234484 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors; Conductive planes wherein only contours around conductors are removed for insulation
Method and device for a high temperature vacuum-safe solder resist utilizing laser ablation of solderable surfaces for an electronic module assembly
#2Electro-optic display backplane structure with drive components and pixel electrodes on opposed surfaces
#3Resource allocation for traffic-profile-dependent scheduling request
#4Printed wiring board
#5Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly
#6Collective lamination substrate forming pseudo waveguide
#7Light emitting device
#8Circuit substrate having a circuit pattern and method for making the same
#9Pattern safety device for preventing interference between patterns
#10Light-emitting device
#11Light emitting device
#12Motherboard with electrostatic discharge protection function
#13Light emitting device
#14Method for partially stripping a defined area of a conductive layer
#15CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING THE SAME
#16Organic light emitting diode and circuit board for control thereof
#17High frequency wiring board comprised of interconnected first and second coplanar lines on different layers and having a ground pattern physically separated therefrom
#18Printed circuit for five LEDs in series
#19Carrier Structure for Electronic Components and Fabrication Method of the same
#20Circuit board and method of manufacturing the same
#21LIGHT SOURCE UNIT AND DISPLAY DEVICE HAVING THE SAME
#22LIGHTING APPARATUS HAVING LIGHT EMITTING DIODES FOR LIGHT SOURCE
#23Backlight device and planar display device using the same
#24Electronic circuit board including surface mount device
#25LED illumination assembly with compliant foil construction
#26FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF FORMING FINE PITCH THEREIN
#27Power Converter Having Multiple Layer Heat Sinks
#28Conductor carrier and arrangement comprising a conductor carrier
#29Circuit board for direct flip chip attachment
#30Printed board
#31Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip
#32Printed wiring board
#33Large area circuitry using appliqués
#34Printed wiring board reliably achieving electric connection with electronic component
#35Printed wiring board and printed circuit board
#36Illumination assembly with enhanced thermal conductivity
#37Variable width conductive lines having substantially constant impedance
#38LED illumination assembly with compliant foil construction
#39Power converter having multiple layer heat sinks
#40Tape carrier package including a heat dissipation element
#41Test carrier for semiconductor components having conductors defined by grooves
#42Ultra-thin alphanumeric display
#43Forming a conductive pattern on a substrate
#44Balanced transmission cable connector
#45Method for fabricating semiconductor components using conductive layer and grooves
#46Substrate with patterned conductive layer