H05K2201/0287 - CPC Classification Index

ClassID:

234367 ⎘

H05K2201/0287 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials; Fibers and reinforcement materials Unidirectional or parallel fibers

Recent Application in this class:

20200043627

2020-02-06

Integrally formed product, and composite material, terminal for electrical contact and printed wiring board including the integrally formed product

20190387615

2019-12-19

MULTI-LAYER INTERCONNECTED ELECTRO-THERMAL SYSTEM HAVING A THERMALLY NON-EXPANSIVE SUPPORT FOR MOUNTING POSITIONALLY RELATED SENSOR COMPONENTS

20190053371

2019-02-14

Circuit board and semiconductor package using the same

20150029652

2015-01-29

Foldable display

20120097431

2012-04-26

LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES

20100319969

2010-12-23

Lightweight circuit board with conductive constraining cores

20100254098

2010-10-07

Circuit board, mounting structure, and method for manufacturing circuit board

20100136284

2010-06-03

Fiber-reinforced resin and method for manufacturing the same

20100051327

2010-03-04

Multilayer-wired substrate

#10

20070126095

2007-06-07

Semiconductor device and manufacturing method thereof

#11

20070116938

2007-05-24

Polymer composite formed article, printed wiring board using the formed article, and methods of producing them

#12

20050019541

2005-01-27

Lightweight circuit board with conductive constraining cores

#13

20050019535

2005-01-27

Lightweight circuit board with conductive constraining cores

#14

17214215

2022-01-25

Printed circuit board trace for galvanic effect reduction

#15

14229671

2016-07-19

Method of attaching electronic module on fabrics by stitching metal foil