234511 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors; Conductive through-holes or vias Via grid, i.e. two-dimensional array of vias or holes in a single plane
WIRING SUBSTRATE
#2MULTILAYER STRETCHABLE PRINTED CIRCUIT BOARD
#3PRINTED CIRCUIT BOARD
#4CIRCUIT BOARD STRUCTURE
#5PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#6Devices Including Substrate Structure With Laterally Offset Ground Vias And Metal Balls
#7FLEXIBLE CIRCUIT BOARD, LIGHT RECEIVING/TRANSMITTING ASSEMBLY, OPTICAL MODULE, AND CONNECTION METHOD
#8MULTILAYER DEFORMABLE LIQUID-METAL CIRCUITS AND INTERCONNECTS WITH IMPROVED RELIABILITY
#9NON-SHARED ANTIPADS OF POWER VIAS IN A PRINTED CIRCUIT BOARD
#10PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
#11ELECTRONIC CIRCUIT BOARD
#12LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING LAMINATED SUBSTRATE
#13PRINTED CIRCUIT BOARD
#14PCB WITH BREAKOUT TO ENABLE HIGHER DENSITY, LAYER COUNT AND ENHANCED PERFORMANCE
#15ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
#16MULTI-LAMINATION STRUCTURE THAT ELIMINATES MICRO CAVITY RESONANCE
#17OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA
#18FLEXIBLE PRINTED CIRCUIT, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
#19PRINTED WIRING BOARD
#20PRINTED CIRCUIT BOARD ASSEMBLY
#21WIRING BOARD
#22MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
#23VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD
#24PRINTED WIRING BOARD
#25DISPLAY PANELS AND DISPLAY DEVICES
#26APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS
#27CARRIER STRUCTURE
#28SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME
#29CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR MODULE, AND METHOD FOR PRODUCING A CIRCUIT BOARD AND A POWER SEMICONDUCTOR MODULE
#30METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS
#31THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA TECHNIQUE AND ASSEMBLY USING SUCH PCB
#32PCB DESIGN TO IMPROVE HFM CONNECTOR PERFORMANCE
#33FLEXIBLE CONNECTING STRUCTURE
#34VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
#35WIRING BASE AND ELECTRONIC DEVICE
#36MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE, AND ELECTRONIC DEVICE
#37PRINTED WIRING BOARD, MULTILAYER RESONATOR, AND MULTILAYER FILTER
#38ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
#39FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE INTEGRATED WAVEGUIDE FILTER FORMED ON A PRINTED CIRCUIT BOARD
#40MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
#41WIRING CIRCUIT BOARD
#42Electronic device including high-frequency transmission circuit
#43Circuit board
#44FLEXIBLE PRINTED WIRING BOARD AND ELECTRIC WIRING
#45Multi-layer printed circuit board
#46Wideband routing techniques for PCB layout
#47APPARATUS AND SYSTEM OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING A RADIO FREQUENCY (RF) TRANSITION
#48Printed Circuit Board, Backplane Architecture System, and Communication Device
#49Multilayer circuit board with offset connection pads and inclined internal conductors for enhanced electrical connectivity
#50Board-level pad pattern for multi-row QFN packages
#51Wiring board and light-emitting device
#52Soldering printed circuits using radiant heat
#53Electronic device including high-frequency transmission circuit
#54Wiring substrate
#55Method and procedure for miniaturing a multi-layer PCB
#56Redistribution plate
#57Rigid flexible printed circuit board and electronic device including the same
#58Electronic device including stacked printed circuit boards
#59High-frequency circuit
#60MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
#61SPACER SELF-ALIGNED VIA STRUCTURES FOR GATE CONTACT OR TRENCH CONTACT
#62Magnetic Inlay With Electrically Conductive Vertical Through Connections for a Component Carrier
#63Resonant-coupled transmission line
#64Electronic device
#65Substrate layered structure and interposer block
#66Wiring substrate
#67Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
#68ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND ELECTRICAL INSPECTION METHOD
#69Adapter board and method for making adapter board
#70Apparatus and method for impedance balancing of long radio frequency (RF) via
#71Current sensing device
#72Systems for shielding bent signal lines
#73Hermetic metallized via with improved reliability
#74Electronic assembly
#75Through-hole and surface mount printed circuit card connections for improved power component soldering
#76Printed Circuit Board and Terminal
#77High-frequency module, high-frequency circuit, and communication device
#78Printed circuit board and antenna module comprising the same
#79Wiring substrate
#80Electronic device having substrate
#81Circuit module and power supply chip module
#82Redistribution plate
#83ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD
#84Wiring board
#85Electronic device including high-frequency transmission circuit
#86Electronic apparatus
#87Waveguide launch system for coupling to a waveguide channel through a probe member on a first lamina and an integrated back-short on a second lamina
#88Chip power supply system, chip, PCB, and computer device
#89Front-end module comprising front-end components and a substrate integrated waveguide filter formed on a printed circuit board
#90Printed circuit board configuration to facilitate a surface mount double density QSFP connector footprint in a belly-to-belly alignment
#91Substrate bonding structure
#92Component carrier and method of manufacturing the same
#93Interposer and electronic device including the same
#94Printed circuit board having a differential pair routing topology with negative plane routing and impedance correction structures
#95Functionally graded thermal vias for inductor winding heat flow control
#96Low parasitic inductance structure for power switched circuits
#97Electronic device including high-frequency transmission circuit
#98System and method for ground via optimization for high speed serial interfaces
#99Millimeter wave impedance matching structures
#100Cassettes with offset vias
#101Microwave feeding module and circuit board structure
#102Printed wiring board
#103Resin multilayer substrate, electronic component, and mounting structure thereof
#104Resin multilayer substrate, electronic component, and mounting structure thereof
#105Wiring board and electronic device
#106DISPLAY APPARATUS
#107Method for producing a printed circuit board having thermal through-contacts
#108Hermetic metallized via with improved reliability
#109Apparatus and system of a printed circuit board (PCB) including a radio frequency (RF) transition
#110Power line structure, array substrate and display panel
#111SEMICONDUCTOR MEMORY MODULE AND SEMICONDUCTOR MEMORY MODULE BOARD
#112Connectors for low cost, high speed printed circuit boards
#113ELECTRICAL ROUTING COMPONENT LAYOUT FOR CROSSTALK REDUCTION
#114Piezoelectric pressure wave analysis
#115EBG structure, EBG component, and antenna device
#116ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FOR FINE PITCH APPLICATIONS
#117Printed circuit board and optical transceiver with the printed circuit board
#118Clearance size reduction for backdrilled differential vias
#119Spread weave induced skew minimization
#120Printed wiring board for high frequency transmission
#121Printed circuit substrate
#122Flexible printed circuit board
#123Wiring board
#124Hermetic metallized via with improved reliability
#125Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
#126Systems and methods for breadboard-style printed circuit board
#127Printed circuit board having vias arranged for high speed serial differential pair data links
#128In-vehicle electronic device
#129High speed signal fan-out method for BGA and printed circuit board using the same
#130Display device and electronic apparatus
#131FLEXIBLE PRINTED CIRCUIT BOARD AND OPTICAL MODULE
#132Printed circuit board and optical transceiver with the printed circuit board
#133Fine pitch component placement on printed circuit boards
#134Component cooling device
#135Printed circuit via for KA satcom circuit boards
#136Apparatus and methods for via connection with reduced via currents
#137Clearance size reduction for backdrilled differential vias
#138Optical modulator with FPC and optical transmission device using same
#139Optically-controlled switch
#140Electronic devices having printed circuits for antennas
#141Printed circuit board having EMI shielding function, method for manufacturing the same, and flat cable using the same
#142Printed circuit board and semiconductor package structure
#143Circuit board
#144Printed circuit board and semiconductor package structure
#145Printed circuit board and semiconductor package structure
#146Circuit board for a control device for a vehicle, method for producing a circuit board for a vehicle, and method for producing a control device for a vehicle
#147Method for contacting a metallic contact pad in a printed circuit board and printed circuit board
#148GLASS WIRED SUBSTRATE AND POWER MODULE
#149GLASS SUBSTRATE AND MANUFACTURING METHOD OF GLASS SUBSTRATE
#150Power signal transmission structure and design method thereof
#151Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#152Through-hole electrode substrate
#153Circuit board
#154Printed board
#155Apparatus and methods for via connection with reduced via currents
#156PRINTED WIRING BOARD
#157Printed circuit board and electric device
#158Optical module
#159Power line structure, array substrate and display panel
#160Printed wiring board, printed circuit board, and electronic apparatus
#161Electrode connection and electric device comprising the same
#162Method of manufacturing conductive layer and wiring board
#163Interconnection between printed circuit boards
#164Electronic device including high-frequency transmission circuit
#165Band pass filter-based galvanic isolator
#166Crosstalk reduction in electrical interconnects
#167Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
#168Interposer frame with polymer matrix and methods of fabrication
#169PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK
#170Assembly architecture employing organic support for compact and improved assembly throughput
#171Systems and methods for breadboard style printed circuit board
#172Through-hole electrode substrate
#173Breakout via system
#174Printed wiring board
#175High-frequency signal line and electronic device provided with the same
#176Crosstalk reduction in electrical interconnects
#177Printed circuit board having a circular signal pad surrounded by a ground pad and at least one recess section disposed therebetween
#178Decoupling capacitive arrangement to manage power integrity
#179Maximizing surface area of surface mount contact pads of circuit board also having via contact pads
#180Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#181INTERPOSER FRAME WITH POLYMER MATRIX AND METHODS OF FABRICATION
#182Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor
#183Replacement electrical connectors
#184Wiring board, semiconductor device, and method for manufacturing wiring board
#185Electronic devices comprising printed circuit boards
#186Semiconductor device
#187Wiring board
#188Printed circuit board structure with heat dissipation function
#189Passive cooling system integrated into a printed circuit board for cooling electronic components
#190High performance vertical interconnection
#191Flexible printed circuit board and circuit-board connection structure
#192Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
#193Printed circuit board
#194Delta arrangement of hexagonal-close-packed signal pairs
#195Through-hole electrode substrate
#196SPACE TRANSFORMER FOR PROBE CARD AND METHOD OF MANUFACTURING THE SAME
#197Printed circuit board with reduced cross-talk
#198Via structures and compact three-dimensional filters with the extended low noise out-of-band area
#199Wiring substrate and semiconductor package
#200BASE MEMBER
#201CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD
#202Conductive structures for microfeature devices and methods for fabricating microfeature devices
#203CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD
#204ELECTRONIC DEVICE WITH OBLIQUELY CONNECTED COMPONENTS
#205Clustered stacked vias for reliable electronic substrates
#206Ceramic substrate and method for manufacturing the same
#207Capacitor-incorporated substrate and component-incorporated wiring substrate
#208MICROWAVE FILTER
#209Electronic device having a hidden input key and method of manufacturing an electronic device
#210Printed circuit board and method for avoiding electromagnetic interference
#211Multi-layer circuit assembly and process for preparing the same
#212HIGH DATA RATE CONNECTOR SYSTEM
#213STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS
#214Printed circuit board impedance matching step for microwave (millimeter wave) devices
#215Method and structure for coaxial via routing in printed circuit boards for improved signal integrity
#216Magnetodielectric substrate and antenna apparatus using the same
#217Method of manufacturing a through-hole electrode substrate
#218Wiring board having piercing linear conductors and semiconductor device using the same
#219Capacitor containing a large number of filamentous conductors and method of manufacturing the same
#220Semiconductor device and method of manufacturing semiconductor device
#221Multilayer printed circuit board
#222CIRCUIT DESIGN ASSEMBLIES
#223CIRCUIT BOARD VIA STRUCTURE AND METHOD FORMING THE SAME
#224Wiring board
#225UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES
#226Electrical component interface
#227MULTILAYER PRINTED WIRING BOARD
#228SPACE TRANSFORMER CONNECTOR PRINTED CIRCUIT BOARD ASSEMBLY
#229Method of manufacturing capacitor device
#230Method of electromagnetic noise suppression devices using hybrid electromagnetic bandgap structures
#231Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device
#232Conductive structures for microfeature devices and methods for fabricating microfeature devices
#233INTEGRATED MICROWAVE CIRCUIT
#234PRINTED CIRCUIT BOARD ARRANGEMENT
#235Printed wiring board
#236STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS
#237Wiring substrate with plurality of wiring and insulating layers with a solder resist layer covering a wiring layer on the outside of outer insulating layer but exposing the holes in the outer insulating layer
#238Clustered stacked vias for reliable electronic substrates
#239Flexible multilayer printed circuit assembly with reduced EMI emissions
#240Ground straddling in PTH pinfield for improved impedance
#241Ceramic substrate grid structure for the creation of virtual coax arrangement
#242Ceramic substrate grid structure for the creation of virtual coax arrangement
#243Circuit board and radiating heat system for circuit board
#244MULTI-LAYER CAPACITOR AND WIRING BOARD HAVING A BUILT-IN CAPACITOR
#245Method for providing hermetic electrical feedthrough
#246METHOD FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH
#247High impedance electromagnetic surface and method
#248Heat management system for a power switching device
#249Systems and methods for blocking microwave propagation in parallel plate structures
#250STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS
#251Multilayer wiring board
#252Ceramic substrate grid structure for the creation of virtual coax arrangement
#253High-frequency electromagnetic bandgap device and method for making same
#254Flexible printed board
#255Substrate module with high thermal conductivity and its fabrication method of same
#256A METHOD AND SYSTEM FOR PLATED THRU HOLE PLACEMENT IN A SUBSTRATE
#257Printed circuit board and method of reducing crosstalk in a printed circuit board
#258Multi-layer circuit assembly and process for preparing the same
#259Method for creating and tuning Electromagnetic Bandgap structure and device
#260Fabricating substrates having low inductance via arrangements
#261Systems and methods for blocking microwave propagation in parallel plate structures
#262High impedance electromagnetic surface and method
#263Systems for displaying images
#264Conductive layer, manufacturing method of the same, and signal transmission substrate
#265High current surge panel with diagnostics
#266Methods for forming connection structures for microelectronic devices
#267Systems and methods for electromagnetic noise suppression using hybrid electromagnetic bandgap structures
#268Multilayer printed wiring board
#269Circuit board and circuit apparatus using the same
#270Conductive sheet having conductive layer with improved adhesion and product including the same
#271Systems and methods for blocking microwave propagation in parallel plate structures
#272Method for producing a rewiring printed circuit board
#273Method and structure to wire electronic devices
#274Method for processing a thin film substrate
#275Transmission circuit board
#276Conductive structures for microfeature devices and methods for fabricating microfeature devices
#277Connection structures for microelectronic devices and methods for forming such structures
#278Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device
#279Semiconductor device
#280Flexible printed circuits with many tiny holes
#281Flexible printed circuits with many tiny holes
#282Preferential ground and via exit structures for printed circuit boards
#283Systems and methods for blocking microwave propagation in parallel plate structures
#284System and method for noise mitigation in high speed printed circuit boards using electromagnetic bandgap structures
#285Method and structure for implementing column attach coupled noise suppressor
#286High density microvia substrate with high wireability
#287Capacitor and method of producing same
#288Conductive sheet having conductive layer with improved adhesion and product including the same
#289Rapid implementation of high-temperature analog interface electronics
#290Circuit board connector footprint
#291Circuit board device
#292Printed circuit board configuration to facilitate a surface mount double density QSFP connector footprint in a belly-to-belly alignment
#293Measuring effective dielectric constant using via-stub resonance
#294Light blocking features for indicator lights in an appliance
#295Circuit board with non-plated hole interposed between plated holes to prevent formation of conductive anodic filament
#296PCB with minimized crosstalk
#297Multi part plastic assembly that snaps into or is captured into existing plastic or metal junction boxes, switch boxes and receptacle boxes to simplify connection wiring to individual switches, receptacles, USB ports, GFCIS
#298Printed circuit board test coupon for electrical testing during thermal exposure and method of using the same
#299Landing pattern for ball grid array
#300Electronic assembly having a conductive shield and grounding contacts