H05K2201/0335 - CPC Classification Index

ClassID:

234383 ⎘

H05K2201/0335 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Conductive materials; Structure of the conductor Layered conductors or foils

Sub-classes:

H05K2201/0338 » Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer 446
H05K2201/0338 » Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer 446
H05K2201/0341 » Intermediate metal, e.g. before reinforcing of conductors by plating 80
H05K2201/0341 » Intermediate metal, e.g. before reinforcing of conductors by plating 80
H05K2201/0344 » Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer 59
H05K2201/0344 » Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer 59
H05K2201/0347 » Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias 326
H05K2201/0347 » Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias 326
H05K2201/035 » Paste overlayer, i.e. conductive paste or solder paste over conductive layer 129
H05K2201/035 » Paste overlayer, i.e. conductive paste or solder paste over conductive layer 129
H05K2201/0352 » Differences between the conductors of different layers of a multilayer 246
H05K2201/0352 » Differences between the conductors of different layers of a multilayer 246
H05K2201/0355 » Metal foils 976
H05K2201/0355 » Metal foils 976
H05K2201/0358 » Resin coated copper [RCC] 161
H05K2201/0358 » Resin coated copper [RCC] 161
H05K2201/0361 » Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched 32
H05K2201/0361 » Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched 32

Recent Application in this class:

20260066784

VOLTAGE CONVERTER AND METHOD FOR PRODUCING A VOLTAGE CONVERTER

20250386433

WIRING BOARD AND MOUNTING STRUCTURE USING THE WIRING BOARD

20250168969

SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT AND METHOD FOR PRODUCING THE SAME

20240179831

ELECTRONIC MODULE AND ELECTRONIC DEVICE

20230422405

CIRCUIT STRUCTURE FOR HOT-PRESS BONDING

20230115820

METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING INSULATION CIRCUIT SUBSTRATE

20220338350

Board-to-board connection structure and method for manufacturing the same

20220279653

Conductive trace interconnection tape

20220022325

Barrier layer

20210092839

Conductive trace interconnection tape

20200413576

Electromagnetic wave shielding sheet and printed wiring board

20200413534

INSULATED CIRCUIT BOARD

20200367358

CONDUCTIVE TRACE INTERCONNECTION TAPE

20200154575

Barrier layer

20190017188

Copper foil with minimized bagginess, wrinkle or tear, electrode including the same, secondary battery including the same and method for manufacturing the same

20170135220

Printable Films for Printed Circuit Boards and Processes for Making Same

20160234930

STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME

20150257261

Printed wiring board

20150237734

Manufacturing method for component incorporated substrate and component incorporated substrate

20150101848

SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDING THE SAME, PRINTED CURCUIT BOARD USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME

16673927

Electromagnetic wave shielding sheet and printed wiring board

14638686

Metal-free monolithic epitaxial graphene-on-diamond PWB with optical waveguide