234490 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors; Pads and lands Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
#2DISPLAY DEVICE AND FILM PACKAGE
#3ELECTRONIC SUBSTRATE UNIT AND BATTERY MONITORING SYSTEM
#4DISPLAY APPARATUS
#5METHODS AND SYSTEMS FOR CONFIGURING CONDUCTIVE PATHS IN A PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) FOR ENHANCED POWER DISTRIBUTION
#6PRINTED WIRING BOARD WITH PLURALITY OF SOLDERING PADS ARRANGED THEREON, AND PAD
#7METHODS AND SYSTEMS FOR CONFIGURING CONDUCTIVE PATHS IN A PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) FOR ENHANCED POWER DISTRIBUTION
#8ELECTRONIC DEVICE
#9ELECTRONIC DEVICE
#10DISPLAY PANEL, DISPLAY DEVICE, AND DRIVER CHIP
#11MICROELECTRONIC DEVICE PACKAGE ASSEMBLIES INCLUDING STIFFENER DEVICES, AND RELATED MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS
#12ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
#13ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME
#14PART COMPRISING ON ITS SURFACE A FILM INCORPORATING AT LEAST ONE PRINTED ELECTRONIC CIRCUIT PROVIDED WITH CONNECTION TERMINALS, METHOD FOR REPAIRING SUCH A PART AND PART THUS REPAIRED
#15DISPLAY DEVICE
#16ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE
#17Electronic component, electric device including the same, and bonding method thereof
#18PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
#19PAD ARRANGING METHOD AND PAD ARRANGEMENT STRUCTURE
#20Electronic device
#21Display device
#22Mounting structure of electronic component
#23Semiconductor device and memory system
#24ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
#25Chip packaging structure and display device
#26TRANSPARENT PACKAGE FOR USE WITH PRINTED CIRCUIT BOARDS
#27WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
#28Bonding pad structure for electronic device and manufacturing method thereof
#29Array substrate and method of mounting integrated circuit using the same
#30Printed Circuit Board and Terminal
#31DISPLAY DEVICE
#32Electronic device and electromagnetic shielding frame
#33Display device and film package
#34Processing method and processing system of a flexible substrate
#35Surface mount device placement to control a signal path in a printed circuit board
#36Display panel and display device including the same having pads with inclinations with respect to reference lines
#37Film package and method of fabricating package module
#38Substrate, electronic device, and bonding method
#39Display panel, flexible circuit board and display device
#40Arrangement for lowering resistance on power delievery region of electrical connector
#41Flexible assembly for display device and display device
#42Wiring substrate
#43Flexible circuit board, light bar, light source and display device
#44Display panel and display device including the same
#45Array substrate and method of mounting integrated circuit using the same
#46Electronic component, electric device including the same, and bonding method thereof
#47Electrical connector element
#48CIRCUIT BOARD AND DETECTING DEVICE
#49Medical circuit board and medical device
#50Semiconductor package with terminal pattern for increased channel density
#51On-vehicle electronic circuit mounting board
#52Wiring board, electronic apparatus, and method for manufacturing electronic apparatus
#53Printed circuit board
#54Electronic component, electric device including the same, and bonding method thereof
#55Multi-layer circuit member with reference planes and ground layer surrounding and separating conductive signal pads
#56Structure for flexible printed circuit boards
#57Printed circuit board and method for producing a printed circuit board
#58Array substrate and method of mounting integrated circuit using the same
#59Flexible film, circuit board assembly including the same and display apparatus including the same
#60Electrical contact pad for electrically contacting a connector
#61Wiring board manufacturing method
#62Semiconductor package, printed circuit board substrate and semiconductor device
#63Flexible printer circuit board
#64Sensor device and sensor arrangement
#65PRINTED CIRCUIT BOARD
#66LED module and light fixture with the same
#67Laminated electronic component and laminated electronic component mounting structure
#68Method of enhancing fatigue life of grid arrays
#69Semiconductor package, printed circuit board substrate and semiconductor device
#70Display device
#71Display device
#72Camera for vehicle vision system
#73Printed circuit board, ball grid array package and wiring method of printed circuit board
#74Structure for flexible printed circuit boards
#75Printed wiring board, semiconductor device and printed circuit board
#76Printed circuit board
#77MODULE
#78Curved display device
#79Printed circuit board and semiconductor package using the same
#80Wiring board, and electronic device
#81Array substrate and method of mounting integrated circuit using the same
#82Sensor device and sensor arrangement
#83Semiconductor package, printed circuit board substrate and semiconductor device
#84CIRCUIT BOARD, IMAGE SENSOR UNIT, IMAGE READING APPARATUS, AND IMAGE FORMING APPARATUS
#85WIRING BOARD
#86Illumination device
#87Paddle card with improved performance
#88Electrode of self-capacitive touch panel utilizing serpentine trace to increase resistance
#89Wiring substrate, semiconductor package, and method for manufacturing semiconductor package
#90Display apparatus
#91WIRING BOARD AND METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT ON WIRING BOARD
#92Printed wiring board and method for manufacturing printed wiring board
#93Electronic component, electric device including the same, and bonding method thereof
#94Submount, assembly including submount, method of assembling and assembling device
#95Chip package and method for forming the same
#96Display panel, electronic device including the same, and bonding method thereof
#97Interconnect arrangement for hexagonal attachment configurations
#98PCB pad for imager of vehicle vision system
#99Printed circuit board
#100Shaped and oriented solder joints
#101Grid arrays with enhanced fatigue life
#102Printed wiring board, semiconductor package, and printed circuit board
#103Ball grid structure
#104Semiconductor device
#105Semiconductor device
#106METHOD OF PREVENTING EMI FOR A FASTENING HOLE IN A CIRCUIT BOARD AND A FIXTURE THEREFOR
#107Mounting structure of chip type electric element and electric apparatus having chip type electric element on flexible board
#108Driver element and display device
#109Package substrate having main dummy pattern located in path of stress
#110THERMAL FLEX CONTACT CARRIERS #2
#111Chip package and method for forming the same
#112Method of manufacturing an electronic component
#113BGA footprint pattern for increasing number of routing channels per PCB layer
#114PLASMA DISPLAY DEVICE
#115Method for Mounting Flip Chip and Substrate Used Therein
#116Dynamic pad size to reduce solder fatigue
#117Electronic device
#118Semiconductor module
#119SPACE TRANSFORMER CONNECTOR PRINTED CIRCUIT BOARD ASSEMBLY
#120Printed circuit board and printed circuit board unit
#121Method and apparatus for printed circuit board with stiffener
#122Switching circuit layout with heatsink
#123LAYOUT STRUCTURE AND METHOD FOR REDUCING AUDIBLE NOISE GENERATED BY FLEXIBLE PRINTED CIRCUIT
#124Printed circuit board and electronic device
#125Apparatus for reducing capacitor generated noise on a printed circuit board
#126FLEXIBLE PRINTED CIRCUITBOARD WITH ANTI-SOLDER CRACK STRUCTURE
#127Electronic carrier board
#128Wiring board having efficiently arranged pads
#129Assembly structure
#130ELECTRONIC ELEMENT MODULE AND ELECTRONIC DEVICE USING THE SAME
#131SOLDER BUMP, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT
#132OC2 oriented connections 2
#133SUBSTRATE FOR MOUNTING SEMICONDUCTOR DEVICE
#134SEMICONDUCTOR SYSTEM HAVING BGA PACKAGE WITH RADIALLY BALL-DEPOPULATED SUBSTRATE ZONES AND BOARD WITH RADIAL VIA ZONES
#135Electrical connector system with orthogonal contact tails
#136CIRCUIT BOARD
#137LED luminous module with crossover connecting element
#138TFCC (TM) and SWCC (TM) thermal flex contact carriers
#139OPTICAL SCANNING UNIT AND ELECTRO-PHOTOGRAPHIC IMAGE FORMING APPARATUS INCLUDING THE SAME
#140Element mounting structure and element mounting method
#141Chip component mounting structure, chip component mounting method, and electronic device
#142SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
#143Liquid crystal display module
#144Dynamic pad size to reduce solder fatigue
#145Semiconductor memory modules, methods of arranging terminals therein, and methods of using thereof
#146Motherboard configured to minimize or prevent damage to a chip thereon
#147Lamp assembly adapted to illuminate a backlit sign
#148Method and System for Self-Aligning Parts in Mems
#149Interconnections resistant to wicking
#150Wiring board, mount structure, and method for manufacturing the same
#151Semiconductor memory module having an oblique memory chip
#152ELECTROOPTIC DEVICE, WIRING BOARD, METHOD FOR MANUFACTURING ELECTROOPTIC DEVICE, AND ELECTRONIC DEVICE
#153CONNECTION PAD LAYOUTS
#154Interconnection pattern design
#155Method and apparatus for reducing electrical interconnection fatigue
#156Memory module with an electronic printed circuit board and a plurality of semiconductor chips of the same type
#157High frequency device mounting substrate and communications apparatus
#158Integrated circuit die configuration for packaging
#159Semiconductor device and a manufacturing method of the same
#160Electronic element module and electronic device using the same
#161Optical module and optical transmitter/receiver device
#162Integrated circuit for communications modules
#163Method and apparatus for configurable printed circuit board circuit layout pattern
#164Circuit board for mounting a semiconductor circuit with a surface mount package
#165Radial circuit board, system, and methods
#166Method of mounting memory device on PCB for memory module
#167Off-width pitch for improved circuit card routing
#168Integrated circuit die configuration for packaging
#169Printed wiring board and information processing device incorporating the board
#170Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
#171Semiconductor device
#172Board having alternating rows of processors and memories
#173CARRIER, CHIP PACKAGE STRUCTURE, AND CIRCUIT BOARD PACKAGE STRUCTURE
#174Printed circuit board and electronic apparatus using the same
#175Multilayered circuit board for high-speed, differential signals
#176Component and circuit module
#177Connection pad layouts
#178Liquid crystal display device with link lines connecting to tape carrier package
#179Interconnections
#180Liquid crystal display having different shaped terminals configured to become substantially aligned
#181Capacitor mounting structure, capacitor-mounted board, and wiring board for use in capacitor mounting
#182Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#183Thermal dissipation and shielding improvement using merged PCB bottom copper post
#184Non-rectangular connection pad for improved electrical characteristics on traces
#185Driving module, restoration method and imaging device
#186Landing pattern for ball grid array
#187Apparatuses and methods for improved network connections
#188PCB with two rows of solder pads including both SMT-based and DIP-based structures
#189Methods of attaching components on fabrics using metal braids