234505 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors; Conductive through-holes or vias Via connected to metal substrate
BOTTOM-UP THROUGH GLASS VIA PLATING FOR GLASS CORE
#2PRINTED WIRING BOARD
#3Single Layer Capacitor
#4Single Layer Capacitor
#5WIRING CIRCUIT BOARD
#6Printed circuit board
#7Circuit board with rigid portion and flexible portion having connecting end and electronic package using the same
#8WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
#9Flexible printed circuit
#10Cooling component carrier material by carbon structure within dielectric shell
#11Carrier substrate, package, and method of manufacture
#12Printed circuit board, circuit and method for producing a circuit
#13Selective segment via plating process and structure
#14Selective segment via plating process and structure
#15Wiring board assembly and method for producing same
#16Wiring substrate and method of manufacturing the same
#17METHOD FOR FORMING A VIA STRUCTURE USING A DOUBLE-SIDE LASER PROCESS
#18Substrate design for semiconductor packages and method of forming same
#19EBG structure, semiconductor device, and circuit board
#20Suspension board assembly sheet with circuits and method for manufacturing the same
#21Method of manufacturing a wiring board having via structures
#22Ground vias for enhanced preamp heat release in hard disk drives
#23Substrate for suspension
#24Multi-layer circuit assembly and process for preparing the same
#25Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials
#26HEAT DISSIPATING SUBSTRATE
#27Disk drive suspension via formation using a tie layer and product
#28Additive disk drive suspension manufacturing using tie layers for vias and product thereof
#29MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC
#30Multi-layer circuit board, method of manufacturing the same, and communication device
#31Circuit device
#32Printed circuit board and method of manufacturing the same
#33Power semiconductor module including a multilayer substrate
#34Printed wiring board and method for manufacturing the same
#35Metal core circuit element mounting board
#36Printed circuit board with improved via design
#37PROCESS OF PACKAGE SUBSTRATE
#38Magnetic head suspension
#39Method of manufacturing PCB and PCB manufactured by the same
#40Method of making printed wiring board with enhanced structural integrity
#41Production method of suspension board with circuit
#42Electronic component, illuminating device, contact-type image sensor, and image reading device having no short circuit condition achieved by allowing only one electrode of an LED chip in direct contact with a metallic substrate
#43Suspension Board with Circuit and Production Method Thereof
#44Enamel substrate for mounting light emitting elements, light emitting element module, illumination apparatus, display apparatus, and traffic signal
#45Flexible printed circuit board and manufacturing method for the same
#46Circuit board and manufacturing method thereof
#47Wired circuit board
#48Circuit device and method of manufacturing the same
#49Printed circuit board and manufacturing method of the same
#50Suspension board with circuit
#51Method of forming a circuit board with improved via design
#52Power semiconductor module
#53ELECTRONIC APPARATUS
#54Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
#55CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
#56Substrate for suspension
#57Printed circuit board (PCB)with enhanced structural integrity
#58Multi-layered interconnect structure using liquid crystalline polymer dielectric
#59Electronic construction unit and electrical circuit carrier
#60Method of manufacturing multi-layered printed circuit board
#61Ground vias for enhanced preamp heat release in hard disk drives
#62Multi-layered interconnect structure using liquid crystalline polymer dielectric
#63Method of manufacturing a printed wiring board lead frame package
#64Printed wiring board with enhanced structural integrity
#65CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
#66METHOD FOR FORMING AN ELECTRICAL INTERCONNECT TO A SPRING LAYER IN AN INTEGRATED LEAD SUSPENSION
#67Recording apparatus having radiator joined to common voltage wire
#68Carrier board and method for manufacturing the same
#69Method of manufacturing a circuit board
#70Wired circuit board
#71Printed Circuit Board With Improved Via Design
#72Method of forming a printed circuit board with improved via design
#73ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS
#74Printed circuit board and manufacturing method thereof
#75Wired circuit board
#76Wired circuit board
#77Conductive stiffener for a flexible substrate
#78Wired circuit board
#79Wired circuit board
#80Multi-layer circuit assembly and process for preparing the same
#81ELECTRICAL CIRCUIT APPARATUS
#82Circuit board and method of manufacture thereof
#83Electronic apparatus
#84Chip embedded packaging structure
#85Production method of suspension board with circuit
#86Electrical circuit apparatus and method for assembling same
#87Single or multi-layer printed circuit board with improved edge via design
#88Semi-conducting resin composition, and wired circuit board
#89Conductive polymer device and method of manufacturing same
#90Wired circuit board
#91Method and apparatus for electrically coupling a slider to a wireless suspension substrate
#92Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
#93Method for making a microelectronic interposer
#94Method of making a circuit board
#95Method of forming printed circuit card
#96Production method of suspension board with circuit
#97Method for providing electrical crossover in a laminated structure
#98Circuit board assembly employing solder vent hole
#99Printed wiring board with enhanced structural integrity
#100Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
#101Electronic package with optimized lamination process
#102Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module
#103Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
#104Coined ground features for integrated lead suspensions
#105Method of electroplating aluminum
#106HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
#107Single or multi-layer printed circuit board with improved via design
#108Electrical circuit apparatus and method
#109FPC with via holes with filler being welded to suspension and drive apparatus
#110Multi-layered interconnect structure using liquid crystalline polymer dielectric
#111Multi-layer integrated circuit package
#112Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof