Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairs

FLAT CABLE AND ELECTRONIC DEVICE USING THE SAME

Via stub termination structures and methods for making same

Signal tranmission line having contact portion

Method of making a printed circuit board with low cross-talk noise

SIGNAL TRANSMISSION STRUCTURE

Low impedance flexible circuit for tape head

Hard disk drive and wireless data terminal using the same

Printed circuit board with differential pair arrangement

Communication bus and electric panel comprising said bus

Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein

Embedded capacitor with interdigitated structure

Transmission line apparatus having conductive strips coupled by at least one additional capacitance element

Electro-optical device, electronic apparatus, and interface board

Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head

Flexible interconnect cable with grounded coplanar waveguide

Method of fabricating a high-layer-count backplane

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

High speed interface design

Printed circuit board and differential signaling structure

Integrated circuit chip module

Circuit substrate and method of manufacturing plated through slot thereon

Configuration connector for information handling system circuit boards

Reconfigurable interconnection device for electrical bundles

Tape distribution substrate having pattern for reducing EMI

Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boards

Differential clock ganging

Electronic component and method for manufacturing the same

Pattern forming method and pattern forming apparatus

Microstrip line dielectric overlay

Layout configuration of differential signal transmission lines for printed circuit board having offset vias

Flexible print cable having alternating signal and ground conductors and connector for the same

Configuration for multi-layer ball grid array

Matched-impedance high-bandwidth configuration jumper

CIRCUIT BOARDS AND ASSEMBLY METHODS

Crosstalk reduction in electrical interconnects using differential signaling

Printed circuit board with differential vias arrangement

Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor

Circuit board with trace configuration for high-speed digital differential signaling

Technique for accommodating electronic components on a multilayer signal routing device

Ball grid array assignment

Printed circuit board

Ball grid array configuration for reducing path distances

CIRCUIT BOARDS

Reduced cost printed circuit board

Printed circuit board for improving impedance of signal transmission lines

Method and system for an improved package substrate for use with a semiconductor package

Matched-impedance surface-mount technology footprints

High-frequency, high-signal-density, surface-mount technology footprint definitions

Wiring structure and recording apparatus and electronic apparatus including wiring structure

Orthogonal backplane connector

Capacitor with co-planar electrodes

Dispensable capacitor manufacturing process

Ball assignment system

Circuit board and display device having the same

Integrated circuit for communications modules

Method and apparatus for routing a differential pair on a printed circuit board

Routing configuration for high frequency signals in an integrated circuit package

Method of making circuitized substrate with signal wire shielding

Transmission line and wiring forming method

Differential signal connector with wafer-style construction

Labeling method and software utilizing the same, and PCB and electronic device utilizing the same

High frequency and wide band impedance matching via

Crosstalk canceling pattern for high-speed communications and modular jack having the same

Printed circuit board and electronic apparatus equipped with the same

Tile-based routing method of a multi-layer circuit board and related structure

Printed circuit boards and the like with improved signal integrity for differential signal pairs

Data processing circuit with a driver and a receiver

Multi-channel waveguide structure

Memory module circuit board layer routing

Interconnect and head gimbal assembly with the same

Virtual ground return for reduction of radiated emissions

Radiation noise suppression circuit for differential transmission line

Conductor trace design to reduce common mode cross-talk and timing skew

System and method for optimizing printed circuit boards to minimize effects of non-uniform dielectric

Printed circuit board having a bond wire shield structure for a signal transmission line

Multilayered circuit board for high-speed, differential signals

Method of producing wiring board

Circuit and method for transmitting a signal

Circuit board having signal lines adapted to transmit high speed signals

Circuit board

Electronic part having reinforcing member

Circuit layout structure and method

Method and system for memory signal transmission

Embedded multilayer printed circuit

Printed circuit board for high-speed electrical connectors

Multi-layer printed circuit with low noise

Multi-layer printed circuit with low noise

Circuit structure of package substrate

Printed wiring board, information processing apparatus, and method of manufacturing the printed wiring board

Method and system for ESD protection of balanced circuit board lines

Writing pattern structure of differential transmission paths

Multi-terminal device and printed wiring board

Two-layer PCB with impedence control and method of providing the same

Method and apparatus for rejecting common mode signals on a printed circuit board and method for making same

Routing differential signal lines in a substrate

Transmission circuit board

Printed circuit board

Midplane especially applicable to an orthogonal architecture electronic system

Signal bus arrangement

Universal energy conditioning interposer with circuit architecture

Reference layer openings

Printed wiring board with conductive constraining core including resin filled channels

Method for bus capacitance reduction

Next high frequency improvement by using frequency dependent effective capacitance

Crosstalk compensation with balancing capacitance system and method

Grouped element transmission channel link termination assemblies

Wiring base board, method of producing thereof, and electronic device

System and method for patient controlled communication of DICOM protected health information

Portable telephone

Circuit board, device mounting structure, device mounting method, and electronic apparatus

Touch panel input device

Method of creating solder bar connections on electronic packages

Microstrip lines in a multi-layered shielded configuration

Preferential via exit structures with triad configuration for printed circuit boards

Reference slots for signal traces

Preferential ground and via exit structures for printed circuit boards

Flexible substrate and electronic equipment

Maximizing capacitance per unit area while minimizing signal transmission delay in PCB

Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making

Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection

High tolerance embedded capacitors

Via structure of packages for high frequency semiconductor devices

Method for bus capacitance reduction

Microstrip line dielectric overlay

Filter circuit device and method of manufacturing the same

Method for flexible circuits

Optical sub-assembly for opto-electronic modules

Transmission line having a transforming impedance

Method for altering the delay properties of a transmission line using compensation tabs

Low reflection driver for a high speed simultaneous bidirectional data bus

Multilayered circuit board for high-speed, differential signals

Printed wiring board with wiring pattern having narrow width portion

Electromagnetically shielded slot transmission line

Structure of stacked vias in multiple layer electrode device carriers

Multilayer printed circuit board including first and second signal traces and a first ground trace

Triangular conforming transmission structure

Transmission line with a transforming impedance and solder lands

High permeability layered magnetic films to reduce noise in high speed interconnection

Multi-layer substrate structure for reducing layout area

Circuit board with trace configuration for high-speed digital differential signaling

Inductive and capacitive coupling balancing electrical connector

Compensation system and method for negative capacitive coupling in IDC

Printed circuit board with low cross-talk noise

Substrate with micro-via structures by laser technique

Techniques for joining an opto-electronic module to a semiconductor package

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Package substrate for integrated circuit and method of making the substrate

Techniques for joining an opto-electronic module to a semiconductor package

Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk

Clock circuitry on plural integrated circuits

Printed circuit board memory module with embedded passive components

Grouped element transmission channel link termination assemblies

Differential signal traces coupled with high permittivity material

Signal transmission structure having salients aligned with non-reference regions

Crosstalk reduction for a system of differential line pairs

Routing for reducing impedance distortions

Printed circuit board and interleaving routing scenario thereof

High tolerance embedded capacitors

Liquid crystal display device with link lines connecting to tape carrier package

Acoustic wave touch detecting apparatus

Circuit board design

Data bus connection for memory device

Printed wiring board having impedance-matched differential pair signal traces

Method of fabricating a high-layer-count backplane

Backplane configuration with shortest-path-relative-shift routing

Electronic device carrier adapted for transmitting high frequency signals

Transmission line parasitic element discontinuity cancellation

Shared vias for differential pair trace routing

System and method for skyrmion based logic device

Connection substrate and interposer substrate including the same

Canceling magnetic pickup using three-dimensional wiring assembly

Stripline transmission lines with cross-hatched pattern return plane, where the striplines do not overlap any intersections in the cross-hatched pattern

Network socket device with compensation means

Techniques for optimizing dual track routing