ClassID:

234366

H05K2201/0284 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials; Fibers and reinforcement materials Paper, e.g. as reinforcement

Recent Application in this class:
#1
20250168976
2025-05-22

ALTERNATIVE FOR FR-4 MATERIAL

#2
20240125050
2024-04-18

CIRCUIT BOARD UNWOVEN FABRIC, CIRCUIT BOARD PREPREG USING SAME AND CIRCUIT BOARD USING SAME

#3
20200283615
2020-09-10

Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board

#4
20200267836
2020-08-20

Monitoring circuitry

#5
20200260789
2020-08-20

Circuit board for non-combustion type flavor inhaler and non-combustion type flavor inhaler

#6
20200223998
2020-07-16

PREPREG, AND METAL-CLAD LAMINATED BOARD AND WIRING SUBSTRATE OBTAINED USING SAME

#7
20200187350
2020-06-11

PAPER-IN-RESIN ELECTRONICS - PROCESS FOR PRODUCING IT AND APPLICATION IN MANUFACTURED PRODUCTS

#8
20190376237
2019-12-12

Aramid paper suitable for use in electronic applications

#9
20190150280
2019-05-16

Monitoring circuitry

#10
20150264812
2015-09-17

Laminate including conductive circuit patterns

#11
20150218326
2015-08-06

Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board

#12
20120275119
2012-11-01

Method and products related to deposited particles

#13
20120234585
2012-09-20

Support for electronic circuits

#14
20120184326
2012-07-19

Electronic circuit

#15
20120081868
2012-04-05

Electronic assemblies and methods of forming electronic assemblies

#16
20110293851
2011-12-01

METHOD FOR CREATING A SUBSTRATE FOR PRINTED OR COATED FUNCTIONALITY, SUBSTRATE, FUNCTIONAL DEVICE AND ITS USE

#17
20110183564
2011-07-28

Metal-clad phenolic resin laminate

#18
20110149529
2011-06-23

PROCESSING OF ELECTRIC AND/OR ELECTRONIC ELEMENTS ON CELLULOSIC SUBSTRATES

#19
20110005821
2011-01-13

Method for manufacturing laminated circuit board

#20
20100284187
2010-11-11

PLANAR ILLUMINATION DEVICE

#21
20100143681
2010-06-10

FLEXIBLE SUBSTRATE

#22
20100108276
2010-05-06

Boron nitride-based fiber paper and manufacturing process thereof

#23
20100009169
2010-01-14

Reducing dusting of epoxy laminates

#24
20090297840
2009-12-03

METHOD FOR APPLYING A METAL ON PAPER

#25
20090264036
2009-10-22

Nanofiber sheet, process for producing the same, and fiber-reinforced composite material

#26
20090202843
2009-08-13

Flexible substrate and manufacturing method thereof

#27
20090063755
2009-03-05

PAPER-SHAPED NON-VOLATILE STORAGE DEVICE

#28
20080302562
2008-12-11

PRINTED CIRCUIT BOARD

#29
20080117238
2008-05-22

Functional device fabrication apparatus and functional device fabricated with the same

#30
20070098882
2007-05-03

Electronic substrate, electronic circuit, and method and device for manufacturing of the same

#31
20060216486
2006-09-28

Entry board suitable for use during drilling of an integrated circuit board

#32
20060188702
2006-08-24

Electronic apparatus including printed circuit board

#33
20060105176
2006-05-18

Prepreg and laminate and printed wiring board using the same

#34
20050230486
2005-10-20

Method for manufacturing radiofrequency identification device using transfer paper and radiofrequency identification device produced using this method

#35
20050112344
2005-05-26

Apparatus and method for use in printed circuit board drilling applications