234363 ⎘
Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials Fibers and reinforcement materials
Sub-classes:ELECTRICAL DEVICE, METHOD FOR PRODUCING AN ELECTRICAL DEVICE
#2PRINTED CIRCUIT BOARD
#3FLEXIBLE PRINTED CIRCUIT BOARD FOR SMALL BENDING-RADIUS APPLICATIONS
#4CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
#5PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
#6CIRCUIT BOARD
#7RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
#8ELECTRONIC COMPONENT MOUNTING SUBSTRATE
#9ELECTRONIC DEVICE AND PRODUCT
#10Laminate, laminate with buildup layer, laminate with metal foil, and circuit board
#11Use of MgO, ZnO, And Rare Earth Oxides for Making Improved Low Dielectric Fibers With Improved Low Thermal Expansion Coeffiicient For High Boron Aluminosilicate Compositions
#12ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
#13Printed circuit board
#14Circuit board
#15CIRCUIT BOARD
#16Resin Sheet and Circuit Board Material Using the Same
#17WIRING SUBSTRATE
#18Fluoride-based resin prepreg and circuit substrate using the same
#19Patterned fiber substrate
#20Method and compositions for embedding electronics in fiber-composite parts fabricated via compression molding
#21Three-dimensional circuit assembly with composite bonded encapsulation
#22Printed circuit board
#23Use of MGO, ZNO, and rare earth oxides for making improved low dielectric fibers with improved low thermal expansion coefficient for high boron aluminosilicate compositions
#24Printed wiring board
#25Thermally conductive type polyimide substrate
#26Use of MgO, ZnO, and rare earth oxides for making improved low dielectric fibers with improved low thermal expansion coefficient for high boron aluminosilicate compositions
#27Spread weave induced skew minimization
#28Method of manufacturing a patterned conductor
#29PREPREG, PRINTED CIRCUIT BOARD INCLUDING PREPREG, AND METHOD OF FABRICATING THE SAME
#30Conductive pattern formation method, conductive pattern-bearing substrate, and touch panel sensor
#31Prepreg, metal foil-clad laminate, and printed wiring board
#32Printed wiring board
#33Composite substrate for light emitting diodes
#34Multilayer wiring substrate
#35Semiconductor package
#36HIGH THERMAL CONDUCTIVITY PREPREG, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD USING THE PREPREG, AND SEMICONDUCTOR DEVICE USING THE MULTILAYER PRINTED WIRING BOARD
#37Angle-adjustable and/or angled printed circuit board structure having at least two printed circuit board sections and method for producing the same
#38Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board
#39Conductive pattern formation method, conductive pattern-bearing substrate, and touch panel sensor
#40PREPREG AND USES OF THE SAME
#41Printed circuit board package structure and manufacturing method thereof
#42INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME
#43Electronic device comprising a substrate board equipped with a local reinforcing or balancing layer
#44Metal-clad laminate and printed wiring board
#45Epoxy resin varnishes, laminates and printed circuit boards
#46Printed circuit board
#47Composite substrate for light emitting diodes