polymer nanofibers

HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME

RESIN-IMPREGNATED BASE SUBSTRATE AND METHOD FOR PRODUCING THE SAME

FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME

FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME

Fiber, fiber aggregate and adhesive having the same

ELECTRONIC TEXTILE, ARTICLE AND METHOD

Organic-inorganic electrospun fibers

Multilayer printed wiring board with filled viahole structure

LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES

METHOD FOR PRODUCING LIQUID CRYSTALLINE POLYESTER IMPREGNATED FIBER SHEET

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

Lightweight circuit board with conductive constraining cores

Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto

Flexible printed conductive fabric and method for fabricating the same

Circuit board and mounting structure

Package for semiconductor devices

Package for semiconductor devices

CURABLE RESIN COMPOSITION, COMPOSITE BODY, MOLDED BODY, LAMINATED BODY AND MULTILAYERED CIRCUIT BOARD

Multilayer printed wiring board with filled viahole structure

Composite woven fabric and printed wiring board

Circuitized substrate with P-aramid dielectric layers and method of making same

PLURAL LAYER WOVEN ELECTRONIC TEXTILE, ARTICLE AND METHOD

Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the same

Printed wiring board with reinforced insulation layer and manufacturing method thereof

Prepreg and its application products for low thermal expansion and low dielectric tangent

Method of making halogen-free circuitized substrate with reduced thermal expansion

Multilayered circuitized substrate with P-aramid dielectric layers and method of making same

Composite resin molded article, laminate, multi-layer circuit board, and electronic device

THERMALLY CONDUCTIVE ARAMID-BASED DIELECTRIC SUBSTRATES FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT CHIP PACKAGING

Multilayer printed wiring board and manufacturing method thereof

Pipd Paper and Components Made Therefrom

Circuit board and method of manufacturing the same

Multilayer printed wiring board with filled viahole structure

Polymer brushes

PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING THE SAME

Process of electrospinning organic-inorganic fibers

Circuitized substrate with continuous thermoplastic support film dielectric layers

Multilayered circuitized substrate with p-aramid dielectric layers and method of making same

Method of Forming a Low Dielectric Loss Composite Material

Laminate for flexible printed wiring board

Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

Silicone-based fiber, nonwoven fabric formed therefrom, and methods of producing same

Package for semiconductor devices

Assemblies useful for the preparation of electronic components and methods for making same

Composite materials including amorphous thermoplastic fibers

Low dielectric composite materials including high modulus polyolefin fibers

Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto

Fluoropolymer laminates and a process for manufacture thereof

Method for machining a board

Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion

Resin-impregnated base substrate and method for producing the same

Composite papyraceous material

PLURAL LAYER WOVEN ELECTRONIC TEXTILE, ARTICLE AND METHOD

Composite materials including high modulus polyolefin fibers

Methods of forming composite materials including high modulus polyolefin fibers

Basic board member for electric facility

Carrier tape for loading flexible printed circuits

Composites, method of manufacture thereof, and articles formed therefrom

Laminate for printed circuit board and method of manufacturing the same

Fabric reinforcement using modified cyclic olefin copolymer and resin substrate for printed circuit board

Circuit board and production method therefor

Fluoropolymer laminates and a process for manufacture thereof

Multilayer printed wiring board with filled viahole structure

Energy absorbent laminate

Method for producing aramid laminate

Resin-impregnated substrate

Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board

Aramid paper blend

Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same

Resin-impregnated substrate

Backup board for machining process

Sheet material especially useful for circuit boards

Base material for laminate and process for producing the same

Multilayer printed wiring board with filled viahole structure

Low signal loss bonding ply for multilayer circuit boards

Lightweight circuit board with conductive constraining cores

Lightweight circuit board with conductive constraining cores

Wiring substrate for intermediate connection and multi-layered wiring board and their production

Prepreg for printed wiring board, printed wiring board using the prepreg and method for manufacturing the printed wiring board, and multilayer printed wiring board and method for manufacturing the multilayer printed wiring board

Package for semiconductor devices