234384 ⎘
Indexing scheme relating to printed circuits covered by; Conductive materials; Structure of the conductor; Layered conductors or foils Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
PRINTED CIRCUIT BOARD
#2PRINTED CIRCUIT BOARD
#3WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME
#4CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A CAMERA MODULE INCLUDING THE SAME
#5WIRING SUBSTRATE
#6PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#7High-Density Multi-Level Interconnects for Harsh Environments and Power Packaging and Method of Making The Same
#8WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
#9RESIN MULTILAYER SUBSTRATE AND CIRCUIT MODULE
#10ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURING EMBEDDED SUBSTRATE BY USING SAME
#11PRINTED WIRING BOARD
#12ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#13PRINTED WIRING BOARD
#14PRINTED WIRING BOARD
#15DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#16LAMINATED UNIT FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
#17Component Carrier and Method Manufacturing the Component Carrier
#18ELECTRODEPOSITED COPPER FOIL WITH A PREFFERED ORIENTATION OF (200) CRYSTAL PLANE AND APPLICATIONS THEREOF
#19SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
#20POWER ELECTRONIC SYSTEM WITH CONDUCTOR HAVING DAMPING FUNCTION
#21WIRING BOARD
#22PRINTED CIRCUIT BOARD
#23TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS
#24PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#25SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT AND METHOD FOR PRODUCING THE SAME
#26PRINTED CIRCUIT BOARD
#27WIRING BOARD
#28COIL DEVICE AND PRINTED WIRING BOARD
#29SWITCHING POWER SUPPLY DEVICE
#30WIRING BOARD
#31PRINTED CIRCUIT BOARD
#32WIRING SUBSTRATE
#33Metal-ceramic substrate and method for producing a metal ceramic substrate
#34CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT THERMAL EXPANSION COEFFICIENTS AND METHOD FOR PRODUCING THE SAME
#35MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIRCULATOR
#36PRINTED WIRING BOARD
#37PRINTED WIRING BOARD
#38PRINTED WIRING BOARD
#39FLEXIBLE CIRCUIT BOARD
#40PRINTED CIRCUIT BOARD
#41ELECTRONIC DEVICE
#42MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
#43WIRING BOARD AND MANUFACTURING METHOD THEREFOR
#44CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING MULTILAYERED WIRING BOARD, AND MULTILAYERED WIRING BOARD
#45METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
#46WIRING SUBSTRATE
#47ELECTRONIC DEVICE
#48WIRING SUBSTRATE
#49BATTERY PACK AND METHOD OF MANUFACTURING THE SAME
#50METHOD FOR FORMING METAL LAYERS ON GLASS-CONTAINING SUBSTRATE, AND RESULTING DEVICE
#51CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE
#52CIRCUIT MODULE
#53WIRING BOARD
#54PRINTED WIRING BOARD
#55WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME
#56PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#57ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURING EMBEDDED SUBSTRATE BY USING SAME
#58SYSTEMS AND METHODS FOR FORMING STUBLESS PLATED THROUGH HOLES HAVING WRAPPING STRUCTURES IN PRINTED CIRCUIT BOARDS
#59CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A CAMERA MODULE INCLUDING THE SAME
#60PRINTED WIRING BOARD
#61Connecting assembly, camera module, and electronic device
#62TEXTURED METAL CORE PRINTED CIRCUIT BOARDS FOR IMPROVED THERMAL DISSIPATION
#63WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
#64WIRING CIRCUIT BOARD
#65WIRING BOARD
#66WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
#67PACKAGE SUBSTRATE STRUCTURE
#68ELECTRONIC COMPONENT
#69Flexible circuit board
#70Printed circuit board and method of fabricating the same
#71PRINTED WIRING BOARD
#72DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#73APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING SUBSTRATE
#74Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
#75Connection structure embedded substrate and substrate structure including the same
#76MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#77Flexible printed circuit board and method of manufacturing flexible printed circuit board
#78CONDUCTOR BONDING METHOD
#79One-Step Oxide Bath for Improving Adhesion of Polymeric Materials to Metal Substrates
#80Solder composition for use in solder joints of printed circuit boards
#81Carrier-foil-attached ultra-thin copper foil
#82Wiring substrate
#83Wiring circuit board
#84WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
#85Application of electrical conductors of a solar cell
#86Electronic device and manufacturing method thereof
#87Wiring circuit board
#88WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
#89Method for applying a pattern to a substrate
#90Bonded body, ceramic copper circuit substrate, and semiconductor device
#91Metal-coated liquid-crystal polymer film
#92TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS
#93SEMICONDUCTOR DEVICE
#94Stretchable electronic device
#95Electronic device
#96Printed circuit board and storage device including the same
#97Display apparatus
#98TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS
#99TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS
#100Flexible circuit board
#101Metal circuit structure based on FPC and method of making the same
#102Circuit board, an image sensor module, a lens driving device, and a camera module including the same
#103Poly-supported copper foil
#104Bonding pad structure
#105Connection structure embedded substrate and substrate structure including the same
#106Printed circuit board and method of fabricating the same
#107Camera module
#108Printed circuit board, communications device, and manufacturing method
#109Flexible circuit board and method for manufacturing same
#110Wiring board and manufacturing method for same
#111IMPLANTABLE THIN FILM DEVICES
#112Flexible circuit board
#113Production method for copper/ceramic joined body, production method for insulated circuit board, copper/ceramic joined body, and insulated circuit board
#114Stretchable electronic device
#115Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
#116Display apparatus
#117Resin composition, metal laminate and printed circuit board using same, and method for manufacturing metal laminate
#118Composite and copper clad laminate made therefrom
#119Method for manufacturing wiring board
#120Surface treated copper foil, copper clad laminate, and printed circuit board
#121Surface treated copper foil, copper clad laminate, and printed circuit board
#122Bonding structure of lateral side of display panel
#123Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
#124Surface treated copper foil, copper clad laminate, and printed circuit board
#125Surface treated copper foil, copper clad laminate, and printed circuit board
#126Printed wiring board
#127Micro-roughened electrodeposited copper foil and copper clad laminate
#128Electrodeposited copper foil and electrode, and lithium-ion secondary battery comprising the same
#129Electroconductive substrate, electronic device and display device
#130Printed circuit board and method of fabricating the same
#131Electrodeposited copper foil, current collector, electrode, and lithium ion secondary battery comprising the same
#132Method for manufacturing wiring substrate
#133Application of electrical conductors to an electrically insulating substrate
#134Flexible printed circuit board and method of manufacturing flexible printed circuit board
#135Surface-treated copper foil, manufacturing method thereof, copper foil laminate including the same, and printed wiring board including the same
#136Printed wiring board and method for manufacturing printed wiring board
#137Flexible membrane for applying a pattern to a substrate
#138Flexible circuit board and display device
#139Poly-supported copper foil
#140Thermally conductive board
#141Apparatus for applying of a conductive pattern to a substrate
#142Base material for printed circuit board and printed circuit board
#143MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
#144Printed circuit board and method of fabricating the same
#145Bonding pad structure
#146Wiring board and method of manufacturing the same
#147Package carrier and package structure
#148Component carrier and method of manufacturing the same
#149Component carrier with embedded tracks protruding up to different heights
#150Wiring substrate
#151Wiring substrate
#152Wiring substrate
#153SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
#154Surface treated copper foil
#155Electrolytic copper foil with low profile
#156BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
#157APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING SUBSTRATE
#158Electroconductive substrate, electronic device and display device
#159Wiring substrate and method for producing wiring substrate
#160Printed circuit board and manufacturing method for the same
#161Flexible wiring circuit board and imaging device
#162Method for reduction of interfacial stress accumulation between double side copper-plated layers and aluminum nitride substrate
#163Printed circuit board and method of fabricating the same
#164Method for manufacturing multi-layer circuit board capable of being applied with electrical testing
#165Population of metal oxide nanosheets, preparation method thereof, and electrical conductor and electronic device including the same
#166Flexible circuit board
#167Display device having protective cover
#168Multilayer printed circuit board via hole registration and accuracy
#169Circuit substrate and semiconductor device
#170METHOD OF FINISHING A METALLIC CONDUCTIVE LAYER
#171Sn whisker growth mitigation using NiO sublayers
#172Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board
#173Circuit board and method for production thereof
#174Mounting component and electronic device
#175Metallization structure and manufacturing method thereof
#176Wiring board and method for manufacturing same
#177Implantable thin film devices
#178Apparatus for applying of a conductive pattern to a substrate
#179Application of electrical conductors to an electrically insulating substrate
#180Component carrier with different surface finishes and method for manufacturing the same
#181Application of electrical conductors of a solar cell
#182Circuit substrate
#183Sensor for detecting immersion in F.O.G. or water
#184Electronic device and manufacturing method thereof
#185Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
#186Component carrier having a three dimensionally printed wiring structure
#187Method for forming circuit board stacked structure
#188Ceramic electronic component
#189High frequency component
#190Electroconductive substrate, electronic device and display device
#191Vehicle-mounted electronic module, card edge connector, and connector
#192Metal-clad laminate, metal member with resin, and wiring board
#193Conductive ball and electronic device
#194Copper foil with carrier, copper foil with resin and method for manufacturing printed wiring board
#195Electronic device having a plated antenna and/or trace, and methods of making and using the same
#196POPULATION OF METAL OXIDE NANOSHEETS, PREPARATION METHOD THEREOF, AND ELECTRICAL CONDUCTOR AND ELECTRONIC DEVICE INCLUDING THE SAME
#197BENDABLE ELECTRICAL CONDUCTOR IN A THERMOFORMED ARTICLE
#198Printed circuit board and method of fabricating the same
#199Metallic nano structure, method of fabricating the same, and electrical apparatus having the same
#200Flexible circuit board
#201Metal-clad laminate and metal foil with resin
#202Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
#203SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
#204Structure to dampen barrel resonance of unused portion of printed circuit board via
#205Transparent conductors including metal traces and methods of making same
#206Alloy bonded graphene sheets for enhanced thermal spreaders
#207Substrate for electrical circuits and method for producing a substrate of this type
#208Substrate for electrical circuits and method for producing a substrate of this type
#209Resin board structure and method for fabricating the same
#210Gold-plating etching process for 5G communication high-frequency signal boards
#211Substrate, electronic device and display device having the same
#212Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
#213Transparent conductor, method for producing same, and touch panel
#214Shield cap and method for manufacturing the same
#215Multilayer printed circuit board via hole registration and accuracy
#216Circuit board and circuit device
#217Fuses with integrated metals
#218Printed wiring board having support plate and method for manufacturing printed wiring board having support plate
#219Structure comprising an inductor and resistor
#220Conductor and method of manufacturing the same
#221Display apparatus
#222FPC-attached optical modulator and optical transmission device using the same
#223Implantable thin film devices
#224Electronic device and method for producing an electronic device
#225Circuit substrate and semiconductor device
#226FLEXIBLE SENSOR
#227PRINTED CIRCUIT BOARD
#228Printed wiring board having embedded pads and method for manufacturing the same
#229Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
#230Conductors, making method of the same, and electronic devices including the same
#231Printed circuit board and method of fabricating the same
#232Circuit board and manufacturing method thereof
#233Laminate for printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device
#234WIRED CIRCUIT BOARD
#235Laminate film and electrode substrate film, and method of manufacturing the same
#236System and method of forming electrical interconnects
#237Conductive component and electronic device including the same
#238Light source module
#239Light source module
#240Vehicular panel and wiring structure for vehicle
#241Population of metal oxide nanosheets, preparation method thereof, and electrical conductor and electronic device including the same
#242Printed circuit board, electronic component, and method for producing printed circuit board
#243Lead solder joint structure and manufacturing method thereof
#244Electrical conductors, production methods thereof, and electronic devices including the same
#245Printed circuit board and method of fabricating the same
#246Depositing bulk or micro-scale electrodes
#247Circuit board and manufacturing method thereof
#248ELECTRICAL COMPONENT AND ELECTRONIC DEVICE
#249Flexible circuit board combined with carrier board and manufacturing method thereof
#250Method for manufacturing printed circuit board with etching process to partially remove conductive layer
#251Carrier-attached copper foil, laminate, printed-wiring board and method for manufacturing the printed wiring board
#252Printed circuit board, package substrate comprising same, and method for manufacturing same
#253Special electric component, printed circuit board assembly, and method of manufacturing an electric appliance
#254CONDUCTING FILM OR ELECTRODE WITH IMPROVED OPTICAL AND ELECTRICAL PERFORMANCE
#255Circuit board and circuit board assembly
#256Circuit board
#257Resonant sensor and an associated sensing method
#258PRINTED CIRCUIT BOARD PRECURSOR
#259Wiring board and method of manufacturing same
#260Printed wiring board
#261Multilayer ceramic substrate and manufacturing thereof
#262Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
#263Manufacturing method for substrate of flat panel display device
#264Electronic component device and method for manufacturing the same
#265Solder material and bonded structure
#266Display device with flexible circuit board having graphite substrate
#267Flexible circuit board with graphite substrate and circuit arrangements using same
#268LED light arrangement with flexible circuit board having graphite substrate
#269Conductive film forming composition, conductive film, and wiring board
#270Metallization having high power compatibility and high electrical conductivity
#271Electroless surface treatment plated layers of printed circuit board and method for preparing the same
#272Liquid composition used in etching multilayer film containing copper and molybdenum, manufacturing method of substrate using said liquid composition, and substrate manufactured by said manufacturing method
#273Electronic device and method for manufacturing the same
#274FLEXIBLE CIRCUIT BOARD COMBINED WITH CARRIER BOARD AND MANUFACTURING METHOD THEREOF
#275Transparent conductive coatings for optoelectronic and electronic devices
#276Electrical barrier layers
#277Method of fabricating substrate structure and substrate structure fabricated by the same method
#278Conductive film, method for manufacturing the same and display device comprising the same
#279Thin-film multi-layer micro-wire structure
#280Multi-layer micro-wire structure
#281Method of fabricating a wiring board
#282METHOD FOR FORMING A VIA STRUCTURE USING A DOUBLE-SIDE LASER PROCESS
#283Shield film and shield printed wiring board
#284PROCESS FOR MANUFACTURING CONDUCTIVE FILM AND PRINTED WIRING BOARD
#285Wiring substrate and method of manufacturing wiring substrate
#286Printed circuit board with coextensive electrical connectors and contact pad areas
#287Conductor and method of manufacturing the same
#288Structure to dampen barrel resonance of unused portion of printed circuit board via
#289Method of fabricating connection structure for a substrate
#290LAMINATE FOIL ASSEMBLY FOR A PRINTED PRODUCT APPARATUS AND METHOD OF MANUFACTURING THE SAME
#291Printed circuit board and light emitting device
#292Heat dissipation printed circuit board and manufacturing method thereof
#293Method for producing conductive tracks
#294Solder material and bonded structure
#295High speed differential wiring in glass ceramic MCMS
#296High speed differential wiring in glass ceramic MCMS
#297Fine wiring pattern, manufacturing method thereof, and thermal print head
#298Enhanced bus bar system for aircraft transparencies
#299Electronic device and method of manufacturing electronic device
#300Multilayer wiring board with enclosed Ur-variant dual conductive layer