H05K2201/0376 - CPC Classification Index

#1

20250212337

2025-06-26

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTERING FUNCTION, AND MANUFACTURING METHOD OF SAME

#2

20250031315

2025-01-23

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE, METHOD OF FORMING PATTERN STRUCTURE, IMPRINT MOLD AND METHOD OF MANUFACTURING THE SAME, IMPRINT MOLD SET, AND METHOD OF MANUFACTURING MULTILAYER WIRING BOARD

#3

20240292526

2024-08-29

Flexible printed circuit

#4

20230309240

2023-09-28

Conductive substrate and carrier plate wiring structure with filtering function, and manufacturing method of same

#5

20230199964

2023-06-22

Circuit board with convex shaped post, light emitting device, and manufacturing method therefor

#6

20230130183

2023-04-27

Wiring substrate and semiconductor device

#7

20220377896

2022-11-24

Component carrier with a magnetic element and a manufacturing method

#8

20220046801

2022-02-10

Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board

#9

20220007494

2022-01-06

Module

#10

20210282274

2021-09-09

Multi-layer circuit board with traces thicker than a circuit board

#11

20210202425

2021-07-01

SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY

#12

20210051804

2021-02-18

Electroless and electrolytic deposition process for forming traces on a catalytic laminate

#13

20200404785

2020-12-24

Circuit board using non-catalytic laminate with catalytic adhesive overlay

#14

20200214144

2020-07-02

Multi-layer circuit board with traces thicker than a circuit board layer

#15

20200176408

2020-06-04

Semiconductor package and method for fabricating base for semiconductor package

#16

20200077521

2020-03-05

Circuit board

#17

20200037455

2020-01-30

Method for manufacturing circuit board

#18

20190393155

2019-12-26

Component carrier and method for manufacturing the same

#19

20190387631

2019-12-19

Manufacturing method of double layer circuit board

#20

20190373737

2019-12-05

Method for manufacturing circuit board

#21

20190335591

2019-10-31

Integrated circuit package substrate

#22

20190239349

2019-08-01

Catalytic circuit board with traces and vias

#23

20190206808

2019-07-04

Mounting component and electronic device

#24

20190014666

2019-01-10

Process for forming traces on a catalytic laminate

#25

20180310413

2018-10-25

Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board

#26

20180295723

2018-10-11

Manufacturing method of circuit board structure

#27

20180209046

2018-07-26

Integrated circuit substrate containing photoimageable dielectric material and method of producing thereof

#28

20180199443

2018-07-12

Producing method of wired circuit board

#29

20180196346

2018-07-12

Method of manufacturing circuit board

#30

20180168036

2018-06-14

Circuit board with catalytic adhesive

#31

20180132349

2018-05-10

Manufacturing method of double layer circuit board

#32

20180098436

2018-04-05

Integrated circuit package substrate

#33

20180053736

2018-02-22

Structure comprising an inductor and resistor

#34

20180027667

2018-01-25

Circuit carrier and a method for producing a circuit carrier

#35

20170352615

2017-12-07

Method of fabricating package structure with an embedded electronic component

#36

20170330837

2017-11-16

Component carrier and method for manufacturing the same

#37

20170311443

2017-10-26

Double layer circuit board

#38

20170290171

2017-10-05

Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs

#39

20170194241

2017-07-06

Package structure and manufacturing method of package structure

#40

20170077045

2017-03-16

Semiconductor structure

#41

20170047230

2017-02-16

Fabrication method of packaging substrate

#42

20170032978

2017-02-02

Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device

#43

20170009976

2017-01-12

Light source module, fabrication method therefor, and lighting device including the same

#44

20170009975

2017-01-12

Light source module, fabrication method therefor, and lighting device including the same

#45

20160358877

2016-12-08

Semiconductor package using flip-chip technology

#46

20160353575

2016-12-01

Package structure

#47

20160353570

2016-12-01

Resin composition for packaging and printed circuit board using the same

#48

20160353568

2016-12-01

Package substrate and method of manufacturing the same

#49

20160307861

2016-10-20

Semiconductor package and method for fabricating base for semiconductor package

#50

20160295684

2016-10-06

Printed circuit board and method of fabricating the same

#51

20160234935

2016-08-11

Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board

#52

20160233152

2016-08-11

Package structure

#53

20160198571

2016-07-07

Transparent electrode and manufacturing method thereof

#54

20160174374

2016-06-16

Vertical trench routing in a substrate

#55

20160157342

2016-06-02

Circuit board comprising an insulating diamond material

#56

20160157340

2016-06-02

Circuit board structure with embedded fine-pitch wires and fabrication method thereof

#57

20160155716

2016-06-02

Package substrate, semiconductor package and method of manufacturing the same

#58

20160079151

2016-03-17

Package structure with an embedded electronic component and method of fabricating the package structure

#59

20160044792

2016-02-11

Method of manufacturing a wiring substrate

#60

20160044782

2016-02-11

Multilayer wiring substrate, manufacturing method therefor, and substrate for probe card

#61

20160043027

2016-02-11

Printed wiring board and method for manufacturing the same

#62

20150373849

2015-12-24

Package substrate structure

#63

20150334834

2015-11-19

Wiring board, wiring board with lead, and electronic device

#64

20150334826

2015-11-19

Method for forming traces of a printed circuit board

#65

20150334825

2015-11-19

Methods for forming embedded traces

#66

20150327355

2015-11-12

Angle-adjustable and/or angled printed circuit board structure having at least two printed circuit board sections and method for producing the same

#67

20150313008

2015-10-29

Multi-layer micro-wire structure

#68

20150282314

2015-10-01

Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive post

#69

20150268770

2015-09-24

Multi-layer micro-wire structure

#70

20150245478

2015-08-27

Wiring substrate and method of manufacturing wiring substrate

#71

20150195917

2015-07-09

Core substrate and method for fabricating circuit board

#72

20150163908

2015-06-11

Circuit board and manufacturing method thereof

#73

20150092358

2015-04-02

Package carrier

#74

20150068787

2015-03-12

Method for making conductive pattern and conductive pattern

#75

20150068032

2015-03-12

Multi-layer micro-wire substrate method

#76

20150060920

2015-03-05

Wiring substrate and light emitting device

#77

20150053469

2015-02-26

Printed circuit board and method of manufacturing the same

#78

20150034366

2015-02-05

Circuit board

#79

20140370705

2014-12-18

Achieving greater planarity between upper surfaces of a layer and a conductive structure residing therein

#80

20140360761

2014-12-11

Printed circuit board and method of manufacturing the same

#81

20140353011

2014-12-04

Flexible circuit connecting device

#82

20140352135

2014-12-04

Method of making a circuit board structure with embedded fine-pitch wires

#83

20140345913

2014-11-27

Method and device of manufacturing printed circuit board having a solid component

#84

20140338192

2014-11-20

Method for manufacturing a metal printed circuit board

#85

20140332255

2014-11-13

Printed circuit board and method of manufacturing the same

#86

20140321087

2014-10-30

Integrated circuit package substrate

#87

20140318829

2014-10-30

Printed wiring boards having thermal management features and thermal management apparatuses comprising the same

#88

20140290991

2014-10-02

Gold finger and touch screen

#89

20140218909

2014-08-07

Light source module and lighting device having the same

#90

20140209358

2014-07-31

Micro-wire electrode buss

#91

20140191396

2014-07-10

Semiconductor package and method for fabricating base for semiconductor package

#92

20140183751

2014-07-03

Three-dimensional structure in which wiring is provided on its surface

#93

20140182913

2014-07-03

Packaging substrate and method of fabricating the same

#94

20140182887

2014-07-03

Three-dimensional structure for wiring formation

#95

20140174810

2014-06-26

Printed circuit board and method of manufacturing the same

#96

20140151867

2014-06-05

Semiconductor package and method for fabricating base for semiconductor package

#97

20140124254

2014-05-08

NON-SOLDER MASK DEFINED COPPER PAD AND EMBEDDED COPPER PAD TO REDUCE PACKAGING SYSTEM HEIGHT

#98

20140097004

2014-04-10

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

#99

20140090876

2014-04-03

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

#100

20140076844

2014-03-20

Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs

#101

20140076610

2014-03-20

Method of manufacturing a planarizing printed electronic device

#102

20140054077

2014-02-27

Electrical component resin, semiconductor device, and substrate

#103

20140034364

2014-02-06

Methods of manufacturing metal wiring buried flexible substrate by using plasma and flexible substrates manufactured by the same

#104

20140014401

2014-01-16

CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME

#105

20140000943

2014-01-02

Methods of manufacturing metal wiring buried flexible substrate and flexible substrates manufactured by the same

#106

20130341076

2013-12-26

Package substrate and die spacer layers having a ceramic backbone

#107

20130255858

2013-10-03

METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD

#108

20130235543

2013-09-12

Wiring board and semiconductor device

#109

20130187182

2013-07-25

Wiring substrate, light emitting device, and manufacturing method of wiring substrate

#110

20130128472

2013-05-23

Printed circuit board and manufacturing method thereof

#111

20130126224

2013-05-23

Printed circuit board and method of manufacturing the same

#112

20130126215

2013-05-23

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

#113

20130112463

2013-05-09

Printed circuit board and manufacturing method thereof

#114

20130075145

2013-03-28

Wiring substrate and method of manufacturing the same

#115

20130043063

2013-02-21

Method of producing printed circuit board, and printed board produced by the method

#116

20130025926

2013-01-31

CIRCUIT SUBSTRATE

#117

20130011576

2013-01-10

Method of manufacturing an embedded wiring board

#118

20130009729

2013-01-10

Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layer

#119

20130008025

2013-01-10

Method of manufacturing a printed circuit board having micro strip line

#120

20120317805

2012-12-20

Method for producing a printed circuit board

#121

20120308718

2012-12-06

Fabricating method for multilayer printed circuit board

#122

20120281375

2012-11-08

Circuit board having semiconductor chip embedded therein

#123

20120267157

2012-10-25

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

#124

20120267155

2012-10-25

CIRCUIT SUBSTRATE

#125

20120256320

2012-10-11

WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD

#126

20120255769

2012-10-11

PRINTED CIRCUIT BOARD

#127

20120222299

2012-09-06

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

#128

20120216946

2012-08-30

METHOD OF MANUFACTURING WIRING SUBSTRATE

#129

20120181690

2012-07-19

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

#130

20120175162

2012-07-12

PRINTED CIRCUIT BOARD

#131

20120168316

2012-07-05

Fabricating process of embedded circuit structure

#132

20120152601

2012-06-21

Package substrate and die spacer layers having a ceramic backbone

#133

20120152595

2012-06-21

Multilayer printed circuit board and method of manufacturing the same

#134

20120124830

2012-05-24

PROCESS FOR FABRICATING CIRCUIT BOARD

#135

20120111609

2012-05-10

Printed circuit board having plating pattern buried in via

#136

20120102734

2012-05-03

Methods for forming circuit pattern forming region in an insulating substrate

#137

20120097429

2012-04-26

Package substrate and fabrication method thereof

#138

20120092816

2012-04-19

Electronic device having a hidden input key and method of manufacturing an electronic device

#139

20120067630

2012-03-22

Circuit structure of circuit board

#140

20120017428

2012-01-26

Method for fabricating a semiconductor test probe card space transformer

#141

20120005886

2012-01-12

Method of manufacturing printed circuit board having buried solder bump

#142

20110303636

2011-12-15

Method of manufacturing mounting substrate

#143

20110297424

2011-12-08

WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND METHODS OF PRODUCTION OF THE SAME

#144

20110286189

2011-11-24

Method of fabricating wiring board and method of fabricating semiconductor device

#145

20110281138

2011-11-17

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

#146

20110253422

2011-10-20

Method for manufacturing a wiring board

#147

20110155440

2011-06-30

Process for manufacturing a circuit board

#148

20110139502

2011-06-16

Wiring board manufacturing method, semiconductor device manufacturing method and wiring board

#149

20110139494

2011-06-16

Embedded wiring board and method for manufacturing the same

#150

20110121452

2011-05-26

Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers

#151

20110120756

2011-05-26

CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUIT BOARD

#152

20110116248

2011-05-19

Circuit board, its manufacturing method, and joint box using circuit board

#153

20110108315

2011-05-12

Process for fabricating circuit substrate

#154

20110108313

2011-05-12

Fabricating process of circuit substrate

#155

20110061231

2011-03-17

Method of manufacturing printed circuit board

#156

20110024176

2011-02-03

Printed circuit board and method of fabricating the same

#157

20110003472

2011-01-06

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

#158

20110003086

2011-01-06

Method for fabricating blackened conductive patterns

#159

20100295191

2010-11-25

Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device

#160

20100243149

2010-09-30

Method for forming a circuit pattern

#161

20100227423

2010-09-09

LED backlight unit without printed circuit board and method of manufacturing the same

#162

20100200154

2010-08-12

FABRICATING PROCESS OF CIRCUIT BOARD WITH EMBEDDED PASSIVE COMPONENT

#163

20100175915

2010-07-15

Printed circuit board and method of manufacturing the same

#164

20100140100

2010-06-10

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

#165

20100139960

2010-06-10

Method of manufacturing a printed circuit board

#166

20100132876

2010-06-03

Manufacturing method of printed circuit board

#167

20100126009

2010-05-27

Method of enabling selective area plating on a substrate

#168

20100116536

2010-05-13

Printed circuit board having a buried solder bump and a circuit layer flush with an insulating layer

#169

20100059866

2010-03-11

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

#170

20100059256

2010-03-11

Method of making a circuit structure of a circuit board

#171

20100052993

2010-03-04

Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layer

#172

20100051322

2010-03-04

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD

#173

20100044845

2010-02-25

CIRCUIT SUBSTRATE, AN ELECTRONIC DEVICE ARRANGEMENT AND A MANUFACTURING PROCESS FOR THE CIRCUIT SUBSTRATE

#174

20100044082

2010-02-25

WIRING BOARD

#175

20100021637

2010-01-28

Process for depositing sensors on a porous support

#176

20100021627

2010-01-28

Manufacturing method for a printed wiring board

#177

20100018762

2010-01-28

BUILDUP PRINTED CIRCUIT BOARD

#178

20100018633

2010-01-28

Method of manufacturing printed circuit board

#179

20100006334

2010-01-14

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

#180

20100002406

2010-01-07

CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN

#181

20090308640

2009-12-17

Wafer level package and method of manufacturing the same

#182

20090288861

2009-11-26

CIRCUIT BOARD WITH BURIED CONDUCTIVE TRACE FORMED THEREON AND METHOD FOR MANUFACTURING THE SAME

#183

20090250260

2009-10-08

High density circuit board and manufacturing method thereof

#184

20090242247

2009-10-01

Method for fabricating package substrate and die spacer layers having a ceramic backbone

#185

20090223043

2009-09-10

Method for fabricating a semiconductor test probe card space transformer

#186

20090205862

2009-08-20

Method of manufacturing a printed circuit board

#187

20090205852

2009-08-20

Circuit board and manufacturing method thereof

#188

20090178828

2009-07-16

Heat dissipating wiring board and method for manufacturing same

#189

20090166059

2009-07-02

CIRCUIT BOARD AND PROCESS THEREOF

#190

20090145630

2009-06-11

Printed wiring board and method for manufacturing printed wiring board

#191

20090144972

2009-06-11

CIRCUIT BOARD AND PROCESS FOR FABRICATING THE SAME

#192

20090120660

2009-05-14

Electrical member and method of manufacturing a printed circuit board using the same

#193

20090106977

2009-04-30

Manufacturing method of printed circuit board

#194

20090101510

2009-04-23

Method of manufacturing high density printed circuit board

#195

20090071704

2009-03-19

Circuit board and method for fabricating the same

#196

20090065246

2009-03-12

Circuit board structure and method for manufacturing the same

#197

20090033443

2009-02-05

Circuit board defined by transmission line patterns disposed within trenches and covered by a conformal layer

#198

20090014411

2009-01-15

Fabricating method for multilayer printed circuit board

#199

20090008145

2009-01-08

Embedded circuit structure and fabricating process of the same

#200

20090008143

2009-01-08

Board having buried patterns and manufacturing method thereof

#201

20080315431

2008-12-25

Mounting substrate and manufacturing method thereof

#202

20080314865

2008-12-25

Method for providing hermetic electrical feedthrough

#203

20080314633

2008-12-25

Printed circuit board

#204

20080314502

2008-12-25

METHOD FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH

#205

20080296055

2008-12-04

Method of fabricating a printed circuit board

#206

20080289863

2008-11-27

Surface finish structure of multi-layer substrate and manufacturing method thereof

#207

20080264677

2008-10-30

Circuit board structure having embedded capacitor and fabrication method thereof

#208

20080261158

2008-10-23

Method of manufacturing printed circuit board

#209

20080258300

2008-10-23

Wiring board manufacturing method, semiconductor device manufacturing method and wiring board

#210

20080258283

2008-10-23

Wiring board and semiconductor package using the same

#211

20080257596

2008-10-23

Wiring board manufacturing method

#212

20080257480

2008-10-23

Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the same

#213

20080251494

2008-10-16

Method for manufacturing circuit board

#214

20080251279

2008-10-16

Method for manufacturing a wiring board

#215

20080210458

2008-09-04

Flexible substrate, multilayer flexible substrate

#216

20080185172

2008-08-07

Printed wiring board and method of manufacturing the same

#217

20080169568

2008-07-17

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#218

20080105972

2008-05-08

Method for making a circuit plate

#219

20080053688

2008-03-06

Printed circuit board and method of manufacturing the same

#220

20080052906

2008-03-06

Method of manufacturing a component-embedded printed circuit board

#221

20080052905

2008-03-06

Fabricating method for printed circuit board

#222

20080029894

2008-02-07

Flip-chip package substrate and a method for fabricating the same

#223

20080029890

2008-02-07

EMBEDDED CHIP PACKAGE PROCESS AND CIRCUIT BOARD WITH EMBEDDED CHIP

#224

20070281390

2007-12-06

Manufacturing method of a package substrate

#225

20070227763

2007-10-04

Coreless thin substrate with embedded circuits in dielectric layers and method for manufacturing the same

#226

20070221942

2007-09-27

LED backlight unit without printed circuit board and method of manufacturing the same

#227

20070218257

2007-09-20

Circuit board, its manufacturing method, and joint box using circuit board

#228

20070194456

2007-08-23

Flexible circuit substrate for flip-chip-on-flex applications

#229

20070171621

2007-07-26

Circuit board with embedded passive component and fabricating process thereof

#230

20070158854

2007-07-12

Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates

#231

20070151756

2007-07-05

Flexible substrate having interlaminar junctions, and process for producing the same

#232

20070137141

2007-06-21

Integration of functional layers in or on transparent plastic parts for vehicle manufacture

#233

20070126108

2007-06-07

EXTERNAL CONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING THE SAME

#234

20070114203

2007-05-24

High density printed circuit board and method of manufacturing the same

#235

20070094873

2007-05-03

SYSTEM FOR MAKING A CONDUCTIVE CIRCUIT ON A SUBSTANTIALLY NON-CONDUCTIVE SUBSTRATE

#236

20060286485

2006-12-21

Substrate structure and the fabrication method thereof

#237

20060270211

2006-11-30

Method of fabricating wiring board and method of fabricating semiconductor device

#238

20060221586

2006-10-05

Packaging substrate having adhesive-overflowing prevention structure

#239

20060191715

2006-08-31

Multilayer circuit board and manufacturing method thereof

#240

20060057341

2006-03-16

Multilayer substrate and manufacturing method thereof

#241

20060055021

2006-03-16

Wiring board, method of manufacturing the same, and semiconductor device

#242

20060014403

2006-01-19

Connecting structure of circuit board and method for manufacturing the same

#243

20060012048

2006-01-19

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

#244

20060000635

2006-01-05

Method for making a circuit plate

#245

20050255312

2005-11-17

Conductive material and manufacturing method thereof

#246

20050252682

2005-11-17

Wiring board and semiconductor package using the same

#247

20050230486

2005-10-20

Method for manufacturing radiofrequency identification device using transfer paper and radiofrequency identification device produced using this method

#248

20050205294

2005-09-22

Flexible substrate, multilayer flexible substrate and process for producing the same

#249

20050205291

2005-09-22

Flexible substrate having interlaminar junctions, and process for producing the same

#250

20050140488

2005-06-30

Coil electric conductor, laminated coil conductor, production method of the same and electronic component using the same