234487 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors; Pads and lands Curved pads, e.g. semi-circular or elliptical pads or lands
EXTENDED PAD AREA TO PREVENT PRINTED CIRCUIT BOARD DAMAGE
#2VERTICAL INTERCONNECTS FOR DEVICE MINIATURIZATION
#3FLEXIBLE CIRCUIT BOARD, LIGHT RECEIVING/TRANSMITTING ASSEMBLY, OPTICAL MODULE, AND CONNECTION METHOD
#4IMPLANTABLE ELECTRONIC DEVICES
#5WIRING BOARD, ELECTRONIC MODULE, AND MANUFACTURING METHOD FOR WIRING BOARD
#6Localized Soldering U&C Shape with Metal Pin Design
#7WIRING SUBSTRATE
#8LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING LAMINATED SUBSTRATE
#9SYSTEMS, METHODS, AND DEVICES FOR PRODUCING DEFORMABLE ELECTRONIC DEVICES HAVING DEFORMABLE INTERCONNECTS
#10CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
#11PRINTED WIRING BOARD WITH PLURALITY OF SOLDERING PADS ARRANGED THEREON, AND PAD
#12ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
#13CIRCUIT BOARD ASSEMBLY AND PREPARATION METHOD FOR CIRCUIT BOARD ASSEMBLY
#14WIRING BOARD AND MOUNTING STRUCTURE
#15ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE
#16SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
#17DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOARD AND CIRCUIT PACKAGE
#18PER LAYER ANTI-PAD STRUCTURE FOR BALL GRID ARRAY PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURE
#19CIRCUIT BOARD
#20CIRCUIT BOARD
#21VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD
#22PRINTED WIRING BOARD
#23IMPLANTABLE ELECTRONIC DEVICES
#24CIRCUIT BOARD DEVICE
#25DISPLAY DEVICE
#26SEMICONDUCTOR STORAGE DEVICE
#27ELECTRONIC SYSTEM
#28WIRING SUBSTRATE
#29CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#30INTERPOSER AND ELECTRONIC DEVICE COMPRISING SAME
#31FILLING CRACKS ON A SUBSTRATE VIA
#32METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
#33WIRING SUBSTRATE
#34PRINTED CIRCUIT BOARD
#35ELECTRONIC DEVICE
#36BOND PAD CONNECTOR FOR SECURING AN ELECTRONIC COMPONENT THEREON
#37WIRING CIRCUIT BOARD
#38Overlap joint flex circuit board interconnection
#39ELECTRONIC DEVICE HAVING PAD STRUCTURE
#40ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE
#41Printed circuit board for galvanic effect reduction
#42Display device and manufacturing method thereof
#43Connectors for Linear Lighting
#44PAD ARRANGING METHOD AND PAD ARRANGEMENT STRUCTURE
#45Circuit board
#46Solder stop feature for electronic devices
#47Implantable electronic devices
#48Skin care device providing micro current to a mask for promoting production of collagen and elastin
#49WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
#50Circuit board
#51Light emitting diode (LED) package and illuminating device including the same
#52Display device and manufacturing method thereof
#53Conductive bonding structure for substrates and display device including the same
#54Printed circuit board
#55Overlap joint flex circuit board mating
#56Imaging module and imaging device
#57PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
#58Printed Circuit Board and Terminal
#59Optical integration device
#60Wiring substrate and method for manufacturing wiring substrate
#61Electric component embedded structure
#62Chip interconnect devices
#63Method for manufacturing printed wiring board and printed wiring board
#64Implantable electronic devices
#65Display device
#66Wiring substrate
#67Pogo module and electronic device comprising same
#68Electrostatic detecting device
#69Multilayer substrate
#70Narrow frame display panel and display
#71Surface structure method and apparatus associated with compute or electronic component packages
#72PRINTED WIRING BOARD
#73Circuit board, display device including the same, and method of manufacturing the circuit board
#74Switch component, push switch, electronic device including push switch
#75Methods and systems for magnetic coupling
#76Semiconductor device with optical and electrical vias
#77LED lamp using ultra-small LED electrode assembly
#78Semiconductor die and package jigsaw submount
#79Ultra-small LED electrode assembly and method for manufacturing same
#80Maximizing surface area of surface mount contact pads of circuit board also having via contact pads
#81Attenuation reduction structure for high frequency signal connection pads of circuit board with insertion component
#82Illumination device
#83Wiring substrate, semiconductor package, and method for manufacturing semiconductor package
#84Substrate structure and fabrication method thereof
#85Wiring board and electronic device
#86Conductivity inspection method of printed circuit board and manufacturing method of printed circuit board
#87DOUBLE-SIDED PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
#88CONNECTING STRUCTURE OF CIRCUIT BOARD
#89Printed wiring board, semiconductor package, and printed circuit board
#90Laboratory sample instrument with printed circuit board cable device
#91CIRCUIT BOARD
#92Printed circuit board assembly chip package component and soldering component
#93Cut-edge positioning type soldering structure and method for preventing pin deviation
#94Notch positioning type soldering structure and method for preventing pin deviation
#95Mounting structure
#96Printed wiring board and method for manufacturing printed wiring board
#97Image data processing method and recording media for the same
#98WIRING PATTERN FORMING METHOD, DEVICE AND ELECTRONIC APPARATUS
#99Rounded contact fingers on substrate/PCB for crack prevention
#100Pad and printed board
#101Connector for clothing
#102Non-rectangular connection pad for improved electrical characteristics on traces
#103Driving module, restoration method and imaging device
#104Board integrated interconnect