Patents-Review.com
ClassID:

234503 ⎘

H05K2201/09536 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors; Conductive through-holes or vias Buried plated through-holes, i.e. plated through-holes formed in a core before lamination

Recent Application in this class:
#1
20260156756
2026-06-04

METHOD FOR MANUFACTURING WIRING SUBSTRATE

 #2
20260156738
2026-06-04

WIRING SUBSTRATE

 #3
20260113845
2026-04-23

PRINTED CIRCUIT BOARD

 #4
20260032818
2026-01-29

RESIN MULTILAYER SUBSTRATE AND CIRCUIT MODULE

 #5
20260006721
2026-01-01

Three-Dimensional (3D) Copper in Printed Circuit Boards

 #6
20250393127
2025-12-25

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #7
20250380354
2025-12-11

DUAL DIFFERENTIAL VIA DESIGN ON A PRINTED CIRCUIT BOARD

 #8
20250287502
2025-09-11

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

 #9
20250227842
2025-07-10

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUCING GLASS SUBSTRATE

 #10
20250227841
2025-07-10

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUCING GLASS SUBSTRATE

 #11
20250203776
2025-06-19

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #12
20250133655
2025-04-24

CIRCUIT BOARD STRUCTURE

 #13
20250071899
2025-02-27

PRINTED WIRING BOARD AND COIL DEVICE

 #14
20250048562
2025-02-06

WIRING SUBSTRATE

 #15
20250016917
2025-01-09

PRINTED CIRCUIT BOARD

 #16
20240389230
2024-11-21

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

 #17
20240365468
2024-10-31

WIRING SUBSTRATE

 #18
20240324103
2024-09-26

WIRING SUBSTRATE

 #19
20240306299
2024-09-12

WIRING SUBSTRATE

 #20
20240306297
2024-09-12

Three-Dimensional (3D) Copper in Printed Circuit Boards

 #21
20240306296
2024-09-12

WIRING SUBSTRATE

 #22
20240224426
2024-07-04

WIRING SUBSTRATE

 #23
20230422412
2023-12-28

MULTILAYER WIRING BOARD

 #24
20230354522
2023-11-02

FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING

 #25
20230262890
2023-08-17

Circuit board structure

 #26
20230245923
2023-08-03

Wafer level chip scale packaging intermediate structure apparatus and method

 #27
20230156909
2023-05-18

Circuit board structure

 #28
20220418101
2022-12-29

MULTI-LAYER CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD FOR MANUFACTURING SAME

 #29
20220394848
2022-12-08

Single circuit board assembly with logic and power components

 #30
20220095455
2022-03-24

Three-dimensional (3D) copper in printed circuit boards

 #31
20210410273
2021-12-30

Hybrid boards with embedded planes

 #32
20210305086
2021-09-30

Wafer level chip scale packaging intermediate structure apparatus and method

 #33
20210227686
2021-07-22

Circuit board

 #34
20210161013
2021-05-27

PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM

 #35
20210153360
2021-05-20

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #36
20200294845
2020-09-17

Wafer level chip scale packaging intermediate structure apparatus and method

 #37
20200043690
2020-02-06

Multilayer printed circuit board via hole registration and accuracy

 #38
20200015364
2020-01-09

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #39
20190254175
2019-08-15

Printed circuit board

 #40
20190244883
2019-08-08

Package with wall-side capacitors

 #41
20190124773
2019-04-25

Embedding into printed circuit board with drilling

 #42
20190075662
2019-03-07

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #43
20180352658
2018-12-06

Method of manufacturing a component embedded package carrier

 #44
20180342414
2018-11-29

Wafer level chip scale packaging intermediate structure apparatus and method

 #45
20180316374
2018-11-01

Glass substrate including passive-on-glass device and semiconductor die

 #46
20180295721
2018-10-11

Multilayer wiring substrate

 #47
20180270958
2018-09-20

Printed wiring board and method for manufacturing the same

 #48
20180220527
2018-08-02

Structure to dampen barrel resonance of unused portion of printed circuit board via

 #49
20180110133
2018-04-19

Multilayer printed circuit board via hole registration and accuracy

 #50
20180108506
2018-04-19

Fuses with integrated metals

 #51
20180092222
2018-03-29

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #52
20170338172
2017-11-23

Multilayer substrate, component mounted board, and method for producing component mounted board

 #53
20170290165
2017-10-05

Thin film component sheet, board with built-in electronic component, and method of manufacturing the thin film component sheet

 #54
20170238420
2017-08-17

Laser diode chip on printed circuit board

 #55
20170133152
2017-05-11

Printed circuit board, antenna, and wireless charging device

 #56
20170019994
2017-01-19

Circuit structure

 #57
20160374189
2016-12-22

Circuit board and method of manufacturing the same

 #58
20160135289
2016-05-12

Printed circuit board and method of manufacturing the same

 #59
20160128201
2016-05-05

Method for forming vias on printed circuit boards

 #60
20160118325
2016-04-28

Fabrication method of embedded chip substrate

 #61
20160050792
2016-02-18

Heat dissipating substrate

 #62
20160044789
2016-02-11

Wiring board with cavity for built-in electronic component and method for manufacturing the same

 #63
20160007451
2016-01-07

Circuit substrate and method for manufacturing the same

 #64
20150334850
2015-11-19

Method of manufacturing wiring substrate, and wiring substrate

 #65
20150319863
2015-11-05

STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT FOR AN EMBEDDED COMPONENT PRINTED CIRCUIT BOARD

 #66
20150282317
2015-10-01

EDGE CONTACTS OF CIRCUIT BOARDS, AND RELATED APPARATUS AND METHODS

 #67
20150264801
2015-09-17

Fault containment routing

 #68
20150245486
2015-08-27

Printed circuit board and method of fabricating the same

 #69
20150216046
2015-07-30

Structure to dampen barrel resonance of unused portion of printed circuit board via

 #70
20150034378
2015-02-05

Printed wiring board

 #71
20140264933
2014-09-18

Wafer level chip scale packaging intermediate structure apparatus and method

 #72
20140262455
2014-09-18

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #73
20140216794
2014-08-07

Printed wiring board and method for manufacturing printed wiring board

 #74
20140209366
2014-07-31

Wiring board and method of manufacturing wiring board

 #75
20140185217
2014-07-03

Printed circuit board, design method thereof and mainboard of terminal product

 #76
20140113415
2014-04-24

Method of manufacturing circuit board and chip package and circuit board manufactured by using the method

 #77
20140097013
2014-04-10

Wiring substrate and method for manufacturing wiring substrate

 #78
20130299218
2013-11-14

Multilayer printed wiring board having multilayer core substrate

 #79
20130213694
2013-08-22

Printed wiring board and method for manufacturing the same

 #80
20130206466
2013-08-15

Multilayer printed wiring board

 #81
20130074332
2013-03-28

Method of manufacturing wiring substrate having built-in component

 #82
20130033827
2013-02-07

Electrically conductive adhesive (ECA) for multilayer device interconnects

 #83
20130008701
2013-01-10

Multilayer printed wiring board

 #84
20120331430
2012-12-27

Circuit manufacturing and design techniques for reference plane voids with strip segment

 #85
20120331429
2012-12-27

Circuit manufacturing and design techniques for reference plane voids with strip segment

 #86
20120299195
2012-11-29

Construction of reliable stacked via in electronic substrates—vertical stiffness control method

 #87
20120295403
2012-11-22

Fabrication method of embedded chip substrate

 #88
20120292089
2012-11-22

Circuit board structure with capacitors embedded therein

 #89
20120273116
2012-11-01

HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

 #90
20120267158
2012-10-25

Construction of reliable stacked via in electronic substrates—vertical stiffness control method

 #91
20120241202
2012-09-27

Build-up printed wiring board substrate having a core layer that is part of a circuit

 #92
20120228007
2012-09-13

PRINTED CIRCUIT BOARD AND METHOD OF MANUFATURING THE SAME

 #93
20120205039
2012-08-16

Method for manufacturing multilayer wiring substrate

 #94
20120186867
2012-07-26

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

 #95
20120186866
2012-07-26

Wiring board and method for manufacturing the same

 #96
20120181078
2012-07-19

Multilayer printed wiring board

 #97
20120162934
2012-06-28

Electromagnetic bandgap structure and printed circuit board

 #98
20120153495
2012-06-21

Reduced PTH pad for enabling core routing and substrate layer count reduction

 #99
20120125680
2012-05-24

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

 #100
20120067633
2012-03-22

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

 #101
20120060367
2012-03-15

Method for manufacturing flex-rigid wiring board

 #102
20120017437
2012-01-26

Method of making a circuitized substrate

 #103
20120008293
2012-01-12

Wiring board and method of manufacturing the same

 #104
20120006469
2012-01-12

Method of manufacturing printed wiring board

 #105
20110314666
2011-12-29

Method for manufacturing circuit board and method for manufacturing structure using the same

 #106
20110303451
2011-12-15

MULTILAYER PRINTED WIRING BOARD

 #107
20110290544
2011-12-01

Printed wiring board with crossing wiring pattern

 #108
20110289773
2011-12-01

Method of manufacturing printed wiring board with built-in electronic component

 #109
20110283535
2011-11-24

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

 #110
20110259629
2011-10-27

High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof

 #111
20110253306
2011-10-20

Method of manufacturing multi-layer printed circuit board

 #112
20110252641
2011-10-20

Method of manufacturing multi-layer printed circuit board

 #113
20110252640
2011-10-20

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

 #114
20110252639
2011-10-20

PRINTED WIRING BOARD WITH A BUILT-IN RESISTIVE ELEMENT

 #115
20110247212
2011-10-13

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

 #116
20110203837
2011-08-25

Flex-rigid wiring board and method for manufacturing the same

 #117
20110192637
2011-08-11

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

 #118
20110173809
2011-07-21

Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

 #119
20110147068
2011-06-23

Structure for enhancing reference return current conduction

 #120
20110114372
2011-05-19

PRINTED WIRING BOARD

 #121
20110108984
2011-05-12

Circuit board and chip package structure

 #122
20110108311
2011-05-12

Multilayer printed wiring board

 #123
20110100680
2011-05-05

Wiring board and method for manufacturing the same

 #124
20110088937
2011-04-21

Method of manufacturing a printed circuit board

 #125
20110083881
2011-04-14

Multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces

 #126
20110079421
2011-04-07

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

 #127
20110057324
2011-03-10

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

 #128
20110048775
2011-03-03

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

 #129
20110037528
2011-02-17

Wave guiding structures for crosstalk reduction

 #130
20110036626
2011-02-17

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

 #131
20110024164
2011-02-03

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD

 #132
20110019372
2011-01-27

Partitioned through-layer via and associated systems and methods

 #133
20110006861
2011-01-13

Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications

 #134
20100330747
2010-12-30

Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip

 #135
20100328915
2010-12-30

Printed circuit board

 #136
20100321914
2010-12-23

Multilayer printed wiring board

 #137
20100319973
2010-12-23

PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR

 #138
20100319970
2010-12-23

Package substrate having embedded capacitor

 #139
20100294553
2010-11-25

PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR

 #140
20100294543
2010-11-25

HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

 #141
20100288544
2010-11-18

Multilayer printed wiring board

 #142
20100282502
2010-11-11

MULTILAYER PRINTED WIRING BOARD

 #143
20100270681
2010-10-28

Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards

 #144
20100270644
2010-10-28

Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers

 #145
20100270066
2010-10-28

Printed circuit board design system and method

 #146
20100261346
2010-10-14

Circuit manufacturing and design techniques for reference plane voids with strip segment

 #147
20100254098
2010-10-07

Circuit board, mounting structure, and method for manufacturing circuit board

 #148
20100243305
2010-09-30

Method for manufacturing substrate with metal film

 #149
20100226108
2010-09-09

Printed circuit board and method of manufacturing printed circuit board

 #150
20100218891
2010-09-02

MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC

 #151
20100200285
2010-08-12

HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF

 #152
20100195954
2010-08-05

Multilayer printed circuit board

 #153
20100170088
2010-07-08

Method of fabricating board having high density core layer and structure thereof

 #154
20100165525
2010-07-01

Low profile discrete electronic components and applications of same

 #155
20100155939
2010-06-24

Fabrication method of circuit board

 #156
20100135611
2010-06-03

Multilayer printed circuit board

 #157
20100126010
2010-05-27

Radio frequency interconnect circuits and techniques

 #158
20100124035
2010-05-20

Integrating capacitors into vias of printed circuit boards

 #159
20100122840
2010-05-20

Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board

 #160
20100101838
2010-04-29

Multilayer printed wiring board

 #161
20100077608
2010-04-01

Alternating Via Fanout Patterns

 #162
20100043942
2010-02-25

Method of manufacturing printed wiring board with built-in electronic component

 #163
20100035426
2010-02-11

Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density

 #164
20100033262
2010-02-11

Radio frequency interconnect circuits and techniques

 #165
20100025087
2010-02-04

Flex-rigid wiring board and method for manufacturing the same

 #166
20100020513
2010-01-28

INTEGRATED MICROWAVE CIRCUIT

 #167
20100018761
2010-01-28

EMBEDDED CHIP SUBSTRATE AND FABRICATION METHOD THEREOF

 #168
20100014261
2010-01-21

Printed circuit board

 #169
20100006331
2010-01-14

Printed Circuit Board With Embedded Semiconductor Component and Method for Fabricating the Same

 #170
20100006330
2010-01-14

STRUCTURE AND PROCESS OF EMBEDDED CHIP PACKAGE

 #171
20100006328
2010-01-14

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

 #172
20100006324
2010-01-14

Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board

 #173
20090321119
2009-12-31

DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE, MOBILE DEVICE, AND MANUFACTURING METHOD OF DEVICE MOUNTING BOARD

 #174
20090294166
2009-12-03

Printed wiring board

 #175
20090294161
2009-12-03

Core substrate and printed wiring board

 #176
20090293271
2009-12-03

Method of manufacturing a printed wiring board with built-in electronic component

 #177
20090288873
2009-11-26

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

 #178
20090283312
2009-11-19

Printed wiring board and method for manufacturing the same

 #179
20090282674
2009-11-19

Electrical interconnect structure and process thereof and circuit board structure

 #180
20090267702
2009-10-29

Printed circuit board having signal line isolation patterns for decreasing WWAN noise

 #181
20090266588
2009-10-29

Multilayer printed wiring board

 #182
20090260868
2009-10-22

Printed circuit board and method of manufacturing the same

 #183
20090258320
2009-10-15

Method of forming measuring targets for measuring dimensions of substrate in substrate manufacturing process

 #184
20090242241
2009-10-01

Flex-rigid wiring board and method of manufacturing the same

 #185
20090241332
2009-10-01

Circuitized substrate and method of making same

 #186
20090233400
2009-09-17

Rigid-flexible printed circuit board manufacturing method for package on package

 #187
20090229875
2009-09-17

Printed circuit board having fine pattern and manufacturing method thereof

 #188
20090211788
2009-08-27

Heat dissipation structure of a print circuit board

 #189
20090205859
2009-08-20

Method of manufacturing printed wiring board with built-in electronic component

 #190
20090205202
2009-08-20

Method of manufacturing printed wiring board with built-in electronic component

 #191
20090188705
2009-07-30

Construction of reliable stacked via in electronic substrates—vertical stiffness control method

 #192
20090184784
2009-07-23

Reference plane voids with strip segment for improving transmission line integrity over vias

 #193
20090178273
2009-07-16

Method of making circuitized assembly including a plurality of circuitized substrates

 #194
20090173523
2009-07-09

Multilayer build-up wiring board including a chip mount region

 #195
20090166832
2009-07-02

Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate

 #196
20090166080
2009-07-02

MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

 #197
20090159327
2009-06-25

Printed wiring board with notched conductive traces

 #198
20090158581
2009-06-25

Process for making a multilayer circuit board

 #199
20090151158
2009-06-18

Method for forming laminated multiple substrates

 #200
20090145652
2009-06-11

Printed wiring board and its manufacturing method

 #201
20090145643
2009-06-11

Printed wiring board with a built-in resistive element

 #202
20090140400
2009-06-04

Device and method for reducing impedance

 #203
20090126983
2009-05-21

Method and apparatus to reduce impedance discontinuity in packages

 #204
20090091406
2009-04-09

Compact via transmission line for printed circuit board and design method of the same

 #205
20090090542
2009-04-09

Multilayer printed wiring board

 #206
20090080168
2009-03-26

Printed circuit board, fabrication method and apparatus

 #207
20090064497
2009-03-12

Printed circuit board using paste bump and manufacturing method thereof

 #208
20090064493
2009-03-12

Method for manufacturing printed circuit board

 #209
20090057912
2009-03-05

Partitioned through-layer via and associated systems and methods

 #210
20090056998
2009-03-05

METHODS FOR MANUFACTURING A SEMI-BURIED VIA AND ARTICLES COMPRISING THE SAME

 #211
20090056118
2009-03-05

METHOD OF MANUFACTURING A COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED CHIPS

 #212
20090039377
2009-02-12

Optical communication module

 #213
20090038830
2009-02-12

Substrate with low-elasticity layer and low-thermal-expansion layer

 #214
20090026604
2009-01-29

Semiconductor plastic package and fabricating method thereof

 #215
20090026168
2009-01-29

METHOD FOR MANUFACTURING A RIGID-FLEX CIRCUIT BOARD

 #216
20090016671
2009-01-15

MULTILAYER PRINTED CIRCUIT BOARD

 #217
20090015354
2009-01-15

Electromagnetic bandgap structure, printed circuit board comprising this and method thereof

 #218
20090014865
2009-01-15

Heat-conductive package structure

 #219
20090014207
2009-01-15

Wiring board and method of manufacturing the same

 #220
20090014205
2009-01-15

Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same

 #221
20090011184
2009-01-08

Method of making a flexible printed circuit board

 #222
20090008128
2009-01-08

ELECTRONIC APPARATUS

 #223
20090007425
2009-01-08

Method for manufacturing multilayer wiring board

 #224
20090000812
2009-01-01

Multilayer printed wiring board

 #225
20080317402
2008-12-25

Optical/electrical composite wiring board and a manufacturing method thereof

 #226
20080314622
2008-12-25

Method of fabricating board having high density core layer and structure thereof

 #227
20080310132
2008-12-18

Printed circuit board and manufacturing method thereof

 #228
20080296052
2008-12-04

MULTILAYER PRINTED WIRING BOARD

 #229
20080290474
2008-11-27

Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density

 #230
20080285910
2008-11-20

Photoelectric circuit board and device for optical communication

 #231
20080283288
2008-11-20

Printed circuit board using paste bump and manufacturing method thereof

 #232
20080283287
2008-11-20

Wiring board and method of manufacturing wiring board

 #233
20080283282
2008-11-20

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

 #234
20080283276
2008-11-20

Wiring board and method of manufacturing wiring board

 #235
20080277148
2008-11-13

Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board

 #236
20080272862
2008-11-06

Electrically optimized and structurally protected via structure for high speed signals

 #237
20080271915
2008-11-06

METHOD FOR MAKING A CIRCUIT BOARD AND MULTI-LAYER SUBSTRATE WITH PLATED THROUGH HOLES

 #238
20080271914
2008-11-06

PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS

 #239
20080267556
2008-10-30

Flexible printed circuits capable of transmitting electrical and optical signals

 #240
20080264685
2008-10-30

Electromagnetic bandgap structure and printed circuit board

 #241
20080264677
2008-10-30

Circuit board structure having embedded capacitor and fabrication method thereof

 #242
20080250377
2008-10-09

Conductive dome probes for measuring system level multi-GHZ signals

 #243
20080250373
2008-10-09

Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards

 #244
20080245557
2008-10-09

Optimizing ASIC pinouts for HDI

 #245
20080245556
2008-10-09

Connection an integrated circuit on a surface layer of a printed circuit board

 #246
20080245551
2008-10-09

CIRCUIT BOARD STRUCTURE FOR EMBEDDING SEMICONDUCTOR CHIP THEREIN AND METHOD FOR FABRICATING THE SAME

 #247
20080239622
2008-10-02

Wiring structure of laminated capacitors

 #248
20080238568
2008-10-02

Package embedded three dimensional balun

 #249
20080236876
2008-10-02

Multilayer printed circuit board

 #250
20080230892
2008-09-25

Chip package module

 #251
20080230260
2008-09-25

Flip-chip substrate

 #252
20080230258
2008-09-25

Printed circuit board, design method thereof and mainboard of terminal product

 #253
20080218985
2008-09-11

Multilayer printed circuit board and method of manufacturing same

 #254
20080217739
2008-09-11

Semiconductor packaging substrate structure with capacitor embedded therein

 #255
20080217050
2008-09-11

Multi-layered interconnect structure using liquid crystalline polymer dielectric

 #256
20080216314
2008-09-11

Method for manufacturing the BGA package board

 #257
20080210460
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Multilayer substrate manufacturing method

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