H05K2201/0293 - CPC Classification Index

#1

20260040443

2026-02-05

USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS

#2

20250368791

2025-12-04

NON-WOVEN FABRIC PREPREG, METAL-FOIL-CLAD PLATE AND PRINTED CIRCUIT BOARD

#3

20240341032

2024-10-10

USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS

#4

20240125050

2024-04-18

CIRCUIT BOARD UNWOVEN FABRIC, CIRCUIT BOARD PREPREG USING SAME AND CIRCUIT BOARD USING SAME

#5

20220322517

2022-10-06

Printed circuit board substrate comprising a coated boron nitride

#6

20210202361

2021-07-01

Wiring board and method of manufacturing the same

#7

20200413536

2020-12-31

POLYMER MATRIX COMPOSITE, PREPREG AND PRINTED CIRCUIT BOARD FOR ELIMINATING SKEW AND FIBER WEAVE EFFECT

#8

20200404782

2020-12-24

Metal-clad laminate and manufacturing method of the same

#9

20200283615

2020-09-10

Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board

#10

20200275550

2020-08-27

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

#11

20200260789

2020-08-20

Circuit board for non-combustion type flavor inhaler and non-combustion type flavor inhaler

#12

20200157332

2020-05-21

Thermosetting resin composition and prepreg and metal foil-covered laminate made using same

#13

20200043627

2020-02-06

Integrally formed product, and composite material, terminal for electrical contact and printed wiring board including the integrally formed product

#14

20180255636

2018-09-06

Wearable device and method for manufacturing same

#15

20170283588

2017-10-05

LIGHT EMITTING DIODE BASED DAYLIGHT RUNNING LIGHT

#16

20170273197

2017-09-21

Printed wiring board and method of producing the same

#17

20170064818

2017-03-02

Package board and prepreg

#18

20160372269

2016-12-22

Resin composition and dielectric layer and capacitor produced therefrom

#19

20160280965

2016-09-29

Film material, electronic component using film material, and method for producing electronic component

#20

20160243577

2016-08-25

Arrangement for producing an electrically conductive pattern on a surface

#21

20150282323

2015-10-01

Wiring board and method of manufacturing the same

#22

20150257263

2015-09-10

Circuit materials, circuit laminates, and articles formed therefrom

#23

20150223343

2015-08-06

Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method

#24

20150218326

2015-08-06

Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board

#25

20150159016

2015-06-11

Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom

#26

20150122532

2015-05-07

HIGH TEMPERATURE MULTILAYER FLEXIBLE PRINTED WIRING BOARD

#27

20150017341

2015-01-15

Method for producing an electrically conductive pattern on a surface

#28

20140362494

2014-12-11

Resin composition and dielectric layer and capacitor produced therefrom

#29

20140353022

2014-12-04

Wiring board

#30

20140147682

2014-05-29

Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer

#31

20140002311

2014-01-02

Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layer

#32

20130153832

2013-06-20

Electrostatic dissipative composites

#33

20130062045

2013-03-14

HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME

#34

20120211270

2012-08-23

METHOD OF MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

#35

20120034382

2012-02-09

SUBSTRATE SUPPORT MATERIAL USEFUL FOR SCREEN PRINTING PROCESSES

#36

20120012553

2012-01-19

METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES

#37

20110315437

2011-12-29

Printed circuit board with reinforced thermoplastic resin layer

#38

20110214907

2011-09-08

Multi layer circuit board and manufacturing method of the same

#39

20110103058

2011-05-05

Printed circuit for five LEDs in series

#40

20100048066

2010-02-25

Method for contacting partially conductive textile materials

#41

20100009169

2010-01-14

Reducing dusting of epoxy laminates

#42

20090286055

2009-11-19

Methods and Devices for Providing Flexible Electronics

#43

20090255714

2009-10-15

Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board

#44

20090229868

2009-09-17

Printed wiring board with reinforced insulation layer and manufacturing method thereof

#45

20090126887

2009-05-21

Pipd Paper and Components Made Therefrom

#46

20090008050

2009-01-08

METHODS FOR PRODUCING WET-SPUN NON-WOVEN FABRICS

#47

20080258873

2008-10-23

Functional Laminate

#48

20080227354

2008-09-18

Hot-Press Cushioning Material its Manufacturing Method and Manufacturing Method of Laminated Board

#49

20080057816

2008-03-06

Silicone-based fiber, nonwoven fabric formed therefrom, and methods of producing same

#50

20070160810

2007-07-12

Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component

#51

20070149001

2007-06-28

Flexible circuit

#52

20060210780

2006-09-21

Circuit board and production method therefor

#53

20050266758

2005-12-01

Wet-spun non-woven fabric and method for producing the same

#54

20050230072

2005-10-20

Aramid paper blend

#55

20050136233

2005-06-23

Sheet material especially useful for circuit boards

#56

20050118910

2005-06-02

Base material for laminate and process for producing the same

#57

20050014035

2005-01-20

Prepreg for printed wiring board, printed wiring board using the prepreg and method for manufacturing the printed wiring board, and multilayer printed wiring board and method for manufacturing the multilayer printed wiring board