ClassID:

234495

H05K2201/09463 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors; Pads and lands Partial lands, i.e. lands or conductive rings not completely surrounding the hole

Recent Application in this class:
#1
20260072392
2026-03-12

PRINTED BOARD, IMAGE FORMING APPARATUS, AND MOUNTING METHOD

#2
20190269016
2019-08-29

Multilayer LED substrate

#3
20190150291
2019-05-16

Zero-misalignment via-pad structures

#4
20190148300
2019-05-16

Circuit substrate

#5
20180302978
2018-10-18

Power signal transmission structure and design method thereof

#6
20180184514
2018-06-28

Printed circuit board and electric device

#7
20170280568
2017-09-28

Zero-misalignment via-pad structures

#8
20160183370
2016-06-23

Zero-misalignment via-pad structures

#9
20140345918
2014-11-27

Connection board, optoelectronic component arrangement and illumination device

#10
20130279134
2013-10-24

Printed wiring board, semiconductor package, and printed circuit board

#11
20120090878
2012-04-19

Substrate for suspension

#12
20110141707
2011-06-16

Electronic apparatus and printed wiring board

#13
20110095851
2011-04-28

High impedance electrical connection via

#14
20100290203
2010-11-18

Printed circuit board equipped with piezoelectric element

#15
20100061067
2010-03-11

ELECTRONIC APPARATUS AND PRINTED WIRING BOARD

#16
20100059264
2010-03-11

Electronic apparatus and printed wiring board

#17
20090124099
2009-05-14

PCB with improved soldering holes and a battery set with the same

#18
20080310133
2008-12-18

Printed wiring board

#19
20080284535
2008-11-20

Two-level mounting board and crystal oscillator using the same

#20
20080266826
2008-10-30

ASSEMBLABLE SUBSTRATE FOR IN-LINE PACKAGE AND ASSEMBLY WITH SAME

#21
20080247131
2008-10-09

Substrate for suspension

#22
20070249224
2007-10-25

Fixing structure of circuit board and display module comprising the same

#23
20070159545
2007-07-12

Managed memory component

#24
20070158821
2007-07-12

Managed memory component

#25
20070108619
2007-05-17

Bonding pad with high bonding strength to solder ball and bump

#26
20060255147
2006-11-16

Long range optical reader

#27
20050072596
2005-04-07

Printed circuit board for avoiding producing cutting burrs