H05K2201/09372 - CPC Classification Index

ClassID:

234485 ⎘

H05K2201/09372 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors Pads and lands

Sub-classes:

H05K2201/09381 » Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component 344
H05K2201/09381 » Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component 344
H05K2201/0939 » Curved pads, e.g. semi-circular or elliptical pads or lands 78
H05K2201/0939 » Curved pads, e.g. semi-circular or elliptical pads or lands 78
H05K2201/094 » Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads 383
H05K2201/094 » Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads 383
H05K2201/09409 » Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components 289
H05K2201/09409 » Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components 289
H05K2201/09418 » Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation 173
H05K2201/09418 » Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation 173
H05K2201/09427 » Special relation between the location or dimension of a pad or land and the location or dimension of a terminal 132
H05K2201/09427 » Special relation between the location or dimension of a pad or land and the location or dimension of a terminal 132
H05K2201/09436 » Pads or lands on permanent coating which covers the other conductors 157
H05K2201/09436 » Pads or lands on permanent coating which covers the other conductors 157
H05K2201/09445 » Pads for connections not located at the edge of the PCB, e.g. for flexible circuits 128
H05K2201/09445 » Pads for connections not located at the edge of the PCB, e.g. for flexible circuits 128
H05K2201/09454 » Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB 107
H05K2201/09454 » Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB 107
H05K2201/09463 » Partial lands, i.e. lands or conductive rings not completely surrounding the hole 26
H05K2201/09463 » Partial lands, i.e. lands or conductive rings not completely surrounding the hole 26
H05K2201/09472 » Recessed pad for surface mounting ; Recessed electrode of component 330
H05K2201/09472 » Recessed pad for surface mounting ; Recessed electrode of component 330
H05K2201/09481 » Via in pad; Pad over filled via 400
H05K2201/09481 » Via in pad; Pad over filled via 400
H05K2201/0949 » Pad close to a hole, not surrounding the hole 134
H05K2201/0949 » Pad close to a hole, not surrounding the hole 134

Recent Application in this class:

20260113842

2026-04-23

PRINTED CIRCUIT BOARD

20260040959

2026-02-05

CHIP ON LEAD DEVICE AND MANUFACTURING METHOD

20250183186

2025-06-05

SEMICONDUCTOR PACKAGE

20250008650

2025-01-02

CONTACT HEIGHT ADJUSTMENT STRUCTURE OF FLEXIBLE CIRCUIT BOARD

20240196538

2024-06-13

ELECTRONIC DEVICE

20240098912

2024-03-21

CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

20240028134

2024-01-25

LIGHT EMITTING DEVICE AND KEYBOARD STRUCTURE

20240006295

2024-01-04

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

20230380068

2023-11-23

Electronic Control Device

#10

20230300987

2023-09-21

Wiring board

#11

20230247788

2023-08-03

Circuit structure

#12

20230120513

2023-04-20

FOLDABLE COMPRESSION ATTACHED MEMORY MODULE (FCAMM)

#13

20230119959

2023-04-20

Electronic device and manufacturing method thereof

#14

20230070808

2023-03-09

Heat Sink Component With Land Grid Array Connections

#15

20230032026

2023-02-02

Multilayer printed circuit board

#16

20220407489

2022-12-22

High frequency filter

#17

20220369475

2022-11-17

Method for manufacturing a circuit board

#18

20220039262

2022-02-03

Flexible printed wiring board, joined body, pressure sensor and mass flow controller

#19

20210325685

2021-10-21

Optical integration device

#20

20210242284

2021-08-05

Display device and fabricating method thereof

#21

20200344881

2020-10-29

BOARD JOINT STRUCTURE AND BOARD JOINT METHOD

#22

20200271979

2020-08-27

Display device

#23

20200196452

2020-06-18

Flexible printed circuit board and flexible display module and electronic device comprising the same

#24

20200025997

2020-01-23

Flexible circuit board, light bar, light source and display device

#25

20190246496

2019-08-08

Printed wiring board and method for manufacturing printed wiring board

#26

20190207327

2019-07-04

Circuit board and card

#27

20180366852

2018-12-20

CONNECTING CABLE ASSEMBLY, ELECTRICAL CONNECTOR ASSEMBLY AND PADDLE CARD THEREOF

#28

20180242462

2018-08-23

Printed circuit board and electronic device

#29

20180139852

2018-05-17

Printed circuit board and methods to enhance reliability

#30

20180077789

2018-03-15

Printed-circuit board, printed-wiring board, and electronic apparatus

#31

20170318679

2017-11-02

Control circuit board and robot control device

#32

20170318669

2017-11-02

ELECTRONIC PACKAGE AND METHOD FORMING AN ELECTRICAL PACKAGE

#33

20170165474

2017-06-15

Closely spaced array of penetrating electrodes

#34

20170094771

2017-03-30

Printed circuit board and electronic apparatus

#35

20170064821

2017-03-02

ELECTRONIC PACKAGE AND METHOD FORMING AN ELECTRICAL PACKAGE

#36

20160324002

2016-11-03

Printed circuit board, circuit and method for producing a circuit

#37

20160316562

2016-10-27

Breakout via system

#38

20160062512

2016-03-03

Method of manufacturing electrode substrate, electrode substrate, display apparatus and input device

#39

20160014898

2016-01-14

PRINTED WIRING BOARD

#40

20150313005

2015-10-29

PRINTED CIRCUIT BOARD

#41

20150305153

2015-10-22

Wiring substrate and method for manufacturing wiring substrate

#42

20150102835

2015-04-16

Substrate plate for MEMS devices

#43

20150034375

2015-02-05

CIRCUIT BOARD ASSEMBLY WITH PADS AND CONNECTION LINES HAVING SAME RESISTANCE VALUE AS THE PADS AND IMPEDANCE MATCHING METHOD

#44

20140326495

2014-11-06

HIGH PERFORMANCE PRINTED CIRCUIT BOARD

#45

20140313682

2014-10-23

COMPOSITE ELECTRONIC COMPONENT

#46

20130269983

2013-10-17

Impedance matching method

#47

16582816

2020-11-17

Trace modulations in connectors for integrated-circuit packages